Workpiece chamfering system

TWM688488UActive Publication Date: 2026-10-11刘松哲 +1
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Patent Information

Application Number
TW115205364
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-06-11
Publication Date
2026-10-11
Estimated Expiration
2036-06-10

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    Figure TWG2TB001916079_001
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    Figure TWG2TB001916079_003
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Abstract

This disclosure provides a workpiece chamfering machining system applied to glass workpieces. The system includes a support device, an adjustment device, a laser device, and a control device. The support device supports the glass workpiece; the adjustment device includes a moving component and a rotating component, the moving component adjusting the machining position of the glass workpiece, and the rotating component adjusting the machining posture of the glass workpiece; the laser device outputs a laser beam along an output path to the area to be machined, forming a chamfer in the area; the control device includes an input module and a control module, the input module inputting machining parameters, and the control module outputting laser control signals to the laser device, and outputting position control signals and posture control signals to the adjustment device based on the machining parameters.
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Claims

1. A workpiece beveling system applied to a glass workpiece having a first surface and a second surface disposed opposite to each other and a processing area disposed between the first surface and the second surface, the workpiece beveling system comprising: a support device for supporting the glass workpiece; an adjustment device connected to the support device, the adjustment device comprising a moving member and a rotating member, the moving member for adjusting a processing position of the glass workpiece, and the rotating member for adjusting a processing posture of the glass workpiece; a laser device for outputting a laser beam along an output path to the processing area to form a beveling angle in the processing area; and a control device coupled to the support device, the adjustment device and the laser device, the control device comprising an input module and a control module, the input module for inputting a processing parameter, the control module for outputting a laser control signal to the laser device according to the processing parameter, and outputting a position control signal and a posture control signal to the adjustment device.

2. The workpiece chamfering system as described in claim 1, wherein, The laser beam has a processing angle with the area to be processed.

3. The workpiece chamfering system as described in claim 1, wherein, The machining parameters include a chamfer type parameter, which can be one of a straight chamfer type, a curved chamfer type, or a multi-angle chamfer type.

4. The workpiece chamfering system as described in claim 1, wherein, The control device includes a mode selection module, which includes a straight line mode, a curved surface mode and a multi-angle mode according to the bevel angle shape parameter. The control module outputs the laser control signal, the position control signal and the attitude control signal according to the straight line mode, the curved surface mode or the multi-angle mode.

5. The workpiece chamfering system as described in claim 1, wherein, The processing parameters include a pre-processing parameter, a main processing parameter, and a fine processing parameter. The laser control signal corresponding to the pre-processing parameter, the main processing parameter, and the fine processing parameter includes a pre-processing signal, a main processing signal, and a fine processing signal. The laser device sequentially processes the area to be processed based on the pre-processing signal, the main processing signal, and the fine processing signal to form the chamfer.