The pressing structure of the bonding machine

Abstract

This invention relates to a bonding structure for a bonding machine, mainly comprising a lower bonding device and an upper bonding device. The upper and lower bonding devices each include a mounting portion, a heat insulation plate, a heating plate, a heat spreader, and a bonding plate stacked together, capable of uniformly heating the wafer, colloid, and substrate stacked between them, allowing the wafer to be smoothly bonded to the substrate. Furthermore, the lower platen of the lower bonding device includes at least one cooling channel to which a cooling fluid can be delivered, enabling the lower platen to rapidly reduce the temperature of the bonded wafer, colloid, and substrate, thereby improving the efficiency of the bonding process.

Claims

1. A pressing structure for a bonding machine, comprising: A lower pressing device includes: a lower mounting portion; a lower heat insulation plate disposed on the lower mounting portion; a lower heating plate disposed on the lower heat insulation plate, the lower heating plate including a first heating unit; a lower heat spreader disposed on the lower heating plate; a lower pressure plate disposed on the lower heat spreader for supporting a wafer, a colloid, and a substrate stacked together, wherein the lower pressure plate includes at least a first cooling channel; and an upper pressing device facing the lower pressing device, including: an upper mounting portion; an upper heat insulation plate disposed on the upper mounting portion; an upper heating plate disposed on the upper heat insulation plate, the upper heating plate including a second heating unit, wherein the first heating unit and the second heating unit are used to heat the wafer, the colloid, and the substrate located between the lower pressing device and the upper pressing device; and an upper heat spreader disposed on the upper heating plate. An upper pressure plate is disposed on the upper heat spreader, wherein the upper pressure plate and the lower pressure plate are used to press and bond the wafer, the colloid and the substrate stacked thereon, and the first cooling channel disposed on the lower pressure plate is used to cool the wafer, the colloid and the substrate; a first drive motor is connected to the lower pressing device; and a second drive motor is connected to the upper pressing device, wherein the first drive motor and the second drive motor are respectively used to drive the lower pressing device and the upper pressing device to move.

2. The bonding structure of the bonding machine as claimed in claim 1, wherein the lower heating plate includes at least one second cooling channel.

3. The bonding structure of the bonding machine as described in claim 2, wherein the lower heat spreader includes a connecting hole for connecting the first cooling channel of the lower pressure plate and the second cooling channel of the lower heating plate.

4. The bonding structure of the bonding machine as described in claim 3, wherein the first cooling channel and the second cooling channel are spiral-shaped.

5. The bonding structure of the bonding machine as claimed in claim 2, wherein the lower heat spreader is located between the first cooling channel and the second cooling channel.

6. The bonding structure of the bonding machine as claimed in claim 2, wherein the second cooling channel is located between the first cooling channel and the first heating unit.

7. The bonding structure of the bonding machine as described in claim 2, wherein the lower heating plate includes a first heat-conducting plate body and a first groove, the first groove being disposed on the surface of the first heat-conducting plate body and used to accommodate the first heating unit.

8. The bonding structure of the bonding machine as claimed in claim 7, wherein the second cooling channel and the first heating unit are respectively disposed on two opposite surfaces of the first heat-conducting plate.

9. The bonding structure of the bonding machine as claimed in claim 7, wherein the upper heating plate includes a second heat-conducting plate body and a second groove, the second groove being disposed on the surface of the second heat-conducting plate body and used to accommodate the second heating unit.

10. The bonding structure of the bonding machine as claimed in claim 1, wherein the upper heat insulation plate and the lower heat insulation plate are mineral fiber boards.

Images