H-beam machining equipment with multiple machining platforms

Abstract

This invention provides an H-beam processing device with multiple processing platforms, comprising at least two conveying units, a processing assembly, and a control center. Each conveying unit is equipped with a processing platform, and the processing assembly is equipped with a transfer frame, two frame tracks, and a processing enclosure. Each conveying unit is defined as a processing area at one end of the frame tracks and the transfer frame, and a placement area at the other end. The control center is electrically connected to each conveying unit and the processing assembly to generate a control signal to control the displacement of the processing platform and the transfer frame. Thus, this invention achieves the parallelization of the processing program and the workpiece placement program through the alternating movement configuration of multiple processing platforms inside and outside the processing enclosure, thereby reducing workpiece waiting time and other advantages.

Claims

1. An H-beam processing apparatus with multiple processing platforms, comprising: at least two conveying units extending along a length direction and arranged parallel to each other at intervals, each conveying unit comprising a processing platform, the processing platform being reciprocated along the length direction of the conveying unit; and a processing assembly comprising a transfer frame laterally spanning each of the conveying units, wherein... A processing device is mounted on the transfer frame; two frame tracks are respectively arranged at both ends of the transfer frame laterally, extending along the length direction, and the transfer frame moves backward along the length direction of the frame tracks; and a processing enclosure is arranged laterally across each of the conveying units, further defining each of the conveying units as a processing area at one end of the frame tracks and the transfer frame, and a placement area at the other end; and a control center is electrically connected to each of the conveying units and the processing assembly to generate a control signal to control the displacement of the processing platform and the transfer frame.

2. The H-beam processing apparatus with multiple processing platforms as described in claim 1, comprising a conveying track extending along the length of each conveying unit toward both ends and disposed on top of the conveying unit.

3. The H-beam processing apparatus with multiple processing platforms as described in claim 1, wherein each processing platform extends in the longitudinal direction corresponding to each conveying unit, and the long axis length of each processing platform is substantially less than half the long axis length of each conveying unit.

4. The H-beam processing apparatus with multiple processing platforms as described in claim 2, wherein each processing platform is provided with multiple transmission devices at its bottom, and these transmission devices are respectively arranged on the conveying track at the top of the corresponding conveying unit.

5. The H-beam processing apparatus with multiple processing platforms as described in claim 1, wherein the transfer frame has support columns located on both sides and a crossbeam connecting the tops of the two support columns, and the transfer frame is arranged across each of the conveying units.

6. The H-beam processing apparatus with multiple processing platforms as described in claim 5, wherein the processing apparatus may be one or a combination of a laser cutting device, a robotic arm or other cutting tools, which is mounted on the crossbeam via a multi-axis positioning mechanism and can be laterally displaced along the crossbeam and vertically displaced relative to the crossbeam.

7. The H-beam processing apparatus with multiple processing platforms as described in claim 6, wherein the length of the two frame tracks is less than that of each of the conveying units, and each supports two of the support columns, providing displacement of the two support columns along the two frame tracks.

8. The H-beam processing apparatus with multiple processing platforms as described in claim 7, wherein the bottom of each of the two support columns is provided with toothed rollers, and the surfaces of the two frame tracks are provided with a rack along the length direction, so that the toothed rollers at the bottom of the two support columns of the transfer frame can mesh on them.

9. The H-beam processing apparatus with multiple processing platforms as described in claim 1, wherein the processing enclosure is composed of multiple metal shielding plates, and the surface of each metal shielding plate is coated with a light-absorbing and anti-reflective coating to block laser beams, noise or processing debris generated during the operation of the processing apparatus.

10. The H-beam processing apparatus with multiple processing platforms as described in claim 9, wherein the processing enclosure includes a working gate disposed at the other end of the processing enclosure away from the loading area; and a feed gate disposed at the processing enclosure at the boundary between the processing area and the loading area.

11. The H-beam processing apparatus with multiple processing platforms as described in claim 1, wherein the control center is provided with an interface terminal located outside the processing enclosure, providing operators with a visual interface for controlling and remotely monitoring the processing operations.

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