Heat dissipation device

Abstract

A heat dissipation device includes: a fan assembly, a vapor chamber, and a fin assembly; the fan assembly includes a fan base plate and a centrifugal fan body; the fan base plate and the vapor chamber cooperate to form a heat dissipation cavity, and the centrifugal fan body is housed within the heat dissipation cavity; at least one of the fan base plate and the vapor chamber has a first air inlet; the fan base plate and the vapor chamber also cooperate to form a first air outlet; the first air inlet and the first air outlet are respectively connected to the heat dissipation cavity to form a heat dissipation air duct; the fin assembly is connected to the vapor chamber. This novel vapor chamber directly connects to the fan assembly as a top cover, achieving efficient heat dissipation while having a simpler, more compact structure and saving overall space. Furthermore, by directly connecting the vapor chamber to the fan assembly as a top cover, the heat transfer path is shortened, resulting in higher heat dissipation efficiency.

Claims

1. A heat dissipation device, comprising: A fan assembly, a heat spreader, and a fin assembly; the fan assembly includes a fan base plate and a centrifugal fan body; the fan base plate and the heat spreader cooperate to form a heat dissipation cavity, and the centrifugal fan body is housed within the heat dissipation cavity; at least one of the fan base plate and the heat spreader has a first air inlet; the fan base plate and the heat spreader also cooperate to form a first air outlet; the first air inlet and the first air outlet are respectively connected to the heat dissipation cavity to form a heat dissipation air duct; the fin assembly is connected to the heat spreader.

2. The heat dissipation device as claimed in claim 1, wherein, It also includes a heat-conducting component, which is connected to the heat spreader; the heat-conducting component conducts the heat generated by the heat source to the heat spreader.

3. The heat dissipation device as claimed in claim 1, wherein, The fin assembly is located at the first air outlet.

4. The heat dissipation device as claimed in claim 1, wherein, The fin assembly has one or more heat dissipation channels, which are connected to the heat dissipation air duct.

5. The heat dissipation device as claimed in claim 1, wherein, The fan base plate is fixed to the heat spreader plate by screws or by clips.

6. The heat dissipation device as claimed in claim 1, wherein, The heat dissipation cavity is provided with at least one support column, one end of which is connected to the fan base plate and the other end of which abuts against the heat spreader; or one end of which is connected to the heat spreader and the other end of which abuts against the fan base plate.

7. The heat dissipation device as claimed in claim 1, wherein, The fan base plate and the heat exchange plate are further limited by a limiting boss.

8. The heat dissipation device as claimed in claim 7, wherein, The limiting boss is a two-dimensional limiting boss, which limits the temperature distribution plate in two dimensions in the horizontal direction.

9. The heat dissipation device as claimed in claim 8, wherein, The number of limiting bosses is two sets, and the two sets of limiting bosses are arranged facing each other.

10. The heat dissipation device as claimed in claim 1, wherein, The heat exchange plate is a common type heat exchange plate; the common type heat exchange plate includes: a first upper cover plate, a first lower cover plate, and a copper pillar, the first upper cover plate and the first lower cover plate cooperate to form a heat dissipation cavity; the copper pillar is disposed in the heat dissipation cavity, and the two ends of the copper pillar are in contact with the first upper cover plate and the first lower cover plate respectively.

11. The heat dissipation device as claimed in claim 10, wherein, A copper mesh or copper powder layer is provided on the side of the first upper cover plate near the heat dissipation cavity or on the side of the first lower cover plate near the heat dissipation cavity.

12. The heat dissipation device as claimed in claim 1, wherein, The heat exchange plate is a thin heat exchange plate; the thin heat exchange plate includes: a second upper cover plate and a second lower cover plate, the second upper cover plate and the second lower cover plate cooperate to form one or more internal flow channels.

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