Electronic chip packaging structure with auxiliary conductive paths and portable electronic device

Abstract

This invention provides an electronic chip packaging structure with auxiliary conductive paths and a portable electronic device. The electronic chip packaging structure includes a circuit board, a chip module, and a bridging unit. The circuit board includes a substrate body, at least one first auxiliary conductive pad, and at least one second auxiliary conductive pad, the substrate body having at least one through-hole. The first and second auxiliary conductive pads are disposed on the substrate body. The chip module includes at least one electronic chip corresponding to the through-hole and electrically connected to the circuit board. The bridging unit includes at least one conductive bridging element. The conductive bridging element is electrically connected between the first and second auxiliary conductive pads. The at least one conductive bridging element can be configured as at least one auxiliary conductive path, thereby solving the problem that insufficient or limited wiring area (or conductive pattern configuration area) of the circuit board makes it difficult to increase wiring density.

Claims

1. An electronic chip package structure with an auxiliary conductive path, comprising: A circuit board, the circuit board including a substrate body, a plurality of first auxiliary conductive pads and a plurality of second auxiliary conductive pads, the substrate body having at least one through opening, and the plurality of first auxiliary conductive pads and the plurality of second auxiliary conductive pads disposed on a top end of the substrate body; a chip module, the chip module including at least one electronic chip corresponding to the at least one through opening and electrically connected to the circuit board. And a bridging unit, the bridging unit including a plurality of conductive bridging elements; wherein a plurality of first auxiliary conductive pads are located on a first side of the at least one through opening, and a plurality of second auxiliary conductive pads are located on a second side of the at least one through opening; wherein each of the conductive bridging elements spans the at least one through opening and is electrically connected between a corresponding first auxiliary conductive pad and a corresponding second auxiliary conductive pad.

2. The electronic chip packaging structure with an auxiliary conductive path as described in claim 1, wherein, The circuit board includes a plurality of first side conductive pads and a plurality of second side conductive pads. The plurality of first side conductive pads are disposed on the top end of the substrate body and located beside the first side of the at least one through-hole, and the plurality of second side conductive pads are disposed on the top end of the substrate body and located beside the second side of the at least one through-hole. The at least one electronic chip of the chip module is configured as a photosensitive chip or a non-photosensitive chip. The at least one electronic chip of the chip module is positioned and housed within the at least one through-hole of the substrate body through a surrounding adhesive layer. The surrounding adhesive layer is housed within the at least one through-hole of the substrate body and connected between an outer surrounding surface of the at least one electronic chip and an inner surrounding surface of the at least one through-hole. The electronic chip packaging structure further includes a light filter element disposed on the top end of the substrate body and spanning the at least one through-hole of the substrate body, and the light filter element corresponds to the at least one electronic chip of the chip module. Each of the conductive bridging elements is configured as a first-width bridging element, a second-width bridging element, or a third-width bridging element; wherein the width of the first-width bridging element is smaller than the width of the second-width bridging element, and the width of the second-width bridging element is smaller than the width of the third-width bridging element; wherein when each of the conductive bridging elements is configured as a first-width bridging element, the vertical projection of each of the conductive bridging elements overlaps with the top end of the substrate body, but does not overlap with the at least one through-hole of the substrate body or the at least one electronic chip of the wafer module; wherein when each of the conductive bridging elements is configured as a second-width bridging element, the vertical projection of each of the conductive bridging elements overlaps with the top end of the substrate body and the at least one through-hole of the substrate body, but does not overlap with the at least one electronic chip of the wafer module. Wherein, when each of the conductive bridging elements is configured as the third width bridging element, the vertical projection of each conductive bridging element overlaps with the top end of the substrate body, the at least one through-hole of the substrate body, and a non-photosensitive area of ​​the at least one electronic chip, but does not overlap with a photosensitive area of ​​the at least one electronic chip; wherein, each of the conductive bridging elements is configured as a pure conductive bridging element or a composite bridging element; wherein, when each of the conductive bridging elements is configured as the pure conductive bridging element, each of the conductive bridging elements is a copper bridging element;Wherein, when each of the conductive bridging elements is configured as the composite bridging element, each conductive bridging element includes an insulating substrate, at least one top conductive layer disposed on a top end of the insulating substrate, and at least one bottom conductive layer disposed on a bottom end of the insulating substrate.

