Heat exchange structure and electronic device having the heat exchange structure

Abstract

This invention relates to a heat exchange structure and an electronic device having the heat exchange structure. The heat exchange structure includes a plurality of first metal fibers and a plurality of second metal fibers. The first metal fibers are interwoven to form a first porous fiber layer, and a plurality of interconnected first pores are formed between the first metal fibers in the first porous fiber layer. The second metal fibers are interwoven to form a second porous fiber layer, which is attached to the first porous fiber layer. A plurality of interconnected second pores are formed between the second metal fibers in the second porous fiber layer. The average pore size of each second pore is smaller than the average pore size of each first pore. This allows the first and second porous fiber layers to have different porosities, thereby improving the heat exchange effect of heat conduction, heat convection, or phase change heat transfer.

Claims

1. A heat exchange structure, comprising: A plurality of first metal fibers, each of which is interwoven to form a first porous fiber layer, wherein a plurality of interconnected first pores are formed between each of the first metal fibers in the first porous fiber layer; and a plurality of second metal fibers, each of which is interwoven to form a second porous fiber layer, wherein the second porous fiber layer is attached to the first porous fiber layer, wherein a plurality of interconnected second pores are formed between each of the second metal fibers in the second porous fiber layer, wherein the average pore diameter of each second pore is smaller than the average pore diameter of each first pore.

2. The heat exchange structure as claimed in claim 1, wherein the density of each of the second metal fibers in the second porous fiber layer is greater than the density of each of the first metal fibers in the first porous fiber layer.

3. The heat exchange structure as claimed in claim 1, wherein the average diameter of each of the second metal fibers is smaller than the average diameter of each of the first metal fibers.

4. The heat exchange structure as claimed in claim 3, wherein the diameter of each of the second metal fibers is greater than or equal to 10 micrometers and less than or equal to 60 micrometers, and the diameter of each of the first metal fibers is greater than or equal to 30 micrometers and less than or equal to 100 micrometers.

5. The heat exchange structure as claimed in claim 3, wherein the diameter of each of the second metal fibers is greater than or equal to 2 micrometers and less than or equal to 20 micrometers, and the diameter of each of the first metal fibers is greater than or equal to 10 micrometers and less than or equal to 60 micrometers.

6. The heat exchange structure as claimed in claim 1, wherein the diameter of each of the second pores is greater than or equal to 10 micrometers and less than or equal to 300 micrometers, and the diameter of each of the first pores is greater than or equal to 30 micrometers and less than or equal to 500 micrometers.

7. The heat exchange structure as claimed in claim 1, wherein the diameter of each of the second pores is greater than or equal to 2 micrometers and less than or equal to 100 micrometers, and the diameter of each of the first pores is greater than or equal to 10 micrometers and less than or equal to 300 micrometers.

8. The heat exchange structure as claimed in claim 1, wherein the porosity of the heat exchange structure is greater than or equal to 40% and less than or equal to 90%, and the porosity of the first porous fiber layer is greater than the porosity of the second porous fiber layer.

9. The heat exchange structure as claimed in claim 1, wherein the thickness of the first porous fiber layer is greater than or equal to 0.05 mm and less than or equal to 8 mm, and the thickness of the second porous fiber layer is greater than or equal to 0.05 mm and less than or equal to 8 mm.

10. The heat exchange structure as claimed in claim 1, wherein each of the first metal fiber and each of the second metal fiber is composed of at least one or more of copper, nickel, titanium, stainless steel, iron-chromium-aluminum and Hastelloy, and the surface of each of the first metal fiber and the surface of each of the second metal fiber are respectively formed with an uneven structure so that their cross-sections are irregular.

11. The heat exchange structure as claimed in claim 10, wherein the surface of each of the first metal fibers and the surface of each of the second metal fibers are respectively coated with a protective coating, the protective coating being composed of at least one or more of nickel, platinum, gold, palladium, chromium, silver, iridium, rhodium, ruthenium, graphite and graphene.

12. The heat exchange structure as claimed in claim 1, wherein a hydrophilic layer is formed on the surface of each of the first metal fibers and on the surface of each of the second metal fibers.

