Semiconductor workpiece conveying and processing equipment with particulate removal function

Abstract

A semiconductor workpiece transfer and processing device with particulate removal function includes a robotic arm, a path, and a particulate removal module. The robotic arm moves the workpiece, creating a path; the particulate removal module positions the workpiece within the path and includes a particle remover with suction and blowing holes. When the workpiece is moved into the path by the robotic arm and positioned by the particulate removal module, the module causes particles on the workpiece to be both blown up by the blowing holes and simultaneously sucked into the particle remover by the suction holes. This achieves excellent particulate removal from the workpiece surface and ensures high workpiece yield.

Claims

1. A semiconductor workpiece conveying and processing device with particulate removal function, used for processing semiconductor workpieces and comprising: A robotic arm is capable of moving the semiconductor workpiece to generate at least one path; A particle removal module is disposed within the path and can position the semiconductor workpiece. The particle removal module includes a particle remover having at least one suction hole and at least one blowing hole. The particle remover blows air onto the semiconductor workpiece through the at least one suction hole and the at least one blowing hole, while simultaneously suctioning air from the semiconductor workpiece. The semiconductor workpiece is moved into the path by the robotic arm and positioned by the particle removal module. The particle removal module allows particles on the semiconductor workpiece to be both blown up by the at least one blowing hole of the particle remover and simultaneously sucked into the particle remover by the at least one suction hole of the particle remover.

2. The semiconductor workpiece conveying and processing apparatus with particulate removal function as described in claim 1, wherein the particulate remover can also control the airflow volume of the airflow blown out of the blow hole.

3. The semiconductor workpiece transfer and processing apparatus with particulate removal function as described in claim 1 further includes a first processing area and a second processing area. The first processing area is provided with at least a first processing device for processing the semiconductor workpiece moved by the robotic arm, and the second processing area is provided with at least a second processing device for processing the semiconductor workpiece transferred by the robotic arm. The path connects and communicates between the first processing area and the second processing area. The semiconductor workpiece is moved from the first processing area into the path by the robotic arm and positioned by the particle removal module.

4. The semiconductor workpiece transfer and processing equipment with particulate removal function as described in claim 1 further includes a body with at least the robotic arm, the body having the path inside, and the particulate removal module being disposed on the body corresponding to the path.

5. The semiconductor workpiece conveying and processing equipment with particulate removal function as described in claim 4, wherein the body has a suspended object corresponding to the path, and the particulate removal module is disposed on the suspended object.

6. The semiconductor workpiece conveying and processing equipment with particulate removal function as described in claim 5, wherein the particulate removal module further includes an adsorption stage, the body has a support object corresponding to the path, the suspended object and the support object are spaced apart from each other, the particulate remover and the adsorption stage are respectively disposed on the suspended object and the support object, and the adsorption stage removes particulates by adsorbing the semiconductor workpiece.

7. A semiconductor workpiece transfer and processing apparatus with particulate removal function as described in claim 6, wherein the adsorption stage is rotatable and has a plurality of fasteners for holding the semiconductor workpiece.

8. The semiconductor workpiece conveying and processing apparatus with particulate removal function as described in claim 1, wherein the particulate removal module further includes an adsorption stage, the particulate remover and the adsorption stage are arranged at intervals from each other, and the adsorption stage removes particulates by adsorbing the semiconductor workpiece.

9. A semiconductor workpiece transfer and processing apparatus with particulate removal function as described in claim 8, wherein the adsorption stage is rotatable and has a plurality of fasteners for holding the semiconductor workpiece.

10. The semiconductor workpiece conveying and processing apparatus with particulate removal function as described in claim 1, wherein the particulate removal module further includes an ion generator disposed on or opposite to the particulate remover, wherein positive ions and / or negative ions generated by the ion generator can be sent out along with the air blown out from the at least one blow hole and drawn into the particulate remover along with the air drawn in from the at least one suction hole.

11. A semiconductor workpiece transfer and processing apparatus with particulate removal function as described in claim 3, wherein the second processing device has a movable platform that receives the semiconductor workpiece from the robotic arm and positions the semiconductor workpiece by the particulate removal module.

12. The semiconductor workpiece transfer processing apparatus with particulate removal function as described in claim 3, wherein the second processing device has an auxiliary robotic arm that receives the semiconductor workpiece from the robotic arm and positions the semiconductor workpiece by the particulate removal module.

13. The semiconductor workpiece transfer and processing apparatus with particulate removal function as described in claim 1, wherein the robotic arm has at least one arm body capable of moving the semiconductor workpiece.

14. The semiconductor workpiece conveying and processing apparatus with particulate removal function as described in claim 1, wherein the particle remover can remove particles of size 1~100μm and has a removal capacity greater than 90%.

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