PACKAGING, COMPONENTS AND PACKAGING MANUFACTURING METHODS

Abstract

The invention relates to a package comprising a substrate, integrated components, and integrated component linkages. The substrate includes a first surface and a second surface. The substrate also includes multiple linkages—integrated components are coupled to the substrate, and integrated components are coupled to the surface of the substrate. The integrated components, integrated components linkages, and substrate are configured to provide an electrical path for the integrated component's signal, passing through at least the substrate, then through the integrated components linkages, and back through the substrate. The invention also relates to the components and methods for constructing the package.