Wafer pick-and-place alignment device

Abstract

This invention discloses a wafer pick-and-place alignment device for picking up, placing, and aligning wafer bodies. The wafer pick-and-place alignment device includes a base plate, multiple alignment components, and a pick-up component. The base plate is connected to a robotic arm. The alignment components include an elastic body, which is disposed on the side of the base plate away from the robotic arm, so that the elastic body can selectively abut against the wafer body. The surface of the elastic body facing the wafer body is provided with an angle.

Claims

1. A wafer pick-and-place alignment device, configured to pick up, place, and align a wafer body (5), the wafer pick-and-place alignment device comprising: A base plate (1) is connected to a robotic arm; Multiple alignment components (2), each alignment component (2) includes an elastomer (21) disposed on the side of the base plate (1) away from the robotic arm, such that the elastomer (21) can selectively abut against the wafer body (5), the surface of the elastomer (21) is provided with an angle facing the wafer body (5), and the height of the elastomer (21) decreases from the side of the elastomer (21) facing the edge of the base plate (1) to the side facing the center of the base plate (1); The suction member is disposed on the side of the base plate (1) away from the robotic arm, and the distance between the suction member and the center of the base plate (1) is less than the distance between the elastomer (21) and the center of the base plate (1).

2. The wafer pick-and-place alignment apparatus as described in claim 1, wherein, The centering assembly (2) further includes a centering adjustment plate (22) and a centering fixing plate (23). The centering adjustment plate (22) is selectively slidably disposed on the centering fixing plate (23) in the vertical direction. The centering fixing plate (23) is connected to the base plate (1). The elastic body (21) is disposed on the centering adjustment plate (22).

3. The wafer pick-and-place alignment apparatus as described in claim 2, wherein, The base plate (1) has an adjustment groove (12) in the radial direction. The adjustment groove (12) is provided in a one-to-one correspondence with the centering fixing plate (23). The centering fixing plate (23) can be selectively slidably disposed on the base plate (1) along the length direction of the adjustment groove (12).

4. The wafer pick-and-place alignment apparatus as described in claim 2, wherein, The centering adjustment plate (22) is connected to a first adjustment member to limit the relative position of the centering adjustment plate (22) and the centering fixing plate (23); and / or, the centering fixing plate (23) is connected to a second adjustment member to limit the relative position of the centering fixing plate (23) and the base plate (1).

5. The wafer pick-and-place alignment apparatus as described in claim 1, wherein, The suction device is a Bennuri suction cup (3), which is connected to a quick-connect connector (31). The quick-connect connector (31) is provided in a one-to-one correspondence with the Bennuri suction cup (3) and is used to provide compressed air to the Bennuri suction cup (3). The quick-connect connector (31) and the Bennuri suction cup (3) are respectively located on both sides of the base plate (1).

6. The wafer pick-and-place alignment apparatus as described in claim 5, wherein, The quick-connect connector (31) and the centering assembly (2) are circumferentially spaced.

7. The wafer pick-and-place alignment apparatus as described in any one of claims 1 to 6, wherein, The tilt angle shall not exceed 10°.

8. The wafer pick-and-place alignment apparatus as described in any one of claims 1 to 6, wherein, The wafer pick-and-place alignment device also includes a wafer sensor (4), which is located at the center of the base plate (1) and is located on the same side of the base plate (1) as the elastomer (21).

9. The wafer pick-and-place alignment apparatus as described in any one of claims 1 to 6, wherein, The centering component (2) is provided in six groups, and the six groups of centering components (2) are circumferentially and equally spaced on the base plate (1).

10. The wafer pick-and-place alignment apparatus as described in any one of claims 1 to 6, wherein, The elastomer (21) is made of rubber or foam material.

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