Sintered circuit boards

Abstract

This invention discloses a sintered circuit board comprising a glass substrate, an insulating layer, and a circuit layer. The glass substrate has a first surface and a second surface located on opposite sides. The insulating layer is located on the first surface; wherein the insulating layer forms a plurality of patterned through holes, so that the first surface has a plurality of formed areas exposed in the plurality of through holes. The circuit layer comprises a plurality of adhesive films and a plurality of sintered circuits. The plurality of adhesive films are formed in the plurality of formed areas, the plurality of sintered circuits are adhered to the plurality of adhesive films, and each sintered circuit is located within one of the through holes.

Claims

1. A sintered circuit board, comprising: A glass substrate having a first plate surface and a second plate surface located on opposite sides; An insulating layer is located on the first board surface; wherein the insulating layer is formed with a plurality of patterned through holes, so that the first board surface has a plurality of shaped regions respectively exposed in the plurality of through holes; and a circuit layer comprising: a plurality of adhesive films respectively formed in the plurality of shaped regions; and a plurality of sintered circuits respectively adhered to the plurality of adhesive films, and each of the sintered circuits being located within one of the through holes.

2. The sintered circuit board as described in claim 1, wherein, The thickness of the circuit formed by any one of the sintered circuits and the adhesive film connected thereto is equal to the thickness of the circuit formed by another sintered circuit and the adhesive film connected thereto.

3. The sintered circuit board as described in claim 1, wherein, The thickness of each of the aforementioned adhesive films is between 5 nanometers (nm) and 20 nanometers.

4. The sintered circuit board as described in claim 1, wherein, Each of the sintered lines has an outer surface away from the glass substrate, and the outer surface of each of the sintered lines is located within the corresponding through hole and is recessed.

5. The sintered circuit board as described in claim 1, wherein, The sintered circuit board includes a coupling layer, and the insulating layer is connected to the glass substrate through the coupling layer.

6. A sintered circuit board, comprising: A glass substrate having a first plate surface and a second plate surface located on opposite sides; An insulating layer is located on the first board surface; wherein the insulating layer is formed with a plurality of patterned through holes, so that the first board surface has a plurality of shaped regions respectively exposed in the plurality of through holes; and a circuit layer is located on the plurality of shaped regions, and the circuit layer comprises a plurality of sintered circuits, and each of the sintered circuits is located within one of the through holes.

7. The sintered circuit board as described in claim 6, wherein, Each of the sintered lines has an outer surface away from the glass substrate, and the outer surface of each of the sintered lines is located within the corresponding through hole and is recessed.

8. The sintered circuit board as described in claim 6, wherein, The sintered circuit board includes a coupling layer, and the insulating layer is connected to the glass substrate through the coupling layer.

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