Wafer trimming equipment

Abstract

This creation belongs to the field of semiconductor processing technology, and a wafer trimming equipment is disclosed. Wafer trimming equipment includes workbenches, cutting mechanisms, and wafer carrier tables. The cutting mechanism activity is provided at the table;

Claims

1. A wafer trimming apparatus for trimming edges of a wafer (100), the wafer trimming apparatus comprising: workbench (1);cutting mechanism (3) with activities set up at said workbench (1); The wafer carrier (42) for carrying and adsorbing said wafer (100) activity is disposed on the table (1) to switch between the waiting position and the trimming position, the number of the wafer carrier (42) is at least two, one of which the trimming position (42) is capable of moving to the trimming position to enable the cutting mechanism (10) to edge the wafer (3).

2. The wafer trimming apparatus as described in claim 1, wherein, The number of the wafer carrier (42) is two, where one of the wafer carrier (42) is in the trimming position and the other of the wafer carrier (42) is in the waiting position.

3. The wafer trimming apparatus as described in claim 2, wherein, The wafer trimming equipment further includes a sink (41) for cleaning the wafer (100), the sink (41) movable in the Y-direction disposed on the workbench (1), both the wafer carriers (42) are movable in the Y-direction at the sink (41), the cutting mechanism (3) is movable in the X-direction at the table (1), the 4. The wafer trimming apparatus as described in claim 3, wherein, The sink (41) includes: a sink body which is movable in the Y direction on the workbench (1), both of the wafer carriers (42) are movable in the Y direction on the sink body; 5. The wafer trimming apparatus as described in claim 2, wherein, Each of the wafer carriers (42) is capable of reciprocating movement in the Y-direction, the cutting mechanism (3) including two tool wheels (32), where one of the wafer carriers (42) is capable of simultaneous trimming of wafers (100) located on the wafer carriers (42) when one moves to the trimming position.

6. The wafer trimming apparatus as described in claim 1, wherein, The wafer trimming equipment further includes two wafer boxes (13).

7. The wafer trimming apparatus as described in claim 6, wherein, The wafer trimming equipment further includes a first handling robot (51), a second handling robot (52), and a wafer cache table (9) disposed on the workbench (1) capable of transferring wafers (100) in one of the wafer boxes (13) to the above The wafer cache stage (9) is capable of adjusting the wafer (100) to a preset orientation and the second handling robot (52) is capable of transferring the wafer (100) on the wafer cache stage (9) to the wafer carrier (42) located on the waiting position.

8. The wafer trimming apparatus as described in claim 7, wherein, The wafer trimming equipment further includes a third handling robot (53) and a wafer cleaning mechanism (11) provided on the workbench (1), the third handling robot (53) capable of transferring the wafer (100) on the wafer carrier (42) on the exiting trimming position to the wafer cleaning mechanism (11); Wherein, the wafer cleaning mechanism (11) includes: a wafer back cleaning mechanism (111), provided on the workbench (1), capable of cleaning the back of the wafer (100), the third handling robot (53) capable of transferring the wafer (100) on the wafer carrier (42) on the exit said trimming position to the wafer back cleaning mechanism (111); The wafer front cleaning mechanism (112), provided at the workbench (1), is capable of cleaning the front side of the wafer (100), and the wafer (100) that completes the back cleaning is capable of transferring to the wafer front cleaning mechanism (112).

9. The wafer trimming apparatus as described in any one of claims 1 to 8, wherein, The wafer carrier (42) includes: a bearing body (421), rotated about its own axis disposed on the table (1); a vacuum adsorption structure (422) with a recess opening on the upper surface of the bearing body (421) and a circumferential arrangement along the bearing body (421).

10. The wafer trimming apparatus as described in any one of claims 1 to 8, wherein, The cutting mechanism (3) includes at least one tool wheel (32); the wafer trimming equipment further includes at least one detection mechanism (8), the detection mechanism (8) and the tool wheel (32), respectively, active disposed on both sides of the table (1) along the Y direction.

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