Antenna substrate packaging structure

Abstract

This invention relates to an antenna substrate packaging structure, comprising an antenna substrate, a circuit board, and an interposer. The interposer is disposed between the antenna substrate and the circuit board, and includes a plurality of copper pillar units and an integrated circuit chip. Each copper pillar unit comprises a plurality of copper pillars extending along a first direction and spaced apart along a second direction. The copper pillars are connected at opposite ends along the first direction to antenna lines on the antenna substrate and redistribution lines on the circuit board, respectively. The integrated circuit chip is connected to the redistribution lines and, through the redistribution lines and the copper pillars, to the antenna lines. Because the interposer uses copper pillar units instead of an interposer substrate, this novel antenna substrate packaging structure can be manufactured without multiple substrate lamination processes, reducing costs and avoiding low yield issues.

Claims

1. An antenna substrate packaging structure, comprising: An antenna substrate, which includes antenna circuitry; A circuit board includes a redistribution circuit; an interposer is disposed between the antenna board and the circuit board, and includes: a plurality of copper pillar units, spaced apart from each other, and forming a wafer space between the copper pillar units, and each copper pillar unit includes a plurality of copper pillars; wherein the copper pillars of each copper pillar unit extend along a first direction and are spaced apart along a second direction, and the copper pillars of each copper pillar unit are connected to the antenna circuit of the antenna board and the redistribution circuit of the circuit board at opposite ends along the first direction; an integrated circuit chip is disposed in the wafer space and connected to the redistribution circuit of the circuit board, and connected to the antenna circuit through the redistribution circuit and the copper pillars.

2. The antenna substrate packaging structure as described in claim 1, wherein, The interposer also includes: an epoxy molding compound covering the copper pillar units and the integrated circuit chip; wherein the epoxy molding compound and the antenna substrate are separated by an encapsulation gap.

3. The antenna substrate packaging structure as described in claim 2, wherein, The interposer also includes: an underfiller disposed in a wiring gap between the integrated circuit chip and the circuit board.

4. The antenna substrate packaging structure as described in claim 1, wherein, Each of the copper pillar units further includes: a fastener covering the copper pillars of each copper pillar unit; wherein the copper pillars of each copper pillar unit extend out of the fastener at opposite ends along the first direction; wherein the interposer further includes: an epoxy molding compound (EMC) covering the copper pillar units and the integrated circuit chip.

5. The antenna substrate packaging structure as described in claim 1, wherein, Each of the copper pillar units further includes: a fastener covering the copper pillars of each copper pillar unit; wherein the copper pillars of each copper pillar unit extend out of the fastener at opposite ends along the first direction; wherein the interlayer further includes: an underfiller disposed in a wiring gap between the integrated circuit chip and the circuit board.

6. The antenna substrate packaging structure as described in claim 5, wherein, The interposer also includes: an epoxy molding compound that encapsulates the copper pillar units and the integrated circuit chip.

7. The antenna substrate packaging structure as described in any one of claims 4 or 5, wherein, Each of the fixing components of these copper pillar units is encapsulated with adhesive.

8. The antenna substrate packaging structure as described in claim 1, wherein, The circuit board further includes: a plurality of fan-out openings formed recessed from a substrate surface of the circuit board and exposing a portion of the redistribution lines; wherein the substrate surface faces away from the interposer layer; and a plurality of fan-out pads disposed in the fan-out openings and connected to the redistribution lines.

Images