Semiconductor packages and methods for fabricating thermal-minimizing structures in semiconductor packages

Abstract

The invention relates to a semiconductor package, comprising a first integrated passive device (IPD) in a first interlayer-dielectric (ILD) layer on top of the first ILD layer. The semiconductor package also includes a second ILD layer on top of the first ILD layer. The semiconductor package also includes a second IPD in a third ILD layer on top of the second ILD layer. The semiconductor package also includes a thermal damping structure on the sensing elements of the second IPD. The invention also describes a method for masking structures that minimize heat transfer in semiconductor packages.