A test socket with impedance adjustment and dielectric connectivity

Abstract

This invention discloses a test socket with impedance adjustment and dielectric connectivity for testing electronic circuit boards. The electronic circuit board has a circuit board body and a plurality of electrical points disposed on the circuit board body. The socket body includes: a through-hole test hole, which is further divided into a test section and an installation section. During testing, the electronic circuit board is placed into the test section of the test hole. The installation section is further divided into a plurality of probe channels, and there is a connecting space between adjacent probe channels, so that at least two adjacent probe channels are connected to each other through at least one connecting space to form a common dielectric space; and a plurality of probes are respectively disposed in each probe channel, and each probe makes electrical contact with each electrical point at one end when the electronic circuit board is placed in the test section; by adjusting the size of the at least one connecting space, the proportion of the common dielectric space is changed, thereby changing the effective dielectric environment around each probe and adjusting the characteristic impedance of each probe.

Claims

1. A test socket with impedance adjustment and dielectric continuity for testing an electronic board, the electronic board having a circuit board body and a plurality of electrical points disposed on the circuit board body, comprising: a socket body having a test through hole formed in the socket body, the test through hole being further divided into a test section and a mounting section, the electronic board being placed into the test section of the test through hole during testing, the mounting section being further divided into a plurality of probe channels, and adjacent probe channels having a communication space, such that at least two adjacent probe channels are connected to each other through at least one communication space to form a common dielectric space; and a plurality of probes, respectively disposed in each probe channel, each probe electrically contacting each electrical point at one end when the electronic board is placed into the test section; wherein... By adjusting the size of the at least one connected space, the proportion of the common dielectric space is changed, thereby altering the effective dielectric environment around each probe and adjusting the characteristic impedance of each probe.

2. The test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein a partition is formed between adjacent probe channels and a connectivity space is formed in each partition.

3. A test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein each connectivity space is formed at the same height position of adjacent probe channels.

4. A test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein the connectivity spaces are staggered.

5. A test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein each connectivity space has the same length, width and depth.

6. A test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein each connectivity space has a different length, width, or depth.

7. The test socket with impedance adjustment and dielectric connectivity as described in claim 1, wherein the socket body is further formed by two housings overlapping each other, and each communication space may be located in either housing or the two housings may be evenly distributed.

Images