Offset Structure of Printed Circuit Board Test Fixture

TWM688957UActive Publication Date: 2026-10-21黄志成
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Patent Information

Application Number
TW115207283
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-07-31
Publication Date
2026-10-21
Estimated Expiration
2036-07-30

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Abstract

This invention relates to an offset structure for a printed circuit board (PCB) test fixture. The PCB test fixture mainly consists of an upper test board, a middle test board, and a lower test board. Each of the upper, middle, and lower test boards has a through-hole for connection via a fixing rod. Each of the upper, middle, and lower test boards also has through holes drilled according to the contact positions of the PCB under test, for mounting springs and wires. The other end of the wire is connected to a horn connector to the tester's cable connector for signal collection. The improvement lies in that the through holes for mounting springs and wires on the upper, middle, and lower test boards have the same diameter. Furthermore, each of the upper, middle, and lower test boards has a through-hole offset positioning hole. The offset positioning hole on the lower test board is offset from the center of the offset positioning holes on the upper and middle test boards by an appropriate distance, enabling quick and economical electrical connection to the horn connector and preventing short circuits.
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Claims

1. A printed circuit board test fixture offset structure, mainly composed of at least three test boards: an upper test board, a middle test board, and a lower test board. The upper, middle, and lower test boards have through-holes for connection via fixing rods. Each test board also has through holes drilled according to the location of the contact points on the printed circuit board to be tested, for mounting springs and wires connected to the ends of the springs. The springs act as contacts on the printed circuit board to be tested or as test probes. The other end of the wires is connected to a horn-shaped connector to a test machine connector for signal collection. The improvement lies in that the upper, middle, and lower test boards, as the mounting springs and wires... The through holes of the wires have the same diameter. The aforementioned upper test plate, middle test plate, and lower test plate are also provided with through offset positioning holes. The offset positioning hole in the lower test plate is offset from the center of the offset positioning holes in the aforementioned upper and middle test plates by an appropriate distance. After the aforementioned spring and wire are installed, the fixing rod on the positioning hole is removed and the fixing rod is fixed to the offset positioning hole. Since the offset positioning hole in the lower test plate is offset from the center of the offset positioning holes in the aforementioned upper and middle test plates by an appropriate distance, the lower test plate can be offset by an appropriate distance as a whole, so that the through hole in the lower test plate is reduced, thereby restricting the spring located above the wire from falling.