Packaging and packaging manufacturing methods

Abstract

The invention relates to the package and the method of package fabrication. Examples here include die connections with metallized structures that eliminate solder joints, reducing resistance and interference on the connection. In one example, the first die is attached to the metallized layer by multiple copper connections, and the second die is attached to the metallized layer opposite the first die through multiple other copper connections. According to this example, copper connections can connect molds corresponding to the metallized structure in the metallized layer.