Automotive electronic system

TWM688308UActive Publication Date: 2026-10-01PEGATRON
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Patent Information

Application Number
TW115206952
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-07-23
Publication Date
2026-10-01
Estimated Expiration
2036-07-22

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Abstract

An automotive electronic system includes a first electronic module, a second electronic module, and a water-cooled radiator. The first electronic module includes a first connector and a first heat sink base. The first connector is exposed on the first heat sink base. The second electronic module includes a second connector and a second heat sink base. The second connector is exposed on the second heat sink base; wherein the first connector is connected to the second connector. The water-cooled radiator is disposed between the first and second heat sink bases to dissipate heat generated by the first and second electronic modules.
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Claims

1. A vehicle electronic system, comprising: A first electronic module includes a first connector and a first heat sink, the first connector being exposed on the first heat sink; a second electronic module includes a second connector and a second heat sink, the second connector being exposed on the second heat sink; wherein the first connector is connected to the second connector; and a water-cooled radiator is disposed between the first heat sink and the second heat sink to dissipate the heat generated by the first electronic module and the second electronic module.

2. The automotive electronic system as described in claim 1, wherein, The lower surface of the first heat dissipation base abuts against the upper surface of the second heat dissipation base, and the first heat dissipation base and the second heat dissipation base together clamp the water-cooled radiator.

3. The automotive electronic system as described in claim 2, wherein, The lower surface of the first heat dissipation base has a first semi-deformed portion, and the upper surface of the second heat dissipation base has a second semi-deformed portion. The first semi-deformed portion and the second semi-deformed portion together surround the water-cooled radiator.

4. The automotive electronic system as described in claim 2, wherein, The first heat dissipation base forms a first through hole, and the first connector is exposed in the first through hole. The second heat dissipation base forms a second through hole, and the second connector is exposed in the second through hole.

5. The automotive electronic system as claimed in claim 1, wherein the first electronic module further includes a first circuit board, the first circuit board including at least one first chip, the first connector disposed on the first circuit board, the first circuit board disposed within the first heat sink, the first heat sink having at least one first cooling base protruding toward the first circuit board, the at least one first cooling base abutting against the at least one first chip.

6. The automotive electronic system as claimed in claim 5, wherein the second electronic module further includes a second circuit board, the second circuit board including at least one second chip, the second connector disposed on the second circuit board, the second circuit board disposed within the second heat sink, the second heat sink having at least one second cooling base protruding toward the second circuit board, the at least one second cooling base abutting against the at least one second chip of the second circuit board.

7. The automotive electronic system as claimed in claim 6 further includes a third electronic module configured to connect to the second electronic module, the third electronic module having a third connector, wherein the second electronic module further includes a rear connector connected to the third connector.

8. The automotive electronic system as described in claim 7, wherein, The third electronic module includes a third heat sink base and a third circuit board. The third circuit board is disposed within the third heat sink base, and the third connector is disposed on the third circuit board. The third heat sink base is connected to the second heat sink base.

9. The automotive electronic system as described in claim 8, wherein, The third circuit board includes at least one third chip, and the third heat dissipation base has at least one third cooling base protruding toward the third circuit board, the at least one third cooling base abutting against the at least one third chip of the third circuit board.

10. The automotive electronic system as claimed in claim 9, wherein, The first electronic module further includes a first cover plate covering the first heat dissipation base; the third electronic module further includes a third cover plate covering the third heat dissipation base.