Vapor chamber device
Patent Information
- Application Number
- TW115204363
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2025-11-21
- Filing Date
- 2026-05-15
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2036-05-14
Smart Images

Figure TWG2TB001909447_001 
Figure TWG2TB001909447_002 
Figure TWG2TB001909447_003
Abstract
Claims
1. A temperature distribution plate device, comprising: A housing comprising a bottom shell and a cover plate, the bottom shell being placed on a contact surface of a heat source element, the cover plate and the bottom shell being hermetically sealed together such that the cover plate and the bottom shell together form an inner cavity; a working fluid located within the inner cavity; an upper capillary layer comprising an upper body located within the inner cavity and connected to the cover plate; a lower capillary layer comprising a lower body and a plurality of vent holes, the lower body being disposed opposite the upper body and divided into a heat source region and a surrounding region surrounding the heat source region, the heat source region overlapping the contact surface of the heat source element in a vertical direction, the vent holes being located only within the heat source region, and each of the vent holes penetrating the lower body, wherein the thickness of the lower body is 1 to 3 millimeters; and a plurality of support members spaced apart within the inner cavity and sandwiched between the cover plate and the bottom shell.
2. The heat spreader device as claimed in claim 1, wherein each of the supports is located between the upper capillary layer and the lower capillary layer, and abuts against the upper capillary layer and the lower capillary layer, respectively.
3. The heat spreader device as claimed in claim 2, wherein each of the supports is one of a solid column and a capillary column, wherein the capillary column has a porous structure.
4. The heat spreader device as claimed in claim 1, wherein the lower capillary layer further comprises a plurality of underperforations spaced apart in the surrounding area of the lower body, and each of the underperforations is larger than one of the vent holes; and each of the supports is partially located within one of the underperforations and abuts against the upper capillary layer and the bottom shell, respectively.
5. The heat spreader device as claimed in claim 4, wherein each of the supports comprises: a column located within one of the lower perforations and abutting against the upper capillary layer and the bottom shell respectively; and a ring fitted onto the column and sandwiched between the upper capillary layer and the lower capillary layer, wherein the ring has a porous structure.
6. The heat spreader device as claimed in claim 1, wherein the upper capillary layer further comprises a plurality of upper perforations spaced apart on the upper body; the lower capillary layer further comprises a plurality of lower perforations spaced apart in the surrounding area of the lower body, and each of the lower perforations is larger than one of the vent holes; and each of the supports is located within one of the upper perforations and one of the lower perforations, and abuts against the bottom shell and the cover plate, respectively.
7. The heat spreader device as claimed in claim 6, wherein each of the supports comprises: a column located within one of the upper perforations and one of the lower perforations, and abutting against the bottom shell and the cover plate respectively; and a ring fitted onto the column and sandwiched between the upper capillary layer and the lower capillary layer, wherein the ring has a porous structure.
8. The heat spreader device as claimed in claim 1, wherein the lower capillary layer further comprises: an additional capillary layer located within the inner cavity and sandwiched between the lower body and the bottom shell, wherein the thickness of the additional capillary layer is less than the thickness of the lower body, and the particles of the additional capillary layer are smaller than the particles of the lower body.
9. The heat spreader device as claimed in claim 8, wherein the lower capillary layer further comprises a plurality of underperforations spaced apart in the surrounding area of the lower body, and each of the underperforations is larger than one of the vent holes; and each of the supports comprises a column and a ring, the column being located within one of the underperforations, and two opposite ends of the column abutting against the upper capillary layer and the additional capillary layer, the ring being fitted onto the column and clamped between the upper capillary layer and the lower capillary layer, wherein the ring has a porous structure.
10. The heat spreader device as claimed in claim 9, wherein the upper capillary layer further comprises a plurality of upper perforations spaced apart on the upper body; the additional capillary layer comprises a plurality of spaced through holes; and each of the columns is located within one of the upper perforations, one of the lower perforations and one of the through holes, and abuts against the bottom shell and the cover plate, respectively.
11. The heat spreader device as claimed in claim 1, wherein the opening ratio of the vent holes in the heat source area to the area of the heat source area is 10 to 30%.
12. The heat spreader device as claimed in claim 1, wherein the thickness of the lower body is greater than the thickness of the upper body.
13. The heat spreader device as claimed in claim 1, wherein the exhaust holes are square, circular, elongated, or elongated radially arranged.