3. The electronic chip packaging structure with an auxiliary conductive path as described in claim 1, wherein, The circuit board includes a plurality of first side conductive pads and a plurality of second side conductive pads, which are disposed on a bottom end of the substrate body. The plurality of first side conductive pads are located beside a first side of the at least one through-hole, and the plurality of second side conductive pads are located beside a second side of the at least one through-hole. The circuit board includes a structural reinforcement layer disposed on the bottom end of the substrate body to enhance its structural strength. The thickness of the structural reinforcement layer is greater than the thickness of the at least one electronic chip in the chip module. A maximum distance between the structural reinforcement layer and the bottom end of the substrate body is greater than a maximum distance between the at least one electronic chip in the chip module and the bottom end of the substrate body. The at least one electronic chip in the chip module is configured as a photosensitive chip or a non-photosensitive chip. The at least one electronic chip in the chip module is disposed on the bottom end of the substrate body and located outside the at least one through-hole. The electronic chip packaging structure further includes: a filter element disposed on the top end of the substrate body and spanning the at least one through-hole of the substrate body, and the filter element corresponding to the at least one electronic chip of the chip module; wherein each conductive bridging element is configured as a first width bridging element, a second width bridging element, or a third width bridging element; wherein the width of the first width bridging element is smaller than the width of the second width bridging element, and the width of the second width bridging element is smaller than the width of the third width bridging element; wherein when each conductive bridging element is configured as the first width bridging element, the vertical projection of each conductive bridging element overlaps with the top end of the substrate body, but does not overlap with the at least one through-hole of the substrate body or the at least one electronic chip of the chip module; wherein when each conductive bridging element is configured as the second width bridging element, the vertical projection of each conductive bridging element overlaps with the top end of the substrate body and the at least one through-hole of the substrate body, but does not overlap with the at least one electronic chip of the chip module. Wherein, when each of the conductive bridging elements is configured as the third width bridging element, the vertical projection of each of the conductive bridging elements overlaps with the top end of the substrate body, the at least one through-hole of the substrate body, and a non-photosensitive area of ​​the at least one electronic chip, but does not overlap with a photosensitive area of ​​the at least one electronic chip; wherein, each of the conductive bridging elements is configured as a pure conductive bridging element or a composite bridging element.Wherein, when each of the conductive bridging elements is configured as a purely conductive bridging element, each of the conductive bridging elements is a copper bridging element; wherein, when each of the conductive bridging elements is configured as a composite bridging element, each of the conductive bridging elements includes an insulating substrate, at least one top conductive layer disposed on a top end of the insulating substrate, and at least one bottom conductive layer disposed on a bottom end of the insulating substrate.

4. An electronic chip packaging structure with an auxiliary conductive path, comprising: A circuit board, the circuit board including a substrate body, at least one first auxiliary conductive pad and at least one second auxiliary conductive pad, the substrate body having at least one through opening, and the at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad disposed on a top end of the substrate body; a chip module, the chip module including at least one electronic chip corresponding to the at least one through opening and electrically connected to the circuit board. And a bridging unit, the bridging unit including at least one conductive bridging element; wherein, the at least one first auxiliary conductive pad is located on a first side of the at least one through opening, and the at least one second auxiliary conductive pad is located on a second side of the at least one through opening; wherein, the at least one conductive bridging element is electrically connected between the at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad.

