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Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrate and Method of Processing the Same

a flexible printed circuit and multi-layer technology, applied in the direction of printed circuit aspects, printed circuit electric connection formation, printed circuit manufacturing, etc., can solve the problems of high laser energy consumption, low drilling efficiency, and deformation of the fpc substrate in a high drilling temperature, and achieve the effect of increasing the thickness of the body

Active Publication Date: 2022-08-25
APLUS SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a way to make a double-sided and multilayer FPC (flexible printed circuit) substrate that can reduce processing costs by eliminating one of its metal layers. The method also allows for precise drilling, low-energy laser drilling, and avoids dust adhesion on the substrate. Additionally, the method includes steps to increase the thickness of the substrate and create multiple conductive portions, locate copper circuit layers on both the top and bottom of the substrate, and connect them using the copper circuit layers. Overall, this invention provides a more efficient and precise method for making double-sided and multilayer FPC substrates.

Problems solved by technology

However, it has higher purchase cost of the FPC substrates and copper foils than insulated substrates.
In addition, a copper layer is covered on the copper foil of the FPC substrate, and drilling the multiple vertical vias will consume high laser energy, thus causing low drilling efficiency, deformation of FPC substrate in a high drilling temperature, and error.

Method used

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  • Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrate and Method of Processing the Same
  • Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrate and Method of Processing the Same

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first embodiment

[0030]With reference to FIG. 1, a double-sided and multilayer flexible printed circuit (FPC) substrate according to the present invention comprises:

[0031]a body 10 through which multiple tilted vias 11 pass, wherein a vertical cross section of a respective tilted via 11 is obliquely columnar, an orthographic projection of a top opening 12 of the respective tilted via 11 does not intersect with an orthographic projection of a bottom opening 13 of the respective tilted via 11, a straight distance between the orthographic projection of the top opening 12 and the orthographic projection of the bottom opening 13 is not greater than a longest chordal distance of the orthographic projection of the top opening 12, and the body 10 is a polyimide (PI) film;

[0032]a sputtering layer 1 adhered on the body 10 and the multiple tilted vias 11;

[0033]multiple conductive portions (not shown), wherein a respective conductive portion (not shown) is formed in the respective titled via 11 and connected wi...

second embodiment

[0037]Referring to FIG. 2, a difference of a double-sided and multilayer flexible printed circuit (FPC) substrate of the present invention from that of the first embodiment comprises:

[0038]a periphery of the orthographic projection of the top opening 12 of the respective tilted via 11 being tangent with a periphery of the orthographic projection of the bottom opening 13 of the respective tilted via 11.

[0039]When the periphery of the orthographic projection of the top opening 12 of the respective tilted via 11 is tangent with the periphery of the orthographic projection of the bottom opening 13 of the respective tilted via 11, the sputter ions are not sputtered on the roller from the respective tilted via but are sputtered on the inner wall of the respective tilted via completely.

[0040]A method of processing the double-sided and multiple layer FPC substrate according to the present invention comprises steps of:[0041]S1) forming the multiple tilted vias on the body 10, wherein the res...

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Abstract

A double-sided and multilayer flexible printed circuit (FPC) substrate contains: a body, multiple tilted vias passing through the body, a sputtering layer, multiple conductive portions, and multiple copper circuit layers. The sputtering layer is adhered on the body and the multiple tilted vias. A respective conductive portion is formed in a respective titled via and is connected with the sputtering layer. The multiple copper circuit layers are located on a top and a bottom of the body and are connected with the sputtering layer, and the multiple copper circuit layers are connected via the multiple conductive portions.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a technology of processing a substrate, and more particularly to a double-sided and multilayer FPC substrate and a method of processing the same.BACKGROUND OF THE INVENTION[0002]A flexible printed circuit (FPC) is made of polyimide or polyester film to have a high reliability and flexibility, and the FPC has high wiring density, compact weight, and thin thickness.[0003]Chip On Flex (COF) or Chip On Film (COF) is applied to fix a drive integrated circuit (IC) on a chip of a flexible circuit board, wherein a substrate is flexible and is configured to carry and adhere the chips with the flexible circuit board, and the COF is capable of obtaining high accuracy of FPC.[0004]Conventional methods of making a double-sided and multilayer FPC substrate contains:[0005]1. A modified-semi-additive process (mSAP) having steps of drilling conductive vias, cleaning vias, shadowing, press molding, exposing, projecting, copper electroplatin...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/11H05K1/03H05K3/42
CPCH05K1/118H05K1/0393H05K1/115H05K3/429H05K2201/09854H05K2201/09836H05K2201/0154
Inventor TSAI, SUI-HOCHEN, CHENG-NENGWANG, YUN-NANCHAO, CHIH-YUANLU, HSUEH-TSUNG
Owner APLUS SEMICON TECH CO LTD