13. The heat exchange structure as claimed in claim 1, further comprising a plurality of third metal fibers, each of the third metal fibers interwoven to form a third porous fiber layer, the third porous fiber layer being attached to the side of the second porous fiber layer away from the first porous fiber layer, a plurality of interconnected third pores being formed between each of the third metal fibers in the third porous fiber layer, the average pore diameter of each third pore being smaller than the average pore diameter of each second pore.

14. The heat exchange structure as claimed in claim 13, wherein the density of each of the third metal fibers in the third porous fiber layer is greater than the density of each of the second metal fibers in the second porous fiber layer, and the density of each of the second metal fibers in the second porous fiber layer is greater than the density of each of the first metal fibers in the first porous fiber layer.

15. The heat exchange structure as claimed in claim 13, wherein the average diameter of each of the third metal fibers is smaller than the average diameter of each of the second metal fibers, and the average diameter of each of the second metal fibers is smaller than the average diameter of each of the first metal fibers.

16. The heat exchange structure as claimed in claim 15, wherein the diameter of each of the third metal fibers is greater than or equal to 2 micrometers and less than or equal to 20 micrometers, the diameter of each of the second metal fibers is greater than or equal to 10 micrometers and less than or equal to 60 micrometers, and the diameter of each of the first metal fibers is greater than or equal to 30 micrometers and less than or equal to 100 micrometers.

17. The heat exchange structure as claimed in claim 13, wherein the diameter of each of the third pores is greater than or equal to 2 micrometers and less than or equal to 100 micrometers, the diameter of each of the second pores is greater than or equal to 10 micrometers and less than or equal to 300 micrometers, and the diameter of each of the first pores is greater than or equal to 30 micrometers and less than or equal to 500 micrometers.

18. The heat exchange structure as claimed in claim 13, wherein the porosity of the heat exchange structure is greater than or equal to 40% and less than or equal to 90%, the porosity of the first porous fiber layer is greater than the porosity of the second porous fiber layer, and the porosity of the second porous fiber layer is greater than the porosity of the third porous fiber layer.

19. The heat exchange structure as claimed in claim 13, wherein the thickness of the first porous fiber layer is greater than or equal to 0.05 mm and less than or equal to 8 mm, the thickness of the second porous fiber layer is greater than or equal to 0.05 mm and less than or equal to 8 mm, and the thickness of the third porous fiber layer is greater than or equal to 0.05 mm and less than or equal to 8 mm.

20. The heat exchange structure as claimed in claim 13, wherein each of the first metal fiber, each of the second metal fiber and each of the third metal fiber is made of at least one or more of copper, nickel, titanium, stainless steel, iron-chromium-aluminum and Hastelloy, and the surface of each of the first metal fiber, the surface of each of the second metal fiber and the surface of each of the third metal fiber are respectively formed with an uneven structure so that their cross-section is irregular.

21. The heat exchange structure as claimed in claim 20, wherein the surface of each of the first metal fibers, the surface of each of the second metal fibers, and the surface of each of the third metal fibers are respectively coated with a protective coating, the protective coating being composed of at least one or more of nickel, platinum, gold, palladium, chromium, silver, iridium, rhodium, ruthenium, graphite, and graphene.

22. The heat exchange structure as claimed in claim 13, wherein a hydrophilic layer is formed on the surface of each of the first metal fibers, the surface of each of the second metal fibers, and each of the third metal fibers.

23. The heat exchange structure as claimed in claim 13 further includes a thermally conductive medium that fills and confines within each of the first pores, each of the second pores and each of the third pores, the thermally conductive medium being thermal paste, a phase change material or a liquid metal alloy.

24. The heat exchange structure as claimed in claim 23, wherein the liquid metal alloy is selected from at least one of gallium, indium, tin and bismuth.

25. The heat exchange structure as claimed in claim 1, further comprising a thermally conductive medium that fills and confines within each of the first pores and each of the second pores, the thermally conductive medium being a thermal paste, a phase change material, or a liquid metal alloy.

