Expandable immersion cooling equipment

Abstract

This invention relates to an expandable immersion cooling device that can be used to solve the heat generation problem in power-requiring industrial equipment. Specifically, it addresses the heat dissipation challenges of chips on AI server motherboards, chips on single or multiple independent graphics cards, and heat-generating components in collaborative devices. The device utilizes a sealed enclosure to directly immerse the power-requiring industrial equipment, including its chips, in a non-conductive coolant. The non-conductive coolant then conducts heat to external devices for dissipation, while the cooled coolant is returned to the circulation pipeline. This expandable immersion cooling device can significantly reduce equipment temperature, improve equipment efficiency, achieve energy savings, environmental control, cost reduction, and extend equipment lifespan.

Claims

1. An expandable immersion cooling device, characterized in that it comprises: One motherboard; At least one heat-generating electronic component is disposed on the motherboard or electronic module; At least one sealing cover covers the heat-generating electronic component and forms a sealed space with the motherboard or electronic module; a non-conductive coolant is contained in the sealed space, immersing the heat-generating electronic component in the non-conductive coolant; a circulating pump is used to drive the non-conductive coolant to circulate; at least one heat exchange device; a plurality of liquid guide pipes; a plurality of connectors; and at least one T-joint; wherein the plurality of liquid guide pipes, the plurality of connectors, and the at least one T-joint are interconnected with the sealing cover, the circulating pump, and the heat exchange device, so that the circulating pump delivers the non-conductive coolant that absorbs the heat energy generated by the heat-generating electronic component to the heat exchange device for cooling, and returns the cooled non-conductive coolant to the sealing cover to form a closed-loop circulating heat dissipation system.

2. The expandable immersion heat dissipation device as described in claim 1, wherein the heat-generating electronic component includes a CPU chip.

3. The expandable immersion heat dissipation device as described in claim 1, wherein the heat-generating electronic component includes a first GPU chip.

4. The expandable immersion cooling device as described in claim 1, wherein the sealing cover covers most of the discrete graphics card, allowing the non-conductive coolant to simultaneously contact the first GPU chip and multiple heat-generating electronic components on the discrete graphics card for immersion cooling.

5. The expandable immersion cooling device as described in claim 1, wherein the sealing cover is fixed to the motherboard or discrete graphics card by a plurality of screws, and a sealing member is provided between the sealing cover and the motherboard or discrete graphics card to form a sealing structure.

6. The expandable immersion cooling device as described in claim 1, wherein the heat exchange device is at least one of the following: a fan-cooled cooling system, a water-cooled cooling system, or a cold storage air-cooled cooling system.

7. The expandable immersion heat dissipation device as described in claim 1, wherein the heat dissipation device further includes a gas cooling system that allows low-temperature gas to be delivered into the sealed enclosure for heat exchange with the heat-generating electronic component.

8. The expandable immersion cooling device as described in claim 1, wherein the device is used for cooling in a data center or high-performance computing device.

9. An expandable immersion cooling device as described in claim 1, wherein the device is used for cooling of electrically powered and heat-generating industrial products.

10. The expandable immersion cooling device as described in claim 1, wherein the non-conductive coolant may be synthetic oil or mineral oil.

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