Wafer heating base

TWM687163UActive Publication Date: 2026-09-01FASTENING E-BEAM TECHNOLOGY CO LTD
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Patent Information

Application Number
TW115205256
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-06-08
Publication Date
2026-09-01
Estimated Expiration
2036-06-07

Smart Images

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    Figure TWG2TB001909542_001
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    Figure TWG2TB001909542_002
  • Figure TWG2TB001909542_003
    Figure TWG2TB001909542_003
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Abstract

A wafer heating base includes a body and a limiting flange wall. The body has a top surface with an outer periphery. A clearance annular groove is formed on the top surface adjacent to the outer periphery, and the clearance annular groove has a plurality of spaced-apart clearance groove segments. The limiting flange wall is disposed on the top surface of the base along the outer periphery and extends upward. The limiting flange wall includes a plurality of spaced-apart limiting wall portions. Each limiting wall portion has a limiting inclined surface inclined to the top surface of the base and a clearance surface connected to the limiting inclined surface. The limiting inclined surface has a sloped bottom edge adjacent to the top surface of the base. The clearance surface of each limiting wall portion extends downward from the sloped bottom edge to connect with a corresponding clearance groove segment. A first included angle can be defined between the limiting inclined surface and the clearance surface, the first included angle being less than 180°.
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Claims

1. A wafer heating base, comprising: a base having a top surface, the top surface having an outer periphery, the top surface having a recessed annular groove adjacent to the outer periphery, the recessed annular groove having a plurality of spaced-apart recessed groove segments; and a limiting flange wall disposed along the outer periphery on the top surface and extending upward, the limiting flange wall including a plurality of spaced-apart limiting wall portions, each limiting wall portion having a limiting inclined surface inclined to the top surface of the base, and a recessed surface connected to the limiting inclined surface, the limiting inclined surface having a sloped bottom edge adjacent to the top surface of the base, the recessed surface of each limiting wall portion extending downward from the sloped bottom edge to connect with a corresponding recessed groove segment, a first included angle being defined between the limiting inclined surface and the recessed surface, the first included angle being less than 180°.

2. The wafer heating base as described in claim 1, wherein, A second included angle can be defined between the avoidance surface and the top surface of the seat, and the second included angle is not greater than 90°.

3. The wafer heating base as described in claim 2, wherein, The avoidance surface and the top surface of the seat can be used to define an avoidance space, and the avoidance space of each limiting wall part is connected to one of the corresponding avoidance groove segments.

4. The wafer heating base as described in claim 1, wherein, The top surface of the seat also has several spaced-apart notches, which are spaced between the avoidance trench sections.

5. The wafer heating base as described in claim 1, wherein, The seat includes a top wall and a peripheral wall extending downward from the top wall, the top wall having the top surface of the seat.