Optical detector arrangement and sensor arrangement

A dual-detector system with distinct spectral sensitivities addresses the sensitivity gaps in existing detectors, enhancing detection capabilities from visible light to shortwave infrared for diverse applications including material analysis and fruit ripeness.

WO2026119561A1PCT designated stage Publication Date: 2026-06-11AMS SENSORS GERMANY GMBH

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
AMS SENSORS GERMANY GMBH
Filing Date
2025-11-18
Publication Date
2026-06-11

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Abstract

An optical detector arrangement (10) is specified, said optical detector arrangement (10) comprising - a first detector device (1) which is configured to detect first electromagnetic radiation (3) in the range of visible light and near infrared radiation, and - a second detector device (2) which is configured to detect second electromagnetic radiation (4) in the range of near infrared radiation and shortwave infrared radiation. Further, a sensor arrangement is specified.
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Description

[0001] 2024PF01048 November 18 , 2025

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[0003] - 1 -

[0004] Description

[0005] OPTICAL DETECTOR ARRANGEMENT AND SENSOR ARRANGEMENT

[0006] An optical detector arrangement is speci fied . Further, a sensor arrangement is speci fied .

[0007] Document US 2022 / 0221341 Al describes a detector device .

[0008] One obj ect to be achieved is to speci fy an optical detector arrangement which is particularly compact in design and which can be used for a large number of applications .

[0009] A further obj ect is to speci fy a sensor arrangement comprising such an optical detector arrangement .

[0010] The optical detector arrangement described herein is particularly well suited for use in the sensor arrangement also described herein . All features disclosed with respect to the optical detector arrangement are likewise applicable to the sensor arrangement and disclosed for the sensor arrangement .

[0011] According to an aspect of the optical detector arrangement , the optical detector arrangement comprises a first detector device which is configured to detect first electromagnetic radiation in the range of visible light and near infrared radiation .

[0012] This means that the first detector device has a basic sensitivity for visible light (VIS ) and near infrared radiation (NIR) . For example , the first detector device is configured to detect electromagnetic radiation for 2024PF01048 November 18 , 2025

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[0014] - 2 - wavelengths of at least 300 nm, for example 350 nm to at most 1100 nm, for example 1000 nm .

[0015] According to at least one aspect of the optical detector arrangement , the optical detector arrangement comprises a second detector device which is configured to detect second electromagnetic radiation in the range of near infrared radiation and shortwave infrared radiation ( SWIR) . For example , the second detector device is configured to detect electromagnetic radiation in the wavelength range of at least 1000 nm to 2400 nm, for example 1600 nm .

[0016] According to at least one aspect of the optical detector arrangement , the optical detector arrangement comprises a first detector device which is configured to detect first electromagnetic radiation in the range of visible light and near infrared radiation and a second detector device which is configured to detect second electromagnetic radiation in the range of near infrared radiation and shortwave infrared radiation .

[0017] The optical detector arrangement described herein relies inter alia on the following considerations .

[0018] For analytic and material detection needs , an enhanced spectral range up to the wavelengths of shortwave infrared radiation would be desirable . For example , in order to detect material characteristics , detection of near infrared radiation is desirable as these characteristics start at a wavelength of about 800 nm . On the one hand, the sensitivity of detector devices which are configured to detect electromagnetic radiation in the range of visible light and near infrared radiation which are based on Si shows a 2024PF01048 November 18 , 2025

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[0020] - 3 - sensitivity drop in this wavelength region . On the other hand, such detector devices are very useful , e . g . for detecting the colour of an obj ect .

[0021] Therefore , one idea of the optical detector described herein is to provide an optical detector which also has a basic sensitivity for electromagnetic radiation in the range of shortwave infrared radiation .

[0022] For this , in an optical detector arrangement described herein, two detector devices can be used for which the sensitivity overlaps in the range of near infrared radiation . By this overlap, the sensitivity for near infrared radiation is enhanced, as both detector devices detect radiation from this wavelength range .

[0023] Further, the overall spectral range is enlarged by combining these two detector devices . With such an optical detector arrangement it is possible , for example , to reali ze complex material detection . Further, such an optical detector arrangement can be used, for example , to detect the ripeness of fruits or plants , plant diseases , material defects and so on, inter alia by detecting the colour of obj ects . As a result , one and the same optical detector arrangement can be used for a large number of applications , and the sensitivities of the two detector devices can be combined to create new applications .

