Substrate plasma-processing apparatus
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[0045]Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. The embodiments are described below in order to explain the present invention by referring to the figures.
[0046]FIG. 1 is a cross-sectional view of a substrate plasma-processing apparatus 100 according to an embodiment of the present invention. Referring to FIG. 1, the substrate plasma-processing apparatus 100 includes a chamber 101, a distance adjusting unit 102, a first electrode 104, a second electrode 105, and at least one flow adjusting valve 107.
[0047]The distance adjusting unit 102 is disposed in the chamber 101 to support a substrate 103 and the second electrode 105. The distance adjusting unit 102 supports the substrate 103 and the second electrode 105, raises or lowers the substrate 103 in the chamber 101, and raises or lowers the second electrod...
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