Hot pressing platform structure for grain bonding

TWM687775UActive Publication Date: 2026-09-21HAOFENG TECH CO LTD
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Patent Information

Application Number
TW115204341
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-05-14
Publication Date
2026-09-21
Estimated Expiration
2036-05-13

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Abstract

A hot-pressing platform structure for grain bonding includes a hot-pressing platform. The top of the hot-pressing platform has an adsorption groove recessed therein. The adsorption groove has a plurality of first adsorption holes and a plurality of second adsorption holes respectively opened in two rows at its bottom. A first channel and a second channel are opened in the front-to-back direction of the hot-pressing platform, respectively communicating with a portion of the first adsorption holes and all of the second adsorption holes. The second channel is connected in the left-to-right direction and passes through at least one third channel, communicating with at least one first adsorption hole. The hot-pressing platform has several sealing surfaces to block the openings of the first, second, and third channels. An exhaust port is opened at the bottom of the hot-pressing platform, communicating with the first and second channels. A heating rod is installed on the hot-pressing platform, upright below the adsorption groove and located between the first and third channels.
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Claims

1. A hot-pressing platform structure for grain bonding, comprising a hot-pressing platform, wherein: The hot-pressing platform has an adsorption groove recessed at its top. The adsorption groove has multiple first adsorption holes and multiple second adsorption holes on its left and right sides at its bottom. The hot-pressing platform has a first channel and a second channel opening in its front-to-back direction, respectively communicating with a portion of the first adsorption holes and all of the second adsorption holes. The second channel connects to at least one third channel in the left-to-right direction, communicating with at least one of the first adsorption holes. The hot-pressing platform has several sealing surfaces to block the openings of the first, second, and third channels. The bottom of the hot-pressing platform has an upward-facing exhaust hole communicating with the first and second channels to generate negative pressure for adsorption. The bottom of the hot-pressing platform has at least one heat dissipation hole. A heating rod is installed on the hot-pressing platform, standing upright below the adsorption groove and located between the first and third channels.

2. The hot-pressing platform structure for grain bonding as described in claim 1, wherein, The hot pressing platform is made of a single ceramic material.

3. The hot-pressing platform structure for grain bonding as described in claim 1, wherein, The number of heat dissipation holes is two.

4. The hot-pressing platform structure for grain bonding as described in claim 1, wherein, The heating rod has a base at its bottom that is fixed to the bottom of the hot press platform, and the hot press platform has a screw part on its side that abuts against the position where the heating rod is fixed.