Intermediary board

TWM688613UActive Publication Date: 2026-10-11JIANGCHEN TECHNOLOGY CO LTD
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Patent Information

Application Number
TW115206991
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-07-23
Publication Date
2026-10-11
Estimated Expiration
2036-07-22

Smart Images

  • Figure TWG2TB001916204_001
    Figure TWG2TB001916204_001
  • Figure TWG2TB001916204_002
    Figure TWG2TB001916204_002
  • Figure TWG2TB001916204_003
    Figure TWG2TB001916204_003
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Abstract

An interposer includes a glass substrate, a seed layer, and a conductive portion. The glass substrate includes a first surface, a second surface, a surrounding wall formed from the first surface toward the second surface, and a hole defined by the surrounding wall defining a passage through the glass substrate. The seed layer has a wall portion correspondingly formed on the surrounding wall and a bottom portion connected to one end of the wall portion, closing one opening of the hole. The conductive portion covers the surface of the seed layer and fills the hole.
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Claims

1. An interposer plate, comprising: a glass substrate including a first surface, a second surface, a perimeter formed from the first surface toward the second surface, and a hole defined by the perimeter defining a through-hole in the glass substrate; a seed layer having a wall portion corresponding to the perimeter and a bottom portion connected to one end of the wall portion and closing one opening of the hole; and a conductive portion covering the surface of the seed layer and filling the hole.

2. The intermediary board as described in claim 1, wherein, The seed layer is made of a different material than the conductive part.

3. The interposer as described in claim 1 further comprises a conductive filler layer located between the seed layer and the conductive portion.

4. The intermediary board as described in claim 1, wherein, The seed layer is made of titanium-copper metal, and the conductive part is made of copper.