Offset Structure of Printed Circuit Board Test Fixture
Patent Information
- Application Number
- TW115207283
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-07-31
- Publication Date
- 2026-10-21
- Estimated Expiration
- 2036-07-30
Smart Images

Figure 00000000_0000_ABST
Abstract
Claims
1. A printed circuit board test fixture offset structure, mainly composed of at least three test boards: an upper test board, a middle test board, and a lower test board. The upper, middle, and lower test boards have through-holes for connection via fixing rods. Each test board also has through holes drilled according to the location of the contact points on the printed circuit board to be tested, for mounting springs and wires connected to the ends of the springs. The springs act as contacts on the printed circuit board to be tested or as test probes. The other end of the wires is connected to a horn-shaped connector to a test machine connector for signal collection. The improvement lies in that the upper, middle, and lower test boards, as the mounting springs and wires... The through holes of the wires have the same diameter. The aforementioned upper test plate, middle test plate, and lower test plate are also provided with through offset positioning holes. The offset positioning hole in the lower test plate is offset from the center of the offset positioning holes in the aforementioned upper and middle test plates by an appropriate distance. After the aforementioned spring and wire are installed, the fixing rod on the positioning hole is removed and the fixing rod is fixed to the offset positioning hole. Since the offset positioning hole in the lower test plate is offset from the center of the offset positioning holes in the aforementioned upper and middle test plates by an appropriate distance, the lower test plate can be offset by an appropriate distance as a whole, so that the through hole in the lower test plate is reduced, thereby restricting the spring located above the wire from falling.
