INTEGRATED CIRCUITS AND METHODS FOR CREATING INTEGRATED CIRCUITS

Abstract

The invention relates to an integrated circuit and a method for constructing an integrated circuit. Systems and methods for encapsulating an audio device in an integrated circuit (IC) consist of partitions formed on the substrate. The partitions are of a height that is less than the intended height of the solder joint on the audio device after soldering. The partitions are placed on one of the sides of the audio device and the small part is located under the outer edge of the audio device such that a relatively small gap is created between the top surface of the partition and the bottom surface of the audio device. By creating a small gap between the partition and the audio device, the encapsulation of the encapsulation material into the orange area of ​​the audio device is minimized.