audio system

Abstract

This invention discloses an audio system. The audio system includes at least one external main unit. The at least one external main unit does not have acoustic sound emission function and includes a conductive substrate structure, a digital signal processing module, multiple power amplification modules, and a grounding structure. The digital signal processing module is disposed on one side of the conductive substrate structure and can emit an active crossover signal. The multiple power amplification modules are modularly disposed on one side of the conductive substrate structure and can receive the active crossover signal; each power amplification module corresponds to an independent audio path. The grounding structure has a single main ground point. The grounding terminal of the digital signal processing module and the grounding terminals of the multiple power amplification modules are connected to the single main ground point.

Claims

1. A sound system, comprising: At least one external host, without acoustic sound generation function, includes: a conductive substrate structure; a digital signal processing module disposed on one side of the conductive substrate structure, the digital signal processing module being capable of emitting an active crossover signal; multiple power amplification modules modularly disposed on one side of the conductive substrate structure and capable of receiving the active crossover signal, each power amplification module corresponding to an independent audio path; and a grounding architecture having a single main location, the grounding terminal of the digital signal processing module and the grounding terminals of the multiple power amplification modules being connected together to the single main location.

2. The audio system according to claim 1, wherein, The conductive substrate structure includes at least one of a metal base plate, an aluminum plate, a metal housing, or a printed circuit board; when the conductive substrate structure includes the printed circuit board, a ground plane of the printed circuit board is connected to the single main location through a physical wire, or the ground plane of the printed circuit board is connected to a conductive base, and a ground terminal of the printed circuit board inside each module is connected to the single main location.

3. The audio system according to claim 1, wherein, The audio system further includes at least one analog signal processing module, disposed between a signal output terminal of the digital signal processing module and a corresponding power amplification module; the analog signal processing module includes at least one of a treble knob, a midrange knob, a bass knob, or a tuning equalizer, the analog signal processing module receives signals from the digital signal processing module, and outputs an analog-adjusted signal to the corresponding power amplification module.

4. The audio system according to claim 1, wherein, The audio system further includes at least one fixed crossover active module disposed between the digital signal processing module and at least two power amplification modules; the digital signal processing module outputs a signal having a first frequency range to the fixed crossover active module, the fixed crossover active module has a built-in non-adjustable fixed crossover point, and the fixed crossover active module outputs multiple sub-frequency signals to corresponding multiple power amplification modules.

5. The audio system according to claim 1, wherein, The grounding architecture includes a star-shaped common ground copper busbar disposed on the conductive substrate structure, and the single main ground point is located on the star-shaped common ground copper busbar; each of the power amplification modules and the digital signal processing modules has an independent physical return conductor, and multiple physical return conductors are respectively converged and directly electrically connected to the single main ground point on the star-shaped common ground copper busbar.

6. The audio system according to claim 5, wherein, The conductive substrate structure is fixed with multiple metal facade compartments, which physically divide the internal space of the external host into a power layer space, a signal layer space and a power supply layer space; the audio system further includes at least one reserved module installation area, and an expansion metal plate is provided at the bottom of the reserved module installation area. The expansion metal plate is connected to the conductive substrate structure and is electrically conductive.

7. The audio system according to claim 1, wherein, The audio system further includes multiple passive component modules and at least one of an external plug-in terminal or a multi-position switch; each passive component module is connected in series in the independent audio path and is located between the digital signal processing module and the power amplification module; each passive component module contains a passive network composed of at least two of resistors, capacitors or inductors; the external plug-in terminal is electrically connected to the passive component module, and the multi-position switch is electrically connected to multiple internal signal paths with different passive network configurations.

8. The audio system according to claim 1, wherein, The at least one external host is an active crossover platform, and the audio system further includes at least one external power module expansion box; the external power module expansion box is equipped with at least one expansion power amplification module but does not have a crossover processing circuit, and the external power module expansion box is equipped with a signal input terminal and an external grounding socket; the signal input terminal is electrically connected to the digital signal processing module of the active crossover platform, and the external grounding socket is directly connected to the single master point of the active crossover platform via a physical grounding line.

9. The audio system according to claim 8, wherein, The internal power supply circuit of the external power module expansion box is electrically connected to both an internal transformer and a DC input port; the housing of the external power module expansion box and the housing of the active crossover platform have corresponding flat surfaces or interlocking structures.

10. The audio system according to claim 1, wherein, The audio system also includes a speaker enclosure, which does not have a passive crossover circuit inside. The speaker enclosure is provided with a single-unit panel and a guide groove. Multiple sound-producing units are installed on the single-unit panel, and the single-unit panel is slidably disposed in the guide groove. Each sound-producing unit is directly electrically coupled to the output terminal of the corresponding power amplification module through an independent physical wire.

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