Wiring board, wiring board manufacturing methods, and wiring board assembly
VN10059338BActive Publication Date: 2026-07-15NITTO DENKO CORP
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Patent Information
- Application Number
- VN1202100621
- Authority / Receiving Office
- VN · VN
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2019-07-12
- Publication Date
- 2026-07-15
- Estimated Expiration
- 2039-07-12
Abstract
The invention relates to a method of producing a wire-connected circuit board including the first step of preparing the wire-connected circuit board assembly (1) including the support plate (2), the wire-connected circuit boards (3) supported by the support plate, and the joint (4) connecting the support plate to the thick wire-connected circuit boards, having one flat surface and the other surface (22) facing a surface (21) at equal distances along the thickness, and has a thin part in the red surface, the other side is concave towards one surface and the second step creates a rough edge (28) protruding towards the other side along the thickness and thin section.
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