[0024] According to one aspect of the optical detector arrangement , the first detector device comprises a plurality of first detector elements and a plurality of first optical filters , wherein each first optical filter is arranged on one of the 2024PF01048 November 18, 2025

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[0026] 4 first detector elements and different first optical filters have different frequency responses.

[0027] For example, the first detector device comprises three or more first detector elements. Each detector element is, for example, given by a photodiode which has a basic sensitivity for the first electromagnetic radiation.

[0028] Each of the first detector elements has a radiation entrance surface through which electromagnetic radiation enters the first detector element.

[0029] A first optical filter can be arranged on top of the radiation entrance surface of each first detector element. In this case each of the first optical filters has a frequency response which is different from the other first optical filters. In this case the frequency response of each filter specifies how the magnitude and phase of each frequency component of the incoming first electromagnetic radiation is modified by the filter.

[0030] For example, the first optical filters are formed directly on each first detector element, or the first optical filters are arranged on radiation-permeable carriers, like for example glass platelets, which are then arranged on the first detector elements.

[0031] For example, the first optical filters can be absorption filters, interference filters, and / or Fabry-Perot filters. For example, interference filters can be formed to have a Gaussian sensitivity with a full width half minimum between at least 5% and at most 25% of the peak wavelength. Fabry- 2024PF01048 November 18 , 2025

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[0033] 5

[0034] Perot filters can, for example , be formed with a full width hal f maximum of less than 5% of the peak wavelength .

[0035] For the first detector device , it is further possible that the plurality of first detector elements is arranged as an array where the first detector elements can be arranged at the nodes of a regular lattice . Further, the first detector elements can be arranged on a common carrier, for example a circuit board .

[0036] According to one aspect of the optical detector arrangement , the second detector device comprises a plurality of second detector elements and a plurality of second optical filters , wherein each optical filter is arranged on one of the detector elements and di f ferent second optical filters have di f ferent frequency responses .

[0037] For example , the second detector device comprises three or more second detector elements . Each detector element is , for example , given by a photodiode which has a basic sensitivity for the second electromagnetic radiation .

[0038] Each of the second detector elements has a radiation entrance surface through which electromagnetic radiation enters the second detector element .

[0039] A second optical filter can be arranged on top of the radiation entrance surface of each second detector element . In this case each of the second optical filters has a frequency response which is di f ferent from the other second optical filters . In this case the frequency response of each filter speci fies how the magnitude and phase of each 2024PF01048 November 18 , 2025

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[0041] 6 frequency component of the incoming second electromagnetic radiation is modi fied by the filter .

[0042] For example , the second optical filters are formed directly on each second detector element , or the second optical filters are arranged on radiation-permeable carriers , like for example glass platelets , which are then arranged on the second detector elements .

[0043] For example , the second optical filters can be absorption filters , interference filters , and / or Fabry-Perot filters . For example , interference filters can be formed to have a Gaussian sensitivity with a full width hal f minimum between at least 5% and at most 25% of the peak wavelength . Fabry- Perot filters can, for example , be formed with a full width hal f maximum of less than 5% of the peak wavelength .

[0044] For the second detector device , it is further possible that the plurality of second detector elements is arranged as an array where the second detector elements can be arranged at the nodes of a regular lattice . Further, the second detector elements can be arranged on a common carrier, for example a circuit board .

[0045] According to at least one aspect of the optical detector arrangement , the optical detector arrangement comprises a housing with a first cavity in which the first detector device is arranged and a second cavity in which the second detector device is arranged .

[0046] For example , the housing is formed with a material which is not permeable to the first and the second electromagnetic radiation . With such a housing, it is possible to let only 2024PF01048 November 18 , 2025

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[0048] - 7 - the radiation entrance side of each detector device be radiated with electromagnetic radiation .

[0049] For example , the housing is absorbing or reflecting for the first and the second electromagnetic radiation . The housing can be formed, for example , with an electrically insulating material , for example a plastic material . Further, the housing can be arranged on a carrier, for example a circuit board, and / or means for electrically connecting the first and the second detector device that are integrated into the housing .

[0050] The housing has a first and a second cavity in which the respective detector devices are arranged . A part of the housing can be arranged between the cavities .

[0051] For example , the cavity is larger than the detector device arranged therein, and sidewalls of the housing forming the cavity are spaced apart from the detector device in this cavity . For such a housing it is possible to arrange the detector devices in the housing after the housing has been formed .

[0052] Alternatively, it is possible that sidewalls of the housing which form the cavity are in direct contact with the detector devices . In this case , the housing is formed, for example , by molding the detector devices with the material which forms the housing .

