Memory heatsink and memory heat dissipation components

Abstract

A memory heat dissipation assembly includes two mounting brackets and a plurality of memory heat sinks. The mounting brackets are disposed at both ends of a memory module. The plurality of memory heat sinks are arranged alternately on both sides of the memory module, and each memory heat sink includes a heat dissipation structure and a plurality of thermal pad structures. The heat dissipation structure includes a strip-shaped body, a plurality of heat dissipation pillars, and a thermally conductive plate. The strip-shaped body extends along a first direction and has a top surface and a bottom surface opposite to each other, and is used to fix the strip-shaped body to the two mounting brackets. The plurality of heat dissipation pillars are arranged at intervals on the top surface. The thermally conductive plate extends from the bottom surface. The thermally conductive pad structures are attached to both sides of the thermally conductive plate for thermal connection to the memory modules.

Claims

1. A memory heat sink for being disposed on one side of a memory module, the memory heat sink comprising: a heat dissipation structure comprising: a strip-shaped body extending along a first direction and having a top surface and a bottom surface disposed opposite to each other; a plurality of heat dissipation pillars arranged at intervals along the first direction on the top surface and extending respectively along a second direction perpendicular to the first direction; a heat-conducting plate extending from the bottom surface along a third direction opposite to the second direction; and a heat-conducting pad structure attached to both sides of the heat-conducting plate for thermally connecting to the memory module.

2. The memory heat sink as described in claim 1, wherein, The strip-shaped body has two sets of terminals arranged opposite to each other in the first direction, and each of the two sets of terminals has a locking hole.

3. The memory heat sink as described in claim 1, wherein, The strip-shaped system gradually shrinks from the top surface to the bottom surface along the third direction.

4. The memory heat sink as described in claim 1, wherein, The thermal pad structure includes: two thermal pad bodies, which are respectively attached to both sides of the thermal plate; and a thermal film, which covers the two thermal pad bodies and is used to abut against the memory module.

5. A memory heat dissipation assembly for dissipating heat from a plurality of memory modules, the memory modules extending along a first direction, the memory heat dissipation assembly comprising: two fixing frames disposed at both ends of the memory modules; and a plurality of memory heat sinks disposed alternately on both sides of the memory modules, each of the memory heat sinks comprising: a heat dissipation structure comprising: a strip-shaped body extending along the first direction and having a top surface and a bottom surface disposed opposite to each other, the strip-shaped body being fixed to the two fixing frames; a plurality of heat dissipation pillars arranged at intervals along the first direction on the top surface and extending along a second direction perpendicular to the first direction; a heat-conducting plate extending from the bottom surface along a third direction opposite to the second direction; and a heat-conducting pad structure attached to both sides of the heat-conducting plate for thermally connecting to the memory modules.

6. The memory heat dissipation assembly as described in claim 5, wherein, Each of the two fixed frames has a plurality of assembly slots, and the strip-shaped body has two assembly ends arranged opposite to each other in the first direction. The two assembly ends are correspondingly assembled into the assembly slots of the two fixed frames.

7. The memory heat dissipation assembly as described in claim 6, wherein, Each of the connecting slots tapers along the third direction, and the strip-shaped body tapers from the top surface to the bottom surface along the third direction, so that the two connecting ends are correspondingly embedded in the connecting slots.

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