Package structure

Abstract

A method for manufacturing a package structure includes bonding a first carrier and a second carrier together by a bonding method, electrically connecting a first circuit structure of the second carrier to a plurality of first conductive posts of the first carrier, and then removing the first carrier and the second carrier to form a package structure having the first circuit structure and the first conductive posts. In this manufacturing method, at least one first electronic component, a second circuit structure and at least one second electronic component can be disposed in the package structure to form a stacked package structure.

Claims

1. A package structure comprising: a first circuit structure having a plurality of first conductive pads and a plurality of second conductive pads; a first electronic component bonded to the first conductive pads; a plurality of first conductive posts electrically connected to the second conductive pads; and a first package body sealing the first electronic component and the first conductive posts, and exposing a plurality of conductive end faces of the first circuit structure and the first conductive posts.

2. The packaging configuration as claimed in claim 1, wherein the first conductive posts are engaged with the second conductive pads.

3. The encapsulation configuration of claim 1, wherein the first circuit structure includes a plurality of second leads formed on the second leads pads, and the first leads are engaged with the second leads.

4. The encapsulation configuration as claimed in claim 3, wherein the first leads are engaged with the second leads by a bonding material.

5. The package configuration of claim 1 further includes a second circuit structure having a plurality of third conductive pads, the second circuit structure being formed on the first package and the conductive end faces, the first package being located between the first circuit structure and the second circuit structure.

6. The package structure of claim 1, further comprising at least one second electronic component, the second electronic component being coupled to the first circuit structure, the first circuit structure being located between the first electronic component and the second electronic component.

7. The package configuration of claim 6 further includes a second circuit structure having a plurality of third conductive pads, the second circuit structure being formed on the first package and the conductive end faces, and the second circuit structure being electrically connected to the first conductive posts, the first package being located between the first circuit structure and the second circuit structure.

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