Heat dissipation module

Abstract

This disclosure provides a heat dissipation module, including: a heat-conducting member, movably floating on a circuit board, having a raised ring portion and a through hole through the raised ring portion; a locking member, passing through the through hole and fixed to the circuit board; and at least one elastic member, connected to the raised ring portion and abutting against the circuit board; wherein the raised ring portion can move along the locking member to be adjacent to or away from the circuit board, so as to compress or release the elastic member.

Claims

1. A heat dissipation module for a circuit board having a connector for connecting a storage element, the heat dissipation module comprising: A heat-conducting component, movably floating on the circuit board, has opposing first and second surfaces, a raised ring portion, a through hole, and an accommodating space. The first surface faces the circuit board, the raised ring portion extends outward from the first surface and surrounds and defines the accommodating space, exposing the accommodating space to the second surface, and the through hole passes through the raised ring portion and connects to the accommodating space. A locking fastener passes through the through hole and is fixed to the circuit board, and has a head, wherein the head is located in the accommodating space and spaced apart from the circuit board. At least one elastic member is connected to the raised ring portion and abuts against the circuit board, and constantly provides an elastic force. The raised ring portion of the heat-conducting component moves along the locking fastener to be adjacent to or away from the circuit board to compress or release the elastic member, and the elastic force continuously keeps the heat-conducting component in contact with the storage element.

2. The heat dissipation module as described in claim 1, wherein, The elastic element is a spring.

3. The heat dissipation module as described in claim 2, wherein, The spring is conical.

4. The heat dissipation module as described in claim 1, wherein, The fastener further has a stepped portion and a screwing portion. The stepped portion extends outward from the head and passes through the through hole, and the screwing portion extends outward from the stepped portion and is screwed onto the circuit board.

5. The heat dissipation module as described in claim 4, wherein, The cross-sectional area of ​​the head is greater than the cross-sectional area of ​​the through hole, and the cross-sectional area of ​​the through hole is greater than the cross-sectional area of ​​the step.

6. The heat dissipation module as described in claim 4, wherein, The protruding ring portion has a ring wall and a base plate connected to the end of the ring wall. The through hole passes through the base plate, and the thickness of the base plate is less than the height of the step portion, so that the base plate can move along the step portion and be limited by the head and the circuit board.

7. The heat dissipation module as described in claim 6, wherein, The convex ring portion further has an annular groove formed by the recess around the ring wall, and one end of the elastic member is engaged in the annular groove.

8. The heat dissipation module as claimed in claim 1 further includes a first thermally conductive pad disposed on the second surface for the storage element disposed on the second surface of the thermally conductive member to contact the first thermally conductive pad.

9. The heat dissipation module as claimed in claim 1 further includes a heat sink disposed on the storage element and a second thermally conductive pad disposed between the heat sink and the storage element.

10. The heat dissipation module as described in claim 9, wherein, The circuit board has a fixing screw, which corresponds to the connector and is located on opposite short sides of the heat-conducting component. A plurality of screws pass through the heat sink and are respectively screwed to the connector and the fixing screw, so that the heat sink contacts the second thermally conductive pad.

Images