5. The electronic chip packaging structure with an auxiliary conductive path as described in claim 4, wherein, The circuit board includes a plurality of first side conductive pads and a plurality of second side conductive pads. The plurality of first side conductive pads are disposed on the top end of the substrate body and located beside the first side of the at least one through-hole, and the plurality of second side conductive pads are disposed on the top end of the substrate body and located beside the second side of the at least one through-hole. The at least one electronic chip of the chip module is configured as a photosensitive chip or a non-photosensitive chip. The at least one electronic chip of the chip module is positioned and housed within the at least one through-hole of the substrate body through a surrounding adhesive layer. The surrounding adhesive layer is housed within the at least one through-hole of the substrate body and connects between an outer surrounding surface of the at least one electronic chip and an inner surrounding surface of the at least one through-hole. The at least one conductive bridging element spans the at least one through-hole. The electronic chip packaging structure further includes: a filter element disposed on the top end of the substrate body and spanning the at least one through-hole of the substrate body, and the filter element corresponding to the at least one electronic chip of the chip module; wherein the at least one conductive bridging element is configured as a first width bridging element, a second width bridging element, or a third width bridging element; wherein the width of the first width bridging element is smaller than the width of the second width bridging element, and the width of the second width bridging element is smaller than the width of the third width bridging element; wherein when the at least one conductive bridging element is configured as the first width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, but does not overlap with the at least one through-hole of the substrate body or the at least one electronic chip of the chip module; Wherein, when the at least one conductive bridging element is configured as the second width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body and the at least one through-hole of the substrate body, but does not overlap with the at least one electronic chip of the chip module; Wherein, when the at least one conductive bridging element is configured as the third width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, the at least one through-hole of the substrate body, and a non-photosensitive area of ​​the at least one electronic chip, but does not overlap with a photosensitive area of ​​the at least one electronic chip; Wherein, the at least one conductive bridging element is configured as a pure conductive bridging element or a composite bridging element; Wherein, when the at least one conductive bridging element is configured as the pure conductive bridging element, the at least one conductive bridging element is a copper bridging element;Wherein, when the at least one conductive bridging element is configured as the composite bridging element, the at least one conductive bridging element includes an insulating substrate, at least one top conductive layer disposed on a top end of the insulating substrate, and at least one bottom conductive layer disposed on a bottom end of the insulating substrate.

6. The electronic chip package structure with an auxiliary conductive path as described in claim 4, wherein, The circuit board includes a plurality of first side conductive pads and a plurality of second side conductive pads, which are disposed on a bottom end of the substrate body. The plurality of first side conductive pads are located beside a first side of the at least one through-hole, and the plurality of second side conductive pads are located beside a second side of the at least one through-hole. The circuit board includes a structural reinforcement layer disposed on the bottom end of the substrate body to enhance its structural strength. The thickness of the structural reinforcement layer is greater than the thickness of the at least one electronic chip in the chip module. A maximum distance between the structural reinforcement layer and the bottom end of the substrate body is greater than a maximum distance between the at least one electronic chip in the chip module and the bottom end of the substrate body. The at least one electronic chip in the chip module is configured as a photosensitive chip or a non-photosensitive chip. The at least one electronic chip in the chip module is disposed on the bottom end of the substrate body and located outside the at least one through-hole. Wherein, the at least one conductive bridging element spans the at least one through-opening; wherein, the electronic chip packaging structure further includes: a filter element disposed on the top end of the substrate body and spanning the at least one through-opening of the substrate body, and the filter element corresponding to the at least one electronic chip of the chip module; wherein, the at least one conductive bridging element is configured as a first width bridging element, a second width bridging element, or a third width bridging element; wherein, the width of the first width bridging element is smaller than the width of the second width bridging element, and the width of the second width bridging element is smaller than the width of the third width bridging element; wherein, when the at least one conductive bridging element is configured as the first width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, but does not overlap with the at least one through-opening of the substrate body or the at least one electronic chip of the chip module; Wherein, when the at least one conductive bridging element is configured as the second width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body and the at least one through-hole of the substrate body, but does not overlap with the at least one electronic chip of the chip module; Wherein, when the at least one conductive bridging element is configured as the third width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, the at least one through-hole of the substrate body, and a non-photosensitive area of ​​the at least one electronic chip, but does not overlap with a photosensitive area of ​​the at least one electronic chip; Wherein, the at least one conductive bridging element is configured as a pure conductive bridging element or a composite bridging element;Wherein, when the at least one conductive bridging element is configured as the purely conductive bridging element, the at least one conductive bridging element is a copper bridging element; wherein, when the at least one conductive bridging element is configured as the composite bridging element, the at least one conductive bridging element includes an insulating substrate, at least one top conductive layer disposed on a top end of the insulating substrate, and at least one bottom conductive layer disposed on a bottom end of the insulating substrate.

7. A portable electronic device configured to use an electronic chip package structure having an auxiliary conductive path, characterized in that the electronic chip package structure comprises: A circuit board, the circuit board including a substrate body, at least one first auxiliary conductive pad and at least one second auxiliary conductive pad, the substrate body having at least one through opening, and the at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad disposed on the substrate body; a chip module, the chip module including at least one electronic chip corresponding to the at least one through opening and electrically connected to the circuit board. And a bridging unit, the bridging unit including at least one conductive bridging element; wherein the at least one conductive bridging element is electrically connected between the at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad.

