Heat absorber for cooling system with multi-directional fluid guidance and heat dissipation system having the same

Abstract

This invention provides a heat absorber with a multi-directional fluid guiding cooling system and a heat absorption and dissipation system having the heat absorber. The heat absorber includes at least a substrate, a first flow guide, a second flow guide, an upper housing, and a lower housing. The substrate has a corresponding first side and a second side and is disposed between the upper housing and the lower housing. The first flow guide is disposed on the first side. The second flow guide is disposed on an inner side of the lower housing and corresponds to the first flow guide. The first flow guide is formed by at least one first channel along the first side, and the first channel has two first sidewalls. A first position is defined between the two first sidewalls. The substrate located at the first position has a through hole penetrating the substrate. The second flow guide is formed by at least one second channel along the inner side of the lower housing. The second channel has two second sidewalls. A second position is defined between the two second sidewalls. The first and second channels are attached to each other and arranged in an oblique or orthogonal vertical manner, such that at least one opening connecting the first and second channels is formed at the intersection of the first and second positions.

Claims

1. A heat absorber for a cooling system with multi-directional fluid guidance, comprising at least: a substrate having a suitable thickness and shape and including at least one corresponding first side and a second side; a first flow guide portion disposed in a group selected from the first side and a middle region of the first side, the first flow guide portion being formed by at least one first channel along the first side, the first channel having a suitable length and having two first sidewalls, the two first sidewalls of the first channel being used to guide a fluid to flow in a first direction, the first direction being defined as from one end of the first channel to the other end of the first channel, the area between the two first sidewalls being defined as a first position, the substrate at the first position having a through hole penetrating the substrate; and an upper housing disposed on the first side of the substrate, such that a first chamber is formed between the interior of the upper housing and the first flow guide portion. A lower housing is assembled on the second side of the substrate, such that a second chamber is formed between the interior of the lower housing and the second side, wherein... A second flow guide is provided on one inner side of the lower housing corresponding to the first flow guide and the second side. The second flow guide is formed by at least one second channel along the inner side. The second channel has an appropriate length and two second sidewalls. A second direction is defined from one end of the second channel to the other end of the second channel. A second position is defined between the two second sidewalls. At least one end of the second channel is an open end that communicates with the second chamber. The outer side of the lower housing corresponding to the second flow guide is used to conduct heat from a heat source. The first channel and the second channel are arranged in an oblique manner, such that the first direction and the second direction are oblique to each other. The outer edges of the two second sidewalls of the second channel relative to the second side are arranged adjacently, attached to or abutting against the second side corresponding to the first guide portion, such that at least one opening is formed at the intersection of the first position and the second position, which connects the first chamber and the second chamber or connects the first channel and the second channel, for guiding the fluid to flow in a third direction. The direction through the opening between the first and second channels is defined as the third direction. A bridging hole is provided on the substrate and penetrates the first and second sidewalls. An inlet hole penetrates one side of the upper housing and connects to the first chamber. An outlet hole penetrates one side of the upper housing and connects to the bridging hole and the second chamber.

2. The heat absorber as described in claim 1, wherein, The first channel and the second channel are arranged in an orthogonal perpendicular manner.

3. The heat absorber as described in claim 1, wherein, The distance between the two first sidewalls of the first channel is greater than the distance between the two second sidewalls of the second channel.

4. The heat absorber as described in claim 2, wherein, The distance between the two first sidewalls of the first channel is greater than the distance between the two second sidewalls of the second channel.

5. The heat absorber as described in claim 1, wherein, The cross-sectional shape of the inner edge of the first channel from the first side to the second side is slightly V-shaped.

6. The heat absorber as described in claim 2, wherein, The cross-sectional shape of the inner edge of the first channel from the first side to the second side is slightly V-shaped.

7. The heat absorber as described in any one of claims 1 to 6, wherein, The first channel is configured as a groove or two spaced-apart fins that protrude outwards.

8. The heat absorber as described in any one of claims 1 to 6, wherein, The second channel is configured as a groove or two spaced fins protruding toward the first guide section.

9. A heat absorption and heat dissipation system comprising a heat absorber as described in any one of claims 1 to 8.

10. The heat absorption and cooling system as described in claim 9, wherein the heat absorption and cooling mode includes a group selected from a liquid phase heat dissipation mode, a liquid-gas phase heat dissipation mode, and a combination of the aforementioned liquid phase heat dissipation mode and the aforementioned liquid-gas phase heat dissipation mode.

11. The heat dissipation system as described in claim 10, wherein, The boiling point of this fluid is between 30℃ and 80℃.

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