[0053] According to at least one aspect of the optical detector arrangement , the first detector device and the second detector device are optically separated from each other . For example , the optical separation of the two detector devices 2024PF01048 November 18 , 2025

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[0055] - 8 - is accomplished by a part of the housing which is arranged between the two devices .

[0056] For example , the cavities in which the first and second detector devices can be arranged are next to each other and separated by a part of the housing in which the cavities are formed . With such an optical separation, it is possible , for example , that the signals in the overlapping region of the sensitivity of the two detector devices can be separated in order to gain spatial information about the target which is detected .

[0057] According to at least one aspect of the optical detector arrangement , the first detector device and the second detector device are operable independently from each other . This means that the detector devices can be operated at the same time or at di f ferent times . This makes it possible , for example , to only operate one of the detector devices in the case that only information from one of the sensitivities of the detector devices is needed .

[0058] According to at least one aspect of the optical detector arrangement , the first detector device is based on Si . This means that the first detector elements are formed with Si as a semiconductor base material . Such detector elements are particularly sensitive in the region of visible light and near infrared radiation .

[0059] According to at least one aspect of the optical detector arrangement , the second detector device is based on InGaAs . This means that the second detector elements of the second detector device are formed with InGaAs as a semiconductor base material . Such detector elements are particularly 2024PF01048 November 18 , 2025

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[0061] - 9 - sensitive in the region of near infrared radiation and shortwave infrared radiation .

[0062] According to at least one aspect of the optical detector arrangement , each of the first and second detector devices comprises a plurality of separate spectral channel sensitivities . For example , each of the first and second detector elements has the basic sensitivity of the corresponding photodiode which forms the detector element . By applying di f ferent first and second filter elements to the first and second detector elements , the sensitivity of each combination of detector element and filter element is restricted to a separate spectral channel sensitivity .

[0063] For example , the filter elements can then be designed in such a way that the spectral channel sensitivities are arranged equidistant from each other . For example , each spectral channel sensitivity has a peak wavelength, and the peak wavelengths of the separate spectral channel sensitivities are arranged equidistant from each other with respect to the wavelength .

[0064] Further, it is possible to adj ust certain peak wavelengths to spectral material characteristics which are to be detected by means of the optical detector arrangement . Moreover, it is possible to not only influence the peak wavelengths of each spectral channel sensitivity but also the shape of the peak using the optical filters .

[0065] Further, a sensor arrangement is speci fied .

[0066] According to at least one aspect of the sensor arrangement , the sensor arrangement comprises an optical detector 2024PF01048 November 18 , 2025

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[0068] 10 arrangement . In particular, it is possible that the sensor arrangement comprises at least one optical detector arrangement as described herein . This means that all features described for the optical detector arrangement are also disclosed for the sensor arrangement and vice versa .

[0069] According to at least one aspect of the sensor arrangement , the sensor arrangement comprises at least one electromagnetic radiation source . The electromagnetic radiation source is configured to produce electromagnetic radiation during operation of the sensor arrangement . It is possible in particular that the sensor arrangement comprises two or more electromagnetic radiation sources . In this case , the di f ferent electromagnetic radiation sources can be configured to emit electromagnetic radiation of di f ferent spectral ranges .

[0070] According to at least aspect of the sensor arrangement , the at least one electromagnetic radiation source is configured to irradiate a target with electromagnetic radiation . For example , the target is an obj ect which is arranged at a distance from the electromagnetic radiation source and the at least one optical detector arrangement . The sensor arrangement is then configured to perform a detection on the target , for example to detect certain material characteristics of the target .

[0071] According to at least one aspect of the sensor arrangement , the at least one optical detector arrangement is configured to detect electromagnetic radiation emitted and / or reflected by the target . The electromagnetic radiation which is produced by the at least one radiation source and which irradiates the target , is partly absorbed, partly 2024PF01048 November 18 , 2025

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[0073] - 11 - transmitted, partly reemitted, and / or partly reflected by the target in the direction of the at least one optical detector arrangement .

[0074] According to at least one aspect of the sensor arrangement , the sensor arrangement comprises at least one optical detector arrangement and at least one electromagnetic radiation source , wherein the at least one electromagnetic radiation source is configured to irradiate a target with electromagnetic radiation, and the at least one optical detector arrangement is configured to detect electromagnetic radiation emitted and / or reflected by the target .