8. The portable electronic device as claimed in claim 7, wherein, The at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad are disposed on a top end of the substrate body; wherein the at least one first auxiliary conductive pad is located beside a first side of the at least one through-hole, and the at least one second auxiliary conductive pad is located beside a second side of the at least one through-hole; wherein the circuit board includes a plurality of first side conductive pads and a plurality of second side conductive pads, the plurality of first side conductive pads are disposed on the top end of the substrate body and beside the first side of the at least one through-hole, and the plurality of second side conductive pads are disposed on the top end of the substrate body and beside the second side of the at least one through-hole; wherein the at least one electronic chip of the chip module is configured as a photosensitive chip or a non-photosensitive chip; wherein the at least one electronic chip of the chip module is positioned and housed inside the at least one through-hole of the substrate body through a surrounding adhesive layer, and the surrounding adhesive layer is housed inside the at least one through-hole of the substrate body and connected between an outer surrounding surface of the at least one electronic chip and an inner surrounding surface of the at least one through-hole; Wherein, the at least one conductive bridging element spans the at least one through-hole; wherein, the electronic chip packaging structure further includes: a filter element disposed on the top end of the substrate body and spanning the at least one through-hole of the substrate body, and the filter element corresponding to the at least one electronic chip of the chip module.

9. The portable electronic device as claimed in claim 7, wherein, The at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad are disposed on a top end of the substrate body; wherein the at least one first auxiliary conductive pad is located beside a first side of the at least one through-hole, and the at least one second auxiliary conductive pad is located beside a second side of the at least one through-hole; wherein the circuit substrate includes a plurality of first side conductive pads and a plurality of second side conductive pads, the plurality of first side conductive pads and the plurality of second side conductive pads are disposed on a bottom end of the substrate body, the plurality of first side conductive pads are located beside the first side of the at least one through-hole, and the plurality of second side conductive pads are located beside the second side of the at least one through-hole; wherein the circuit substrate includes a structural reinforcement layer disposed on the bottom end of the substrate body to improve the structural strength of the circuit substrate; wherein the thickness of the structural reinforcement layer of the circuit substrate is greater than the thickness of the at least one electronic chip of the chip module. Wherein, the maximum distance between the structural reinforcement layer of the circuit substrate and the bottom end of the substrate body is greater than the maximum distance between the at least one electronic chip of the chip module and the bottom end of the substrate body; wherein, the at least one electronic chip of the chip module is configured as a photosensitive chip or a non-photosensitive chip; wherein, the at least one electronic chip of the chip module is disposed on the bottom end of the substrate body and located outside the at least one through-hole; wherein, the at least one conductive bridging element spans the at least one through-hole; wherein, the electronic chip packaging structure further includes: a light filter element disposed on the top end of the substrate body and spanning the at least one through-hole of the substrate body, and the light filter element corresponds to the at least one electronic chip of the chip module.

10. The portable electronic device as claimed in claim 7, wherein, The at least one first auxiliary conductive pad and the at least one second auxiliary conductive pad are disposed on a top end of the substrate body; wherein, the at least one conductive bridging element is configured as a first width bridging element, a second width bridging element, or a third width bridging element; wherein, the width of the first width bridging element is smaller than the width of the second width bridging element, and the width of the second width bridging element is smaller than the width of the third width bridging element; wherein, when the at least one conductive bridging element is configured as the first width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, but does not overlap with the at least one through-hole of the substrate body or the at least one electronic chip of the wafer module; wherein, when the at least one conductive bridging element is configured as the second width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body and the at least one through-hole of the substrate body, but does not overlap with the at least one electronic chip of the wafer module. Wherein, when the at least one conductive bridging element is configured as the third width bridging element, the vertical projection of the at least one conductive bridging element overlaps with the top end of the substrate body, the at least one through-hole of the substrate body, and a non-photosensitive area of ​​the at least one electronic chip, but does not overlap with a photosensitive area of ​​the at least one electronic chip; wherein, the at least one conductive bridging element is configured as a pure conductive bridging element or a composite bridging element; wherein, when the at least one conductive bridging element is configured as the pure conductive bridging element, the at least one conductive bridging element is a copper bridging element; wherein, when the at least one conductive bridging element is configured as the composite bridging element, the at least one conductive bridging element includes an insulating substrate, at least one top conductive layer disposed on a top end of the insulating substrate, and at least one bottom conductive layer disposed on a bottom end of the insulating substrate.

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