Improved structure of ultra-micro wire diameter probe

TWM688090UActive Publication Date: 2026-10-01刘松哲 +1
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Patent Information

Application Number
TW115203991
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-05-05
Publication Date
2026-10-01
Estimated Expiration
2036-05-04

Smart Images

  • Figure TWG2TB001914360_001
    Figure TWG2TB001914360_001
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    Figure TWG2TB001914360_002
  • Figure TWG2TB001914360_003
    Figure TWG2TB001914360_003
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Abstract

This invention provides an improved structure for an ultra-micro diameter probe, comprising: a conductor device including an outer sheath and a conductor; and a tube device including a tube body at one end and a wire at the other end, the tube body having a tube body insertion hole for inserting and assembling the conductor, the insertion and assembly area forming a bonding area; wherein the diameter of the conductor is less than 0.3 mm and forms a gap fit with the tube body, the bonding area is laser welded by dynamically modulating the laser energy distribution after being scanned by a laser beam, so that the conductor and the tube body are fixed together; in this way, through laser beam scanning and dynamic distribution of laser welding energy, the laser energy can be uniformly distributed along the bonding area between the ultra-micro diameter conductor and the tube body, thereby realizing the welding of the ultra-micro diameter conductor and improving the welding quality and overall stability.
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Claims

1. An improved structure for an ultra-micro diameter probe, comprising: a conductor device including an outer sheath and a conductor; a tube device including a tube body at one end and a wire at the other end, the tube body having a tube body insertion hole for inserting and assembling the conductor, the insertion and assembly area forming a mating region; wherein, The conductor has a diameter of less than 0.3 mm and forms a gap fit with the tube. The joint area is scanned by a laser beam and then laser welding with dynamically modulated laser energy distribution is performed to fix the conductor and the tube together.

2. The improved structure of the ultra-micro diameter probe as described in claim 1, wherein the conductor device is formed by cutting an ultra-micro coaxial cable roll to a fixed length and stripping the outer wire.

3. The improved structure of the ultra-micro diameter probe as described in claim 1, wherein a spring is provided inside the tube body device.

4. The improved structure of the ultra-micro diameter probe as described in claim 1, wherein the laser beam performs periodic or non-periodic scanning along the junction region.

5. The improved structure of the ultra-micro diameter probe as described in claim 4, wherein the scanning trajectory includes a circular, elliptical, linear reciprocating, or irregular path.

6. The improved structure of the ultra-micro diameter probe as described in claim 1, wherein the laser welding dynamically modulates the laser energy distribution according to the geometric dimensions and gap fit of the joint area.

7. The improved structure of the ultra-micro diameter probe as described in claim 6, wherein the laser energy is dynamically modulated according to the scanning position or time, and the laser beam scanning frequency is 1 kHz to 4 kHz.

8. The improved structure of the ultra-micro diameter probe as described in claim 1, wherein the laser beam scanning is performed by a galvanometer system or a multi-axis moving platform.