ANTENNA COMPONENTS, PACKAGING, BASE LAYER, AND ANTENNA MANUFACTURING METHODS

Abstract

The substrate consists of at least one dielectric layer, multiple bonds, and a curved antenna coupled to the substrate surface. The curved antenna is bent relative to the substrate surface so that at least part of the curved antenna is offset from the substrate surface. The substrate includes the dielectric layer of the first antenna coupled to the substrate surface, the grounding bond of the antenna coupled to the dielectric layer of the first antenna, and the dielectric layer of the second antenna coupled to the grounding bond of the antenna. The grounding bond of the antenna is configured for grounding. The curved antenna is coupled to the dielectric layer of the second antenna. The invention also relates to the antenna components, package, and method of antenna fabrication.