Direct backside power delivery system for stacked chips

The direct power delivery system using a permanent carrier to supply power to the top side of stacked semiconductor chips addresses efficiency and heat dissipation issues, improving performance and flexibility in stacked chip designs.

WO2026120376A1 Publication Date: 2026-06-11INTERNATIONAL BUSINESS MACHINE CORPORATION +2
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Patent Information

Application Number
PCT/IB2025/061489
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-05
Filing Date
2025-11-11
Publication Date
2026-06-11

AI Technical Summary

Technical Problem

Stacked semiconductor chips face challenges in efficient power delivery and heat dissipation due to complex manufacturing processes and intricate design requirements, particularly when powering the backside power delivery network (BSPDN) through the chip stack.

Method used

A direct power delivery system is implemented using a permanent carrier that supplies power signals directly to the BSPDN on the top side of the chip stack, bypassing the need for power transmission through individual chips, and includes features like through vias, redistribution layers, and hybrid bonding to enhance efficiency and heat dissipation.

Benefits of technology

This approach improves power delivery efficiency, reduces heat dissipation challenges, and enhances the overall performance and flexibility of stacked chip designs by allowing for better heat management and reduced fabrication defects.

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Abstract

Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a first die, and a second die bonded above the first die. The second die may include a front-end-of-line (FEOL) on a bottom side of the second die facing the first die and a backside power delivery network (BSPDN) on a top side of the second die. The semiconductor structure may also include a permanent carrier hybrid bonded above the second die with a power grid directly supplying a power signal to the BSPDN.
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