Electronic package

Abstract

This invention provides an electronic package including a carrier, at least one electronic component, a cover structure, and a working fluid. The electronic component is disposed on the carrier and has an upper surface. The cover structure is disposed on the carrier and, together with the carrier, defines a sealed accommodating space, within which the electronic component is located. The cover structure has an inner upper surface facing the upper surface of the electronic component. The working fluid is contained within the sealed accommodating space and contacts the electronic component. One level of the working fluid is higher than the upper surface of the electronic component and lower than the inner upper surface of the cover structure. Therefore, this invention utilizes the two-phase phase change cycle of the fluid to achieve efficient heat dissipation, eliminating the problems of thermal resistance and stress damage at solid-state heat dissipation interfaces.

Claims

1. An electronic package, comprising: One carrier; At least one electronic component is disposed on the carrier, the at least one electronic component having an upper surface; a cover structure is disposed on the carrier, the cover structure and the carrier together defining a sealed accommodating space, wherein the at least one electronic component is located within the sealed accommodating space, and the cover structure has an inner upper surface facing the upper surface of the at least one electronic component; and a working fluid is contained within the sealed accommodating space and in contact with the at least one electronic component; wherein one liquid level of the working fluid is higher than the upper surface of the at least one electronic component, and the liquid level is lower than the inner upper surface.

2. The electronic package as claimed in claim 1, wherein the inner upper surface of the cover structure has a capillary structure.

3. The electronic package as claimed in claim 1, wherein the vertical distance from the liquid level of the working fluid to one of the inner upper surfaces of the cover structure is greater than or equal to 0.5 mm; and the vertical distance from the liquid level of the working fluid to one of the upper surfaces of the at least one electronic component is greater than or equal to 0.5 mm.

4. The electronic package as claimed in claim 1, wherein the upper surface of the at least one electronic component is further provided with a boiling-enhancing coating; and wherein the boiling-enhancing coating includes a central region and a peripheral region surrounding the central region, the central region being a hydrophobic surface and the peripheral region being a hydrophilic surface.

5. The electronic package as described in claim 1, further comprising: A heat sink is disposed on the upper surface of the at least one electronic component, wherein the liquid level of the working fluid is higher than one of the upper surfaces of the heat sink.

6. The electronic package as claimed in claim 5, wherein the vertical distance from the liquid level of the working fluid to one of the inner upper surfaces of the cover structure is greater than or equal to 0.5 mm; and the vertical distance from the liquid level of the working fluid to one of the upper surfaces of the heat sink is greater than or equal to 0.5 mm.

7. The electronic package as claimed in claim 5, wherein the upper surface of the heat sink is further provided with a boiling-enhancing coating; and wherein the boiling-enhancing coating includes a central region and a peripheral region surrounding the central region, the central region being a hydrophobic surface and the peripheral region being a hydrophilic surface.

8. The electronic package as described in claim 1, further comprising: A cooling plate is disposed on the outer upper surface of one of the cover structures, wherein the outer upper surface is located on the opposite side of the inner upper surface.

9. The electronic package as claimed in claim 1, wherein the cover structure includes a metal sidewall and a top cover, wherein the metal sidewall is disposed on the carrier and the top cover is disposed on the metal sidewall.

10. The electronic package as claimed in claim 9, wherein the top cover is a metal top cover.

11. The electronic package as described in claim 9, wherein the top cover is a cooling plate.

12. The electronic package as claimed in claim 1, wherein the at least one electronic component comprises a plurality of wafers arranged side by side on the carrier.

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