Heat dissipation device and method for manufacturing the same

Abstract

A heat dissipation device for a heat generating element includes a fastening layer and a plurality of carbon nanotubes. The fastening layer is formed on the heat generating element. The carbon nanotubes are arranged in an array structure. The carbon nanotubes are arranged in a predetermined pattern. Ends of the carbon nanotubes are connected to the fastening layer.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure relates to heat dissipation devices and methods for manufacturing the same, particularly, to a heat dissipation device based on carbon nanotubes and a method for manufacturing the same.[0003]2. Description of Related Art[0004]Currently, it is possible to combine multiple electronic elements into an efficient module to perform complex tasks. However, electronic devices with high efficiency, such as central processing units (CPUs), will generate a great amount of heat during operation. If the heat is not dissipated efficiently, the electronic devices may become unstable or damaged. Generally, a heat sink is attached to an outer surface of a CPU to dissipate heat from the CPU. Meanwhile, miniaturization is a continuing trend in the production of electronic devices. Consequently, there is a demand for developing a heat sink that meets miniaturization requirements.[0005]A typical heat sink includes a substrate and a plurality of para...

AI Technical Summary

Benefits of technology

The patent text describes a heat dissipation device and method for manufacturing it that uses carbon nanotubes. The device is designed to efficiently dissipate heat from electronic devices that generate a lot of heat, such as central processing units (CPUs). The technical effect of the invention is to provide a heat dissipation device that is suitable for thin-type electronic devices and can meet the increasing demand for higher heat dissipation efficiency. The invention also addresses the issue of thermal conductivity in materials used in heat dissipation devices and proposes a solution to improve their performance.

Problems solved by technology

However, electronic devices with high efficiency, such as central processing units (CPUs), will generate a great amount of heat during operation.

If the heat is not dissipated efficiently, the electronic devices may become unstable or damaged.

However, the thermal conductivity of material currently used cannot meet the increasing demand.

Furthermore, the thermal interface material between the heat sink and the heat source, causes additional difficulty in production of thin-type electronic devices.

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