26. The heat exchange structure as claimed in claim 25, wherein the liquid metal alloy is selected from at least one of gallium, indium, tin and bismuth.

27. An electronic device comprising: One heating element; And a heat exchange structure as described in any one of claims 1 to 22, thermally coupled to the heating element and configured to conduct the heat energy generated by the heating element through at least one of heat conduction, heat convection and phase change heat transfer, wherein the first porous fiber layer is located on the side of the heat exchange structure away from the heating element.

28. The electronic device as claimed in claim 27, further comprising a sealed housing and a working fluid, the sealed housing being connected to the heating element, the heat exchange structure and the working fluid being disposed within the sealed housing.

29. The electronic device as claimed in claim 28, comprising two heat exchange structures as claimed in any one of claims 1 to 24, each heat exchange structure being disposed parallel to each other and spaced apart within the sealed housing, a plurality of support columns being formed between the heat exchange structures, the working fluid being configured to perform two-phase phase change heat exchange between the heat exchange structures and the sealed housing.

30. The electronic device as claimed in claim 28, further comprising an encapsulation module, the heating element disposed within the encapsulation module, the sealing housing disposed on one side of the encapsulation module, and the working fluid configured to perform two-phase phase change heat exchange between the heat exchange structure and the sealing housing.

31. The electronic device as claimed in claim 28, further comprising an encapsulation module, the heating element disposed within the encapsulation module, the sealing housing disposed on one side of the encapsulation module, and the working fluid configured to circulate within the heat exchange structure and the sealing housing.

32. The electronic device as claimed in claim 27 further includes a liquid cooling plate attached to the heating element and having at least one flow channel, the heat exchange structure being disposed within the flow channel.

33. The electronic device as claimed in claim 27 further includes a liquid cooling plate attached to the heating element and having a plurality of fins, the heat exchange structure being disposed inside the liquid cooling plate and adjacent to the heating element, and the fins being disposed parallel to each other on the side of the heat exchange structure away from the heating element.

34. The electronic device as claimed in claim 27 further includes a liquid cooling plate attached to the heating element and having a liquid inlet, a liquid outlet and a partition, the liquid inlet being located on the side of the liquid cooling plate away from the heating element, the partition having a plurality of jet holes and disposed inside the liquid cooling plate to separate a flow distribution space and a jet space, the flow distribution space being connected to the jet space via each of the jet holes, and the heat exchange structure being disposed in the jet space and adjacent to the heating element.

35. The electronic device as claimed in claim 27, further comprising a housing and a dielectric fluid filled in the housing, the heating element disposed in the housing and immersed in the dielectric fluid, and the heat exchange structure attached above the heating element and immersed in the dielectric fluid.

36. The electronic device as claimed in claim 27, wherein the heat exchange structure further includes a thermally conductive medium filling and confining within each of the first pores and each of the second pores, the thermally conductive medium being a thermal paste, a phase change material, or a liquid metal alloy, the heat-generating element being a power semiconductor module having a ceramic substrate and a heat sink, the heat exchange structure being disposed between the ceramic substrate and the heat sink, the heat exchange structure being configured to reduce the interfacial thermal resistance between the ceramic substrate and the heat sink and to absorb the thermal expansion stress between the ceramic substrate and the heat sink.

37. The electronic device as claimed in claim 36, wherein the ceramic substrate is made of a direct-bonded copper substrate or a metal brazed substrate.

38. The electronic device as claimed in claim 27, wherein the heat exchange structure further includes a thermally conductive medium filling and confining within each of the first pores and each of the second pores, the thermally conductive medium being a thermal paste, a phase change material, or a liquid metal alloy, the heat-generating element being an encapsulation module having an encapsulation cover and a heat sink, the heat exchange structure being disposed between the encapsulation cover and the heat sink, the heat exchange structure being configured to provide a heat conduction path between the encapsulation cover and the heat sink, reduce the interfacial thermal resistance between the encapsulation cover and the heat sink, and absorb the thermal expansion stress between the encapsulation cover and the heat sink.

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