Pipeline vacuum insulation device with thermal field homogenization structure

Abstract

A pipeline vacuum insulation device with a thermal field homogenization structure mainly includes a first insulation sheet and a second insulation sheet that are joined together to form a circular tube. The feature is that each insulation sheet has a corrugated or convex support frame inside to support the outer wall and the inner wall to form a closed vacuum space that will not collapse after vacuuming. In addition, a curved thermally conductive anti-slip sheet with high lateral thermal conductivity is provided between the inner wall and the pipeline. Through the temperature compensation mechanism of the thermally conductive anti-slip sheet, the thermal bridging effect caused by the contact of the support frame can be effectively offset, eliminating local cold spots on the pipe wall, thereby completely preventing the condensation and crystallization of the transported fluid (such as semiconductor exhaust gas).

Claims

1. A pipeline vacuum insulation device with a thermal field homogenization structure, comprising: Two insulation sheets, each in a semi-circular arc shape, each insulation sheet defining a vacuum space by an outer wall and an inner wall; a plurality of connectors and locking elements, respectively disposed on the side edges of the two insulation sheets for closure; a support frame, disposed within the vacuum space and in a wavy or convex / concave shape, respectively abutting against the outer wall and the inner wall; and a thermally conductive anti-slip sheet, in a curved arc shape and sandwiched between the inner wall and the pipeline; characterized in that: the thermally conductive anti-slip sheet has a lateral thermal conductivity coefficient, and when the support frame generates a thermal bridge effect at the contact point, the thermally conductive anti-slip sheet compensates for the local cold spots on the inner wall surface by means of the lateral thermal conductivity coefficient.

2. The pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1, wherein, The support frame and the inner wall are in point contact or line contact.

3. The pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1, wherein, The material of this thermally conductive anti-slip sheet is selected from high thermal conductivity metals, thermally conductive silicone or their composite materials.

4. A pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1 or 3, wherein, The thermally conductive anti-slip sheet has elastic deformation capability to fill the microscopic gaps between the pipe surface and the inner wall.

5. The pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1, wherein, The vacuum level of this vacuum space is sufficient to block gas convection and conduction heat loss.

6. The pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1, wherein, The joint between the two insulation sheets is equipped with a high-temperature resistant seal.

7. The pipeline vacuum insulation device with a thermal field homogenization structure as described in claim 1, wherein, The support frame is made of thin metal sheets formed by stamping or bending processes to reduce the cross-sectional area of ​​its vertical heat conduction path.

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