Sensor circuit structure

TWM688943UActive Publication Date: 2026-10-21CAREER TECHNOLOGY MFG CO LTD
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Patent Information

Application Number
TW115207158
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-07-28
Publication Date
2026-10-21
Estimated Expiration
2036-07-27

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  • Figure TWG2TB001917896_003
    Figure TWG2TB001917896_003
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Abstract

A sensor circuit structure includes a substrate layer, a first circuit layer, and a second circuit layer. The substrate layer includes a first surface, a second surface, and a cutout area penetrating both the first and second surfaces. The first circuit layer is disposed on the first surface of the substrate layer. The first circuit layer includes sensing lines and vias, with the sensing lines located outside the cutout area and the vias corresponding to the cutout area. The second circuit layer is disposed on the second surface of the substrate layer and has transmission lines located at corresponding cutout areas.
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Claims

1. A sensor circuit structure, comprising: A substrate layer includes a first surface, a second surface, and a cutout area penetrating the first surface and the second surface; A first circuit layer is disposed on the first surface of the substrate layer, the first circuit layer including a sensing line and a through hole, the sensing line being located outside the cutout area and the through hole corresponding to the cutout area; and a second circuit layer is disposed on the second surface of the substrate layer, and has a transmission line located at the cutout area.

2. The sensor circuit structure as described in claim 1, wherein the cutout area is formed after removing a portion of the material corresponding to the transmission line from the substrate layer when the second circuit layer is disposed on the second surface.

3. The sensor circuit structure as described in claim 1 further includes a first skin-friendly layer covering the first circuit layer; and a second skin-friendly layer covering the second circuit layer.

4. The sensor circuit structure as described in claim 3, wherein the first skin-friendly layer and the second skin-friendly layer are composed of polydimethylsiloxane or thermoplastic polyurethane.

5. The sensor circuit structure as described in claim 1, wherein the substrate layer is a flexible insulating substrate layer.

6. The sensor circuit structure as described in claim 5, wherein the substrate layer is composed of polyimide, modified polyimide, or liquid crystal polymer.

7. The sensor circuit structure as described in claim 1, wherein the second circuit layer further includes another sensing circuit, the other sensing circuit being integrally formed with the transmission circuit.

8. The sensor circuit structure as described in claim 1, wherein the first circuit layer is formed by curing a stretchable conductive metal adhesive.