ELECTRONIC DEVICES

Abstract

The invention relates to an electronic device comprising: a housing, a non-conductive support structure arranged within the housing, a support structure comprising a first region, a second region positioned at a distance from the first region, and a third region connecting the first and second regions, a conductive structure arranged above the first region of the support structure, a heat dissipation structure which at least part is arranged to overlap the conductive structure, and an antenna comprising a circuit board, a conductive part, and a ground part. The conductive part of the antenna may be arranged above the second region, the heat dissipation structure may be made to extend from the first to the third region, and the antenna band may be made to extend from the second to the third region to be arranged in contact with at least part of the heat dissipation structure.