[0075] According to at least one aspect of the sensor arrangement , the at least one electromagnetic radiation source comprises at least one filament light bulb and / or at least one lightemitting diode . With a filament light bulb, in particular a miniature filament light bulb, it is possible to emit electromagnetic radiation in a wide spectral range . Such a filament light bulb can, for example , be operated in a continuous mode where an electromagnetic spectrum with a fixed correlated color temperature is produced . In the case that the sensor arrangement comprises at least one lightemitting diode as an electromagnetic radiation source , the sensor arrangement comprises in particular a plurality of such light-emitting diodes in order to produce electromagnetic radiation with a wanted spectrum .

[0076] According to at least one aspect of the sensor arrangement , the sensor arrangement further comprises a further housing in which the at least one optical detector arrangement is arranged and which comprises an aperture and which is configured to be in direct contact with the target in the 2024PF01048 November 18 , 2025

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[0078] - 12 - region of the aperture . For example , in this case the at least one electromagnetic radiation source is also arranged in the further housing, and electromagnetic radiation leaves and enters the housing through the aperture .

[0079] Here , optics , for example tube or collimating optics , can be arranged in the aperture . With such a sensor arrangement , where the components are arranged in a further housing which comprises an aperture , the field of view of the sensor arrangement can be designed according to the requirements .

[0080] Further, a sensor arrangement which allows for contactless measurement is possible . Here , for example tube and / or collimating optics can be integrated into an aperture of the housing of the optical detector arrangement . Further, the sensor arrangement can comprise an integrated signal converter and / or a processing unit for processing the signals received from the at least one optical detector arrangement .

[0081] In the following, the optical detector arrangement and the sensor arrangement described herein are described in more detail with respect to embodiments and figures . Advantageous embodiments and developments of the optical detector arrangement and the sensor arrangement will become apparent from the exemplary embodiments described below in association with the figures .

[0082] In the figures :

[0083] Figure 1 shows a schematic sectional view of an embodiment of an optical detector arrangement described herein . 2024PF01048 November 18 , 2025

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[0085] - 13 -

[0086] Figure 2 shows a schematic top view of an embodiment of an optical detector arrangement described herein .

[0087] Figure 3 shows a graphical representation to explain in more detail an embodiment of an optical detector arrangement described herein and an embodiment of a sensor arrangement described herein .

[0088] Figure 4 shows a schematic sectional view of an embodiment of an optical detector arrangement described herein .

[0089] Figure 5 shows a schematic sectional view of an embodiment of a sensor arrangement described herein .

[0090] Figure 6 shows a schematic sectional view of a sensor arrangement described herein .

[0091] In the exemplary embodiments and figures , similar or similarly acting constituent parts are provided with the same reference symbols . The elements illustrated in the figures and their si ze relationships among one another should not be regarded as true to scale . Rather, individual elements may be represented in an exaggerated si ze for the sake of better representability and / or for the sake of better understanding .

[0092] Figure 1 shows a schematic sectional view of an embodiment of an optical detector arrangement described herein . The optical detector arrangement comprises a first detector device 1 which is configured to detect first electromagnetic radiation 3 in the range of visible light and near infrared radiation .

[0093] Further, the optical detector arrangement 10 comprises a second detector device 2 which is configured to detect second 2024PF01048 November 18 , 2025

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[0095] 14 electromagnetic radiation 4 in the range of near infrared radiation and shortwave infrared radiation .

[0096] The first detector device 1 comprises a plurality of first detector elements 11 , which are photodetector chips , for example . The first detector elements 11 are , for example , based on Si . The first detector elements then have a first base sensitivity 31 in the range of visible light and near infrared radiation ( also see Figure 3 , where the sensitivity S is shown for di f ferent wavelengths X) .

[0097] Further, the first detector device 1 comprises a plurality of first optical filters 12 , wherein each first optical filter 12 is arranged on one of the first detector elements 11 and di f ferent first optical filters 12 have di f ferent frequency responses . For the plurality of first detector devices , this leads to a plurality of separate spectral channel sensitivities 33 , see Figure 3 .

[0098] In this case the design of the first filter elements 12 , like for example the number of channels , the peak wavelength of each channel and the FWHM for each channel , can be designed according to the desired application . For example , the peak wavelengths can be equidistant to each other .

[0099] Further, the first filter elements can be arranged directly on each first detector device , or all filters of the plurality of first filter elements are processed on a common carrier, which can be formed with a glass , for example .

