Substrate structure

Abstract

A substrate structure includes a glass substrate, and an anti-glare film solution is sprayed onto the surface of the glass substrate. The anti-glare film solution contains at least a silicon oxide and a metal oxide, wherein the refractive index of the metal oxide is greater than that of the silicon oxide. After the anti-glare film solution is sprayed onto the surface of the glass substrate, the glass substrate is baked by a heating device to form an anti-glare film on the surface of the glass substrate.

Claims

1. A substrate structure comprising: a glass substrate; and an anti-glare film layer bonded to the surface of the glass substrate, the anti-glare film layer having a refractive index of 1.55 to 2.0, and the anti-glare film layer comprising silicon oxide and a metal oxide, wherein the refractive index of the metal oxide is greater than the refractive index of the silicon oxide; wherein, An anti-reflective film is bonded to the anti-glare film layer. After the glass substrate is bonded to the anti-glare film layer and the anti-reflective film layer, the single-sided reflectivity of the substrate structure is less than 3.

2.

2. The substrate structure as claimed in claim 1, wherein the antireflective film layer is a single-layer compound or a multi-layer compound, wherein the single-layer compound is silicon oxide, and each layer of the multi-layer compound is silicon oxide or titanium oxide.

3. The substrate structure as described in claim 1, wherein the metal oxide is titanium oxide, zirconium oxide, hafnium oxide, niobium oxide, aluminum oxide, tantalum pentoxide, vanadium pentoxide, tin oxide, cerium oxide, bismuth oxide, or zinc oxide.

4. The substrate structure as described in claim 1, wherein an anti-glare film solution is sprayed onto the surface of the glass substrate, and after the anti-glare film solution is sprayed onto the surface of the glass substrate, the glass substrate is baked by a heating device to form the anti-glare film on the surface of the glass substrate.

5. The substrate structure as described in claim 4, wherein the baking temperature for baking the glass substrate is 80 to 650 degrees Celsius, and the baking time is 20 to 60 minutes.

6. The substrate structure as described in claim 4, wherein the silicon oxide and the metal oxide are stirred and heated in a container to form the anti-glare film solution, wherein the stirring time is 8 to 24 hours and the heating temperature is 30 to 80 degrees Celsius.

7. The substrate structure as described in claim 1, wherein an anti-fingerprint film layer can be bonded to the anti-reflective film layer.

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