PHOTOSENSITIVE PLASTICS AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Abstract

The invention proposes a photosensitive resin formulation that, even when adjusted to low viscosity, still achieves good washability and edge coverage properties on printed circuit boards during the coating process. The photosensitive resin composition according to the invention contains a resin containing a carboxyl group, a thermosetting resin, a photosensitive monomer, and an organic solvent, and is characterized by the fact that, assuming the viscosity of the photosensitive resin composition at 25°C is Λ (dPas), and the specific resistance value according to volume of the photosensitive resin composition at 25°C is B (Míì), and when the viscosity of the photosensitive resin composition is adjusted to Ai = 5.0 (dPas) and Ai = 1.5 (dPas) using propylene glycol monomethyl ether, the specific resistance value according to volume B1 (MΏ) given by I*a ó'Λ1 and the specific resistance value according to volume Bi (Míi) given at Aj satisfy the following formula: 1.4 < (Λt “ Aa) / (B1 - Ba) < 40.