[0100] The optical detector arrangement 10 further comprises a second detector device 2 which comprises a plurality of second detector elements 21 . The second detector elements 2024PF01048 November 18 , 2025

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[0102] 15 are , for example , based on InGaAs . Thus , the second detector elements have a second base sensitivity 32 in the range of near infrared radiation to shortwave infrared radiation .

[0103] Further, the second detector device 2 comprises a plurality of second optical filters 22 , wherein each second optical filter 22 is arranged on one of the second detector elements 21 and di f ferent second optical filters 22 have di f ferent frequency responses . In this way, the second detector device comprises a plurality of separate spectral channel sensitivities 33 .

[0104] As can also be seen from Figure 3 , for example , the base sensitivities 31 and 32 overlap in the spectral range of near infrared radiation . As a result , the combined sensitivity of the sensor arrangement in this spectral range is enhanced with respect to the base sensitivities 31 and 32 .

[0105] In the embodiment of Figure 1 , the first detector elements 11 are arranged on a common carrier, and the second detector elements 22 are also arranged on a common carrier . Further, the optical detector element may comprise an integrated signal converting and processing unit which enables , for example , the simultaneous readout of all channels .

[0106] In this case , it is possible that the first detector device and the second detector device are operable independently from each other .

[0107] In the embodiment of Figure 1 , the optical detector arrangement further comprises a housing 5 with a first cavity 51 in which the first detector device 1 is arranged and a second cavity 52 in which the second detector device 2 is 2024PF01048 November 18 , 2025

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[0109] 16 arranged . A part of the housing is arranged between the two detector devices 1 , 2 , thus optically separating the two detector devices from each other . Further, both detector devices 1 , 2 are arranged on a common carrier 6 which can be , for example , a circuit board for contacting the detector devices .

[0110] Further, the housing 5 has an optical window or a lid aperture so that the arrangement has the same or a similar field of view for both detector devices 1 , 2 .

[0111] Figure 2 shows a schematic top view of an embodiment of an optical detector arrangement described herein . From Figure 2 it can be seen that the first and second detector elements 11 , 21 and their corresponding first and second optical filters 12 , 22 can be arranged on the nodes of a regular lattice , for example in the shape of an area as shown in Figure 2 .

[0112] Figure 3 shows a graphical representation of the sensitivity S and the irradiance I for di f ferent wavelengths . As can be seen, the first sensitivity 31 and the second sensitivity 32 overlap in the region of near infrared radiation, and the sensitivity S of the optical detector arrangement spans a wide range from visible light to shortwave infrared radiation .

[0113] With this , the optical detector arrangement described herein of fers a compact solution that combines multispectral detection over a wide spectral range in a single device .

[0114] The optical detector arrangement described herein enables signal processing for spectral reconstruction or speci fic 2024PF01048 November 18 , 2025

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[0116] - 17 - material detection due to the detection of certain peak positions .

[0117] With such an optical detector, color and material measurement can be combined, which makes it eligible for a wide range of applications .

[0118] Moreover, with such an optical detector arrangement , analytics like for example moisture quanti fication or f abric / plastic identi fication are possible .

[0119] Further, such a device can be used in robotics , for example in vacuum cleaners and other automation applications .

[0120] The schematic sectional view of Figure 4 shows a further embodiment of an optical detector arrangement 10 described herein . In this embodiment , the housing 5 is formed by a molding material which molds the first detector device and the second detector device .

[0121] At the radiation entrance sides of both detector devices 1 , 2 a window layer 7 , which may comprise an optical element for example , may be present and also molded into the housing material 5 .

[0122] In connection with Figure 5 , a schematic sectional view of an embodiment of a sensor arrangement described herein is described in more detail .

[0123] The sensor arrangement comprises an optical detector arrangement 10 as described herein, for example as shown in Figures 1 , 2 or 4 . Further, the sensor arrangement comprises 2024PF01048 November 18 , 2025

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[0125] 18 electromagnetic radiation sources 60 which are configured to irradiate a target 70 with electromagnetic radiation .

[0126] The optical detector arrangement 10 is configured to detect electromagnetic radiation emitted and / or reflected by the target 70 . For example , the sensor arrangement comprises two radiation sources which are formed by miniature filament bulbs , wherein optics 61 can be used to collimate the electromagnetic radiation on the target 70 .

[0127] According to the embodiment of Figure 5 , the sensor arrangement comprises a further housing 80 in which the optical detector arrangement 10 and the light sources 60 are arranged and which comprises an aperture 81 . In this case , the housing is configured to be in direct contact with the target 70 in the region of the aperture 81 .

