Anti-warping composite film

Abstract

An anti-warpage composite film, suitable for attachment to the surface of a semiconductor device, comprises a support layer, an adhesive layer, and a warpage control layer. The support layer is made of a polymer material; the adhesive layer is located on one side of the support layer and is made of silicone pressure-sensitive adhesive; the warpage control layer is located on the side of the support layer opposite to the adhesive layer and is made of at least one epoxy resin. By adjusting the coefficient of thermal expansion through the type of epoxy resin used in the warpage control layer, the anti-warpage composite film can withstand different process environments and the types of semiconductor devices to be attached.

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