Cables and connectors

TWM688727UActive Publication Date: 2026-10-21STARCONN ELECTRONIC (SU ZHOU) CO LTD
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Patent Information

Application Number
TW115203628
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2026-03-05
Filing Date
2026-04-24
Publication Date
2026-10-21
Estimated Expiration
2036-04-23

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  • Figure TWG2TB001917680_003
    Figure TWG2TB001917680_003
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Abstract

A cable is provided comprising: a conductor configured to transmit electrical signals; and a shielding layer extending around the conductor, the shielding layer comprising a base layer and a solder layer stacked on top of each other, the solder layer being configured to be soldered to a grounding element of the shielding component to electrically connect the grounding element and the base layer. This facilitates soldering of the shielding layer to the grounding element, thereby improving product quality and production efficiency.
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Claims

1. A cable (100) comprising: Conductor (110) is configured to transmit electrical signals; And a shielding layer (120) extending around the conductor (110), the shielding layer (120) including a base layer (121) and a solder layer (122) stacked on top of each other, the solder layer (122) being configured to be soldered to a grounding element (210) of the shielding component (200) to electrically connect the grounding element (210) and the base layer (121).

2. The cable (100) as described in claim 1, wherein, The solder layer (122) is fixedly connected to the grounding element (210) of the shielding component (200) by solder, wherein the solder layer (122) has better wettability to the solder than the base layer (121).

3. The cable (100) as described in claim 1 or 2, wherein, The base layer (121) comprises aluminum; and / or the weld layer (122) comprises one or more of the following materials: nickel, copper, tin, silver and gold.

4. The cable (100) as described in claim 1 or 2, wherein, The thickness of the weld layer (122) is greater than or equal to 0.76 μm; and / or the weld layer (122) is an electroplated layer.

5. The cable (100) as described in claim 1 or 2, wherein, The cable (100) is a groundless differential signal cable; and / or the surface of the shielding layer (120) is provided with pits for receiving solder.

6. The cable (100) as described in claim 1 or 2, wherein the shielding layer (120) comprises: The welding area (120a) is located within the welding area (120a); and the non-welding area (120b) is located outside the non-welding area (120b).

7. The cable (100) as described in claim 1 or 2, wherein, The base layer (121) is provided with a recess (1211) for receiving at least a portion of the weld layer (122).

8. The cable (100) as described in claim 7, wherein, The cable (100) includes a pair of conductors (110) arranged side by side in the transverse direction (T) in the cross section of the cable (100), and the projection of the recess (1211) in the longitudinal direction (L) perpendicular to the transverse direction (T) is at least partially located between the pair of conductors (110).

9. The cable (100) as described in claim 7, wherein, The masking layer (120) further includes a recessed region (120c) corresponding to the recess (1211); the thickness of the welding layer (122) within the recessed region (120c) is greater than the thickness of the welding layer (122) outside the recessed region (120c), or the entire welding layer (122) is located within the recessed region (120c).

10. The cable (100) as described in claim 1 or 2, wherein, The shielding layer (120) further includes one or more of the following layers: a protective layer configured to prevent oxidation of the weld layer (122), the protective layer being disposed stacked on top of the base layer (121) and the weld layer (122), and the weld layer (122) being at least partially located between the base layer (121) and the protective layer; and a barrier layer configured to prevent separation of the base layer (121) and the weld layer (122), the barrier layer being disposed stacked on top of the base layer (121) and the weld layer (122), and the barrier layer being at least partially located between the base layer (121) and the weld layer (122).

11. The cable (100) as described in claim 10, wherein, The protective layer comprises one or more of the following materials: organic matter, nickel, gold, silver and tin; and / or the barrier layer comprises one or more of the following materials: nickel and phosphorus.

12. A connector, wherein, include: The cable (100) as described in any of the requests 1 to 11; And a shielding component (200), including: a grounding element (210) configured to be welded to the solder layer (122) of the cable (100) to be electrically connected to the base layer (121) of the cable (100) via the solder layer (122).

13. The connector as described in claim 12, wherein, The grounding element (210) includes a solder hole (211) for receiving solder. The grounding element (210) is configured to be soldered to the solder layer (122) via the solder hole (211). The solder hole (211) includes a proximal end (2111) configured to face the solder layer (122) during soldering and a distal end (2112) configured to face away from the solder layer (122) during soldering. The aperture of the solder hole (211) gradually increases from the distal end (2112) to the proximal end (2111).