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Electroless platinum plating solution

a technology of electroless platinum and plating solution, applied in the direction of liquid/solution decomposition chemical coating, metal material coating process, coating, etc., to achieve the effect of easy dissolved in water, easy reduction, and easy reduction

Pending Publication Date: 2018-10-25
KOJIMA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The electroless platinum plating solution of the present invention has several technical effects. Firstly, it uses a water-soluble platinum compound that forms a platinum complex that is easily dissolved in water, without the need for a strong complexing agent like ethylenediamine or ammonia. This means that the platinum complex can be easily reduced, even with weak reducing agents like formalin, glucose, formic acid, or formates. Secondly, the solution does not contain any compounds that can generate ammonia gas, which makes it safer to use. Overall, this electroless platinum plating solution is stable, safe, and effective in reducing hydrogen gas production compared to conventional solutions.

Problems solved by technology

However, since hydrazine monohydrate and sodium borohydride have too strong reducing power, there are problems that platinum is deposited in the plating solutions due to reduction of the platinum complex and the reduction reaction is accompanied by generation of hydrogen.

Method used

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Examples

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Effect test

example 1

[0050][Preparation of Plating Substrate]

[0051]First, a nickel film having a thickness of 3 μm was formed on a copper plate by electrolytic plating processing. Then, a plating substrate was prepared by forming a platinum film (electrolytic platinum film) having a thickness of 0.1 μm on the surface of the nickel film by electrolytic plating processing.

[0052][Preparation of Electroless Platinum Plating Solution]

[0053]In this Example, 0.005 mol / L of dichlorotetraammineplatinum (II) (1.0 g / L in terms of platinum) as a water-soluble platinum compound, 0.5 mol / L of sodium formate as a reducing agent, and 0.1 mol / L of malic acid as an complexing agent were dissolved in water to prepare an electroless platinum plating solution. Next, the pH (at a temperature of 25° C.) of the electroless platinum plating solution was adjusted to 7.0 by using sodium hydroxide and sulfuric acid as pH adjusting agents.

[0054][Electroless Plating Processing]

[0055]The resulting electroless platinum plating solutio...

example 2

[0060]In this example, the electroless platinum plating solution was prepared in exactly the same manner as in Example 1 except that the pH (at a temperature of 25° C.) was adjusted to 11.0.

[0061]The resulting electroless platinum plating solution was warmed to a temperature of 70° C., the plating substrate having the electrolytic platinum film thereon was subjected to electroless plating processing by immersing it in the electroless platinum plating solution for 60 minutes to form an electroless platinum film having a thickness of 0.5 μm on the electrolytic platinum film. The resulting electroless platinum film was visually observed to have a white glossy appearance. In addition, the surface of the resulting electroless platinum film was observed with a SEM at a magnification of 30,000 times. As shown in FIG. 3, the particle size of the platinum particles was small, and the electroless platinum film has a smooth surface shape.

[0062]Then, the resulting electroless platinum plating s...

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Abstract

Provided is an electroless platinum plating solution that can exhibit solution stability without the use of heavy metal ions or thiol compounds and can prevent the generation of ammonia gas. The electroless platinum plating solution is characterized by comprising a water-soluble platinum compound, and one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates. The water-soluble platinum compound is preferably one or more water-soluble platinum compounds selected from the group consisting of platinous chloride (II), hydrogen tetrachloroplatinate (II), tetrachloroplatinate (II), platinic chloride (IV), hydrogen hexachloroplatinate (IV), hexachloroplatinate (IV), hydrogen hexahydroxoplatinate (IV), hexahydroxoplatinate (IV) and dichlorotetraammineplatinum (II). The electroless platinum plating solution preferably comprises an organic acid.

Description

TECHNICAL FIELD[0001]The present invention relates to an electroless platinum plating solution.BACKGROUND ART[0002]Some electroless platinum plating solutions conventionally known contain dinitrodiammineplatinum or dinitrotetraammineplatinum as a platinum salt, ethylenediamine or ammonia as a complexing agent, and hydrazine monohydrate or sodium borohydride as a reducing agent (See, for example, Patent Literatures 1 to 4).[0003]Dinitrodiammineplatinum and dinitrotetraammineplatinum are poorly soluble in water. Therefore, they are dissolved in water by adding ethylenediamine or ammonia as a complexing agent to electroless platinum plating solutions containing them to form platinum complexes coordinated with ethylenediamine or ammonia.[0004]Generally, addition of reducing agents to electroless platinum plating solutions can reduce metal ions or metal complexes on the surface of a plating substrate to deposit metals thereon. Since the platinum complexes coordinated with ethylenediamine...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor KATO, TOMOHITOWATANABE, HIDETO
Owner KOJIMA CHEM CO LTD
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