[0128] Figure 3 shows the irradiance I of such light sources 60 , which is , for example , in the visible range of ? white light with a color temperature of 4000 Kelvin . The aperture 81 limits the field of view of the sensor arrangement in order to only receive radiation reflected or reemitted by the target 70 .

[0129] Figure 6 shows a schematic sectional view of a further embodiment of a sensor arrangement described herein . In contrast to Figure 5 , it represents a non-contact measurement of the target 70 . For this , tube or collimating optics can be arranged in the housing 5 of the optical detector arrangement 10 . 2024PF01048 November 18 , 2025

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[0131] 19

[0132] This patent application claims the priority of German patent application 102024135834 . 3 , the disclosure content of which is hereby incorporated by reference . The invention is not restricted to the exemplary embodiments by the description on the basis of said exemplary embodiments . Rather, the invention encompasses any new feature and also any combination of features , which in particular comprises any combination of features in the patent claims and any combination of features in the exemplary embodiments , even i f this feature or this combination itsel f is not explicitly speci fied in the patent claims or exemplary embodiments .

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[0135] 20

[0136] References

[0137] 1 first detector device

[0138] 2 second detector device

[0139] 3 first electromagnetic radiation

[0140] 4 second electromagnetic radiation

[0141] 5 housing

[0142] 6 carrier

[0143] 7 window layer

[0144] 10 optical detector arrangement

[0145] 11 first detector element

[0146] 12 first optical filter

[0147] 21 second detector element

[0148] 22 second optical filter

[0149] 31 first sensitivity

[0150] 32 second sensitivity

[0151] 33 channel sensitivity

[0152] 51 first cavity

[0153] 52 second cavity

[0154] 60 electromagnetic radiation source

[0155] 61 optics

[0156] 70 target

[0157] 80 further housing

[0158] 81 aperture

Claims

2024PF01048 November 18, 2025P2024, 0922 WO N- 21 -Claims1. Sensor arrangement comprising- at least one optical detector arrangement (10) comprising- a first detector device (1) which is configured to detect first electromagnetic radiation (3) in the range of visible light and near infrared radiation,- a second detector device (2) which is configured to detect second electromagnetic radiation (4) in the range of near infrared radiation and shortwave infrared radiation, and- at least one electromagnetic radiation source (60) , wherein- the first detector device (1) comprises a plurality of first detector elements (11) and a plurality of first optical filters (12) , wherein each first optical filter (12) is arranged on one of the first detector elements (11) and different first optical filters (12) have different frequency responses and / or the second detector device (2) comprises a plurality of second detector elements (21) and a plurality of second optical filters (22) , wherein each second optical filter (22) is arranged on one of the second detector elements (21) and different second optical filters (22) have different frequency responses,- the at least one electromagnetic radiation source (60) is configured to irradiate a target (70) with electromagnetic radiation, and- the at least one optical detector arrangement (10) is configured to detect electromagnetic radiation emitted and / or reflected by the target (70) , and- the at least one electromagnetic radiation source (60) comprises at least one filament light bulb and / or at least one light-emitting diode.2024PF01048 November 18, 2025P2024, 0922 WO N- 22 -2. Sensor arrangement according to at least one of the previous claims, further comprising a housing (5) with a first cavity (51) in which the first detector device (1) is arranged and a second cavity (52) in which the second detector device (2) is arranged.

3. Sensor arrangement according to at least one of the previous claims, wherein the first detector device (1) and the second detector device (2) are optically separated from each other.

4. Sensor arrangement according to at least one of the previous claims, wherein the first detector device (1) and the second detector device (2) are operable independently from each other.

5. Sensor arrangement according to at least one of the previous claims, wherein the first detector device (1) and / or the first detector elements (11) is / are based on Si.

6. Sensor arrangement according to at least one of the previous claims, wherein the second detector device (2) and / or the second detector elements (21) is / are based on InGaAs .

7. Sensor arrangement according to at least one of the previous claims, wherein a first sensitivity (31) of the first detector device (1) overlaps with a second sensitivity (32) of the second detector device (2) in the range of near infrared radiation.2024PF01048 November 18, 2025P2024, 0922 WO N- 23 -8. Sensor arrangement according to at least one of the previous claims, wherein each of the first and second detector devices (1, 2) comprises a plurality of separate spectral channel sensitivities (33) .

9. Sensor arrangement according to at least one of the previous claims, further comprising a further housing (80) in which the at least one optical detector arrangement (10) is arranged and which comprises an aperture (81) and which is configured to be in direct contact with the target (70) in the region of the aperture (81) .