Wafer trimming and test cutting platform

Abstract

This invention discloses a wafer trimming and test dicing platform for detecting the shape and preset cutting depth of the cutting wheel before wafer trimming. The platform includes a cutting wheel, wafer stage, base, test dicing component, detection mechanism, and trimming component. A visual inspection component allows real-time observation of the cutting shape of the cutting wheel on the sample, clarifying the trimming effect and radius, and identifying any abnormalities in the cutting wheel's shape in advance. If abnormalities are found, the trimming component corrects them to avoid affecting the wafer trimming quality. A ranging component accurately calculates the cutting depth of the cutting wheel, ensuring that the wafer trimming meets technical requirements.

Claims

1. A wafer trimming and test dicing platform, wherein the wafer is placed on a wafer stage (200), wherein, The wafer trimming and test dicing platform includes: a base (1), on which the wafer stage (200) is provided, and the base (1) can drive the wafer stage (200) to move along the Y-axis; a test dicing assembly (2), which includes a support base (21), a sample stage (22) and a sample (23), the support base (21) being disposed on the base (1) and located on one side of the wafer stage (200), the sample stage (22) being disposed on the support base (21), and the sample (23) being disposed on the sample stage (22), the sample (23) providing a test dicing reference surface for the cutter wheel (100) to simulate the target height to be achieved after the wafer trimming; The detection mechanism (3) is movable along the X-axis and Z-axis. The detection mechanism (3) includes a vision detection component (31) and a distance measuring component (32). The vision detection component (31) can observe the cutting pattern of the cutting wheel (100) on the sample (23) to detect the shape of the cutting wheel (100). The distance measuring component (32) can measure the distance between the cutting wheel (100) and the surface of the wafer to be trimmed, and the distance between the cutting wheel (100) and the surface of the sample (23) to determine the cutting depth of the cutting wheel (100). The trimming component is placed on the base (1) and located on one side of the test cutting component (2). The trimming component can trim the cutting wheel (100) with abnormal cutting pattern. The X-axis, Y-axis and Z-axis are perpendicular to each other.

2. The wafer trimming and test dicing platform as described in claim 1, wherein, The tool trimming assembly includes a tool trimming support, a tool trimming wheel, and a tool trimming drive. The tool trimming support is located on the base (1) and on one side of the test cutting assembly (2). The tool trimming wheel is located on the tool trimming support. The output end of the tool trimming drive is connected to the tool trimming wheel to drive the tool trimming wheel to rotate along its central axis.

3. The wafer trimming and test dicing platform as described in claim 1, wherein, The sample (23) is detachably mounted on the sample stage (22).

4. The wafer trimming and test dicing platform as described in claim 3, wherein, The sample (23) has multiple test cutting areas, which are distributed sequentially at intervals along the length of the sample (23).

5. The wafer trimming and test dicing platform as described in claim 4, wherein, The sample stage (22) has a slot, and a vacuum adsorption component is provided below the slot. The vacuum adsorption component can vacuum adsorb the sample (23) onto the sample stage (22).

6. The wafer trimming and test dicing platform as described in claim 1, wherein, The visual inspection component (31) includes a first mounting bracket and a visual inspection component (311). The first mounting bracket is located on one side of the cutter wheel (100), and the visual inspection component (311) is mounted on the first mounting bracket. The first mounting bracket can drive the visual inspection component (311) to move along the X-axis and Z-axis directions.

7. The wafer trimming and test dicing platform as described in claim 6, wherein, The visual inspection component (311) includes a camera (3111), a lens (3112), and a lens fixing component (3113). The camera (3111) and the lens (3112) are both mounted on the first mounting bracket. The lens fixing component (3113) is connected to the first mounting bracket and is used to fix the lens (3112).

8. The wafer trimming and test dicing platform as described in claim 1, wherein, The ranging component (32) includes a second mounting bracket (321) and a ranging sensor (322). The second mounting bracket (321) is located on one side of the cutter wheel (100). The second mounting bracket (321) can drive the ranging sensor (322) to move along the X-axis and Z-axis directions.

9. The wafer trimming and test dicing platform as described in claim 8, wherein, The detection mechanism (3) further includes a guide assembly (33), which includes a first guide and a second guide. The first guide is disposed on the second mounting bracket (321), and the second guide is disposed on the distance sensor (322). The first guide and the second guide slide together to enable the distance sensor (322) to move along the Z-axis on the second mounting bracket (321).

10. The wafer trimming and test dicing platform as described in any one of claims 1 to 9, wherein, The detection mechanism (3) further includes a control component, and the visual detection component (31), the ranging component (32) and the control component are electrically connected.

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