Light-emitting diode packaging structure

Abstract

A light-emitting diode (LED) packaging structure includes: a substrate, an LED chip, conductive wires, a filler, and a lens. The substrate has a top surface and a bottom surface. The top surface has a die-bonding layer and an internal electrode layer. A surrounding wall surrounds the die-bonding layer and the internal electrode layer, forming a die-bonding groove around the top surface of the substrate, thus positioning the die-bonding layer and the internal electrode layer within the groove. The LED chip is electrically connected to the die-bonding layer. Conductors are electrically connected between the LED chip and the internal electrode layer. The filler is disposed in the die-bonding groove. The lens is disposed on the surrounding wall. An expansion space is formed between the substrate, the filler, the LED chip, and the surrounding wall. This expansion space allows stress to be released from the filler, preventing conductor breakage and die removal problems, thereby improving the brightness, reliability, and lifespan of the packaged LED.

Claims

1. A light-emitting diode (LED) packaging structure, comprising: A base has a top surface and a bottom surface. The top surface has a die-bonding layer and an internal electrode layer. A surrounding wall surrounds the die-bonding layer and the internal electrode layer, forming a die-bonding groove around the top surface of the base. The die-bonding layer and the internal electrode layer are located within the die-bonding groove. A light-emitting wafer is electrically connected to the die-bonding layer. A wire is electrically connected between the light-emitting wafer and the internal electrode layer. A filler is disposed in the die-bonding groove. A lens is disposed on the surrounding wall. An expansion space is formed between the base, the filler, the light-emitting wafer, and the surrounding wall.

2. The light-emitting diode packaging structure as described in claim 1, wherein, The expansion space is formed between the top surface of the base, the bottom of the filler, and the light-emitting chip and the enclosure.

3. The light-emitting diode packaging structure as described in claim 1, wherein, The base has a plurality of external electrode layers on its bottom surface. These external electrode layers pass through the base via conductive pillars or conductive layers inside the base and are electrically connected to the internal electrode layers.

4. The light-emitting diode packaging structure as described in claim 1, wherein, The base is a ceramic substrate or a printed circuit board.

5. The light-emitting diode packaging structure as described in claim 1, wherein, The height of the light-emitting chip does not exceed the height of the wall.

6. The light-emitting diode packaging structure as described in claim 5, wherein, The light-emitting wafer is composed of a single grain or multiple grains.

7. The light-emitting diode packaging structure as described in claim 1, wherein, The filler is located at the bottom of the lens, part of the upper edge of the light-emitting chip, and part of the upper edge of the inner wall of the enclosure.

8. The light-emitting diode packaging structure as described in claim 7, wherein, The filler is silicone.

9. The light-emitting diode packaging structure as described in claim 1, wherein, The upper edge of the wall has a joint for assembling the lens.

10. The light-emitting diode packaging structure as described in claim 9, wherein, The cross-section of the joint is stepped.

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