Die attaching device with piezoelectric drive angle adjustment function

Abstract

This invention discloses a die-attachment device with piezoelectric drive angle adjustment function, comprising a movable base, a pick-and-place mechanism mounted on the movable base, a piezoelectric mechanism mounted on the movable base and linked to the pick-and-place mechanism, and a contact sensing mechanism disposed on the pick-and-place mechanism. The mounting end of the pick-and-place mechanism is disposed on the movable base. During a calibration operation performed by the die-attachment device with piezoelectric drive angle adjustment function, when the picking end of the pick-and-place mechanism touches a carrier at an angle, and the contact sensing mechanism detects that the force on the picking end exceeds a threshold, the contact sensing mechanism generates a signal to drive the piezoelectric mechanism to rotate the pick-and-place mechanism, thereby reducing the angle to within a preset range.

Claims

1. A die-attaching device with piezoelectric drive angle adjustment function, which is used to pick up a die and attach the die to the surface of a carrier board, the die-attaching device with piezoelectric drive angle adjustment function comprising: A mobile base; A pick-and-place mechanism is mounted on the movable base; wherein the pick-and-place mechanism includes: a mounting end disposed on the movable base; and a picking end for picking up the die; a piezoelectric mechanism mounted on the movable base and connected to the pick-and-place mechanism; wherein the piezoelectric mechanism can drive the pick-and-place mechanism to rotate; and a contact sensing mechanism disposed on the pick-and-place mechanism; wherein, during the process of the die attachment device with piezoelectric drive angle adjustment function performing a calibration operation and moving towards the carrier plate, when the picking end touches the carrier plate at an included angle and the contact sensing mechanism detects that the force on the picking end exceeds a threshold, the contact sensing mechanism generates a signal to drive the piezoelectric mechanism to rotate the pick-and-place mechanism, so that the included angle is reduced to within a preset range.

2. The die attachment device with piezoelectric drive angle adjustment function as described in claim 1, wherein, The surface of the carrier plate is non-horizontal, and the die attachment device with piezoelectric drive angle adjustment function performs the calibration operation to make the end face of the picking end parallel to the surface of the plate, so that the die picked up by the end face of the picking end can be flatly attached to the surface of the carrier plate.

3. The die attachment device with piezoelectric drive angle adjustment function as described in claim 1, wherein, The angle at which the pick-and-place mechanism can rotate, driven by the piezoelectric mechanism, is less than or equal to 1 degree.

4. The die attachment device with piezoelectric drive angle adjustment function as described in claim 1, wherein, The movable base forms a curved track, and the curved track defines a curved center; the mounting end is disposed on the curved track, the curved center of the curved track is located at the picking end, and the piezoelectric mechanism can drive the picking and placing mechanism to rotate along the curved track.

5. The die attachment device with piezoelectric drive angle adjustment function as described in claim 4, wherein, The curved track is an arc-shaped long strip with the center of the curve as the center of the circle, and the mounting end can move along the curved track so that the picking and placing mechanism can rotate around the center of the circle.

6. The die attachment device with piezoelectric drive angle adjustment function as described in claim 1, wherein, The mounting end of the pick-and-place mechanism is configured on the mobile base in a magnetic levitation or air levitation manner; wherein the contact sensing mechanism includes at least one of a torque sensor and a force sensor built into the pick-and-place mechanism.

7. The die attachment device with piezoelectric drive angle adjustment function as described in claim 1, wherein, The pick-and-place mechanism is a flexible structure, and the pick-and-place mechanism has a middle section located between the mounting end and the picking end, which is elastically deformable; wherein the picking end can rotate relative to the mounting end by the deformation of the middle section.

8. The die attachment device with piezoelectric drive angle adjustment function as described in claim 7, wherein, The cross-sectional area of ​​the middle section increases from its center point toward the mounting end and the picking end, respectively.

9. A die-attaching device with piezoelectric drive angle adjustment function, which can be used to pick up a die and attach the die to the surface of a carrier board, the die-attaching device with piezoelectric drive angle adjustment function comprising: A mobile base; A pick-and-place mechanism is mounted on the movable base, and the pick-and-place mechanism includes: a mounting end disposed on the movable base; and a picking end for picking up the die; a piezoelectric mechanism mounted on the movable base and connected to the pick-and-place mechanism; wherein the piezoelectric mechanism can drive the pick-and-place mechanism to rotate; and a non-contact sensing mechanism disposed corresponding to the pick-and-place mechanism; wherein the non-contact sensing mechanism can be used to detect an angle between the picking end and the board surface; wherein, during a calibration operation performed by the die attachment device with piezoelectric drive angle adjustment function, when the angle detected by the non-contact sensing mechanism exceeds a preset range, the non-contact sensing mechanism generates a signal to drive the piezoelectric mechanism to rotate the pick-and-place mechanism, so that the angle is reduced to within the preset range.

10. The die attachment device with piezoelectric drive angle adjustment function as described in claim 9, wherein, The surface of the carrier plate is non-horizontal, and the die attachment device with piezoelectric drive angle adjustment function performs the calibration operation to make the end face of the picking end parallel to the surface of the plate, so that the die picked up by the end face of the picking end can be flatly attached to the surface of the carrier plate.

11. The die attachment device with piezoelectric drive angle adjustment function as described in claim 9, wherein, The angle at which the pick-and-place mechanism can rotate, driven by the piezoelectric mechanism, is less than or equal to 1 degree.

12. The die attachment device with piezoelectric drive angle adjustment function as described in claim 9, wherein, The movable base forms a curved track, and the curved track defines a curved center; the mounting end is disposed on the curved track, the curved center of the curved track is located at the picking end, and the piezoelectric mechanism can drive the picking and placing mechanism to rotate along the curved track.

13. The die attachment device with piezoelectric drive angle adjustment function as described in claim 9, wherein, The mounting end of the pick-and-place mechanism is configured on the movable base in a magnetic levitation or air levitation manner; wherein, the non-contact sensing mechanism includes a distance sensor spaced apart from the pick-and-place mechanism.

14. The die attachment device with piezoelectric drive angle adjustment function as described in claim 9, wherein, The pick-and-place mechanism is a flexible structure, and the pick-and-place mechanism has a middle section located between the mounting end and the picking end, which is elastically deformable; wherein the picking end can rotate relative to the mounting end by the deformation of the middle section.

15. The die attachment device with piezoelectric drive angle adjustment function as described in claim 14, wherein, The cross-sectional area of ​​the middle section increases from its center point toward the mounting end and the picking end, respectively.

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