Probe device having identification information

TWM688471UActive Publication Date: 2026-10-11STAR TECHNOLOGIES INC
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Patent Information

Application Number
TW115204891
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-05-28
Publication Date
2026-10-11
Estimated Expiration
2036-05-27

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    Figure TWG2TB001916062_003
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Abstract

This disclosure provides a probe device for transmitting test commands and test signals in response to the test commands. The probe device includes a substrate, multiple contact points, multiple probes, and non-volatile memory. The substrate has corresponding first and second surfaces. The contact points are disposed in a signal connection area on the first surface. The probes are disposed on the second surface and electrically connected to the contact points. The non-volatile memory is disposed in the signal connection area for storing identification data that identifies the correspondence between the probe device and the object under test. The correspondence is identified by reading the identification data.
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Claims

1. A probe device for transmitting a test command and a test signal responding to the test command, wherein the probe device comprises: a substrate having a corresponding first surface and a second surface; a plurality of contact points disposed in a signal connection area on the first surface; a plurality of probes disposed on the second surface and electrically connected to the contact points; and a non-volatile memory disposed in the signal connection area for storing identification data that identifies a correspondence between the probe device and a test object, wherein the correspondence is identified by reading the identification data.

2. The probe device as claimed in claim 1, wherein the contact points comprise: a plurality of first contact points disposed on the outermost side of the signal connection area; and a plurality of second contact points surrounded by the first contact points, wherein the substrate comprises a plurality of first inner layer buried wires for electrically connecting the first contact points and the second contact points respectively.

3. The probe device as claimed in claim 2, wherein the non-volatile memory is disposed between two adjacent first contact points.

4. The probe device as claimed in claim 2, wherein the substrate further includes a plurality of second inner layer buried wires for electrically connecting the second contact points and the probes respectively, wherein the probes are disposed in the area of ​​the signal connection area projected on the second surface.

5. The probe device as claimed in claim 2 further comprises: a plurality of test signal lines electrically connected to the first contacts for transmitting the test command and the test signal, respectively; and a first connector coupled to the test signal lines.

6. The probe device as claimed in claim 1 further comprises: a memory read line electrically connected to the non-volatile memory for transmitting the identification data; and a second connector coupled to the memory read line.

7. A probe device for transmitting a test command and a test signal responding to the test command, wherein the probe device comprises: a substrate having a corresponding first surface and a second surface; a plurality of contact points disposed in a signal connection area on the first surface and surrounding a through hole in the substrate, wherein the through hole extends from the first surface to the second surface; a first non-volatile memory disposed in the signal connection area for storing first identification data; and a probe card carrier disposed in the through hole, comprising: a body; a probe card disposed on the body and including a plurality of probes; and a second non-volatile memory disposed on the probe card for storing second identification data, wherein a correspondence between the probe device and a test object is identified by reading the first identification data and the second identification data.

8. The probe device as claimed in claim 7 further comprises: a plurality of test signal lines for transmitting the test command and the test signal, respectively; and a first connector coupled to the test signal lines.

9. The probe device as claimed in claim 7 further comprises: a memory read line electrically connected to the first non-volatile memory and the second non-volatile memory for transmitting the first identification data and the second identification data; and a second connector for coupling the memory read line.

10. The probe device as claimed in claim 9 further comprises: a clamping assembly disposed on the first surface, wherein the clamping assembly has a receiving space corresponding to the perforation, wherein the body of the probe card carrier is fitted in the receiving space, and the probe card of the probe card carrier passes through the receiving space and the perforation and protrudes from the second surface.

11. The probe device as claimed in claim 7, wherein the plurality of contact points includes: a plurality of first contact points disposed on the outermost side of the signal connection area; and a plurality of second contact points surrounded by the first contact points, wherein the substrate includes a plurality of inner layer buried wires for electrically connecting the first contact points and the second contact points respectively, wherein the probe card carrier further includes: a plurality of third contact points for electrically coupling the second contact points to the probes respectively.

12. The probe device as claimed in claim 11, wherein each of the second contact points is provided with a conductive spring needle or an elastic protrusion.

13. The probe device as claimed in claim 11, wherein the second non-volatile memory is electrically connected to a plurality of third contact points.