LIGHT MODULE AND LIDAR DEVICE WITH AT LEAST ONE SUCH LIGHT MODULE

Abstract

The light module comprises a carrier (TR) with a circuit die. On the top side (TRO) of the carrier (TR), a light-emitting diode die (D1D) and an associated charge storage component (LSBT) are electrically connected to the conduction path terminals (TAF1, TAF2) of a transistor (Tdis) via die-to-die bonds. The electrical connection between the two dies and the conduction path (LPF) of the transistor (Tdis) is as short as possible. On the top side of each of the two dies are terminals (DAF2, LAF2) connected to each other by a short bond wire (BD1). This discharge circuit is optimized to reduce parasitic inductances and ohmic resistances. The charge storage component (LSBT) is charged by a charging circuit (B1), which is electrically connected to the charge storage component (LSBT) via a second bond wire (BD2). The second bond wire (BD2) is longer than the first bond wire (BD1).The light module can be part of a LiDAR device, which may include a special optical system. The driver circuit for the transistor (Tdis) may also be designed in a special way.

Description

[0001] The present PCT application claims the priorities of the following national German patent applications, the contents of which are hereby incorporated by reference into the subject matter of the present application: 10 2020 100 142.8 of January 7, 2020, 10 2020 111 075.8 of April 23, 2020, 10 2020 114 782.1 of June 3, 2020 and 10 2020 124 564. 5 of September 22, 2020.

[0002] The invention relates to a light module and a LIDAR device with at least one such light module as well as optics for a LIDAR device and an integrated circuit, in particular a driver circuit, for example for a LIDAR device. Furthermore, the invention also relates to the use of a LIDAR device and an optical unit for a LIDAR device.

[0003] LIDAR (abbreviation for light detection and ranging) is a method similar to radar for optical distance and speed measurement as well as for remote measurement of atmospheric parameters. Instead of radio waves like radar, light or laser beams are used. For example, if semiconductor lasers are used, they are sometimes referred to as LADAR (English abbreviation: light amplification by stimulation emission of radiation detection and ranging). In the prior art, mechanical mirrors are preferably used to deflect the light or laser beams in different directions.

[0004] From DE-A-10 2009 060 873 a driver circuit for an LED is known, although it is left open how the components should be mounted in order to optimally minimize the parasitic inductances and capacitances.

[0005] A laser array circuit is described in DE-A-10 2008 062 544.

[0006] From DE-A-10 2016 116 368 a driver circuit for light-emitting optoelectronic components is known. According to Fig. 1 In this document, the charging circuit 2, 3, 4, 5, 9, 10, 11, 12, 13, 14 charges a capacitor 18 to 21 via a series resistor 3. The light-emitting optoelectronic components 22 to 25 are connected with their cathodes to form a first star point . A control switch 26 connects this star point to the reference potential GND if one or more of the light-emitting optoelectronic components are to emit light. A buffer capacitor charging circuit 9 is used to quickly charge the actual energy reserve capacitor 18 to 21. In this known concept, the series resistance affects the energy balance.

[0007] From US-B-10 193 304 a driver circuit is known in which the capacitors are charged in such a way that the current remains below the response threshold of the laser.

[0008] From EP-A-2 002 519 (see Fig. 2 ) a compact structure with four layers (two circuit boards, capacitors, laser and switching IC) is known, which is too complex and works too slowly for the solution sought in the context of the invention.

[0009] From EP-A-3 301 473 a control circuit for a single LED is known, which is suitable for emitting short pulses. How the required inductance can be achieved is not described or shown.

[0010] From DE-A-10 2016 116 369 an LED driver circuit is known in which each LED has its own control switch, which increases the effort and worsens the compactness of the device.

[0011] From DE-A-10 2008 021 588 a laser control circuit is known in which several control switches are connected in parallel, so that they can generate pulses with a time delay to one another and cool down between the pulses, while other control switches can generate the further pulses.

[0012] From DE-A-10 2017 121 713 control switches are known which consist of subunits in which each subunit has its own capacitor to provide the switching energy.

[0013] A control device for a gas laser is known from DE-A-199 14 362 and DE-A-19 514 062.

[0014] From US-B-9 185 762 (DE-A-10 2014 105 482) a circuit for reducing the switch-off time of a laser diode is known.

[0015] From DE-A-10 2017 100 879 a circuit for quickly switching a single laser diode on and off is known. A setup example is also given there.

[0016] From DE-A-10 2018 106 860 and US-A-2018 / 0045882 two variants of a direct connection between a laser die of a single laser and the die of an integrated control switch are known. The control switch is connected between the supply voltage and the anode of the laser diode, which, as will become clear below, prevents a particularly compact solution for a laser array.

[0017] DE-A-10 2018 106 860 describes a laser diode module in which several charge storage capacitors and several laser diode dies are arranged on a substrate. The electrical connection of the laser diodes to a control IC can be done via a bonding wire. The charge storage capacitors are connected to the control IC via a lead frame.

[0018] From US-A-2018 / 0045882 a laser module is known in which a laser diode die designed as an edge emitter and a charge storage capacitor are arranged on a circuit die. Among other things, a power transistor for electrically connecting the charge storage capacitor to the laser diode is arranged in the circuit die. The conduction path of the power transistor can be contacted via two surface contacts of the circuit die. In addition, the circuit die has two further surface contacts which are provided for electrical connection to the respective one contact of the charge storage capacitor and the laser diode die. The second contact of the charge storage capacitor is connected to one of the two surface contacts for the conduction path of the power transistor by means of a flexible circuit board. In the same way, the second contact of the laser diode die is connected to the other contact for the conduction path of the power transistor via a flexible circuit board. The electrical current that flows from the capacitor to the laser diode to ignite the laser diode flows through the two flexible circuit boards and over the conduction path. The circuit is closed by an electrical connection between the laser diode and the charge storage capacitor, which is formed in the circuit die. The total length of this circuit is comparatively large, which is why there is a risk of both electrical losses and impairments caused by parasitic inductances.

[0019] A driver circuit is described in DE-A-10 2016 116 875. She points accordingly Fig. 12 This document has a common control switch S3 for several lasers D1, D7, the common control switch S3 being connected to the cathodes of the lasers and being able to connect them to the reference potential. The energy for the laser pulse is taken from a common storage capacity C. The lasers are selected via separate switches S2. The known circuit has the disadvantage that a parasitic voltage drops across this switch S2.

[0020] From DE-B-10 2006 036 167 a laser driver circuit is known in which the resonances of the parasitic inductances and the capacitances are tuned so that they support predetermined properties of the light pulses to be generated.

[0021] US-B-6 697 402 describes a laser driver with laser current detection via a shunt resistor between the cathode connection and reference potential.

[0022] A single driver circuit is known from US-B-9 368 936. A coil is used as energy storage.

[0023] US-B-9 155 146 describes a circuit for supplying energy to an LED chain.

[0024] From DE-A-10 2018 106 861 the control of a laser diode with an H-bridge is known.

[0025] From DE-C-195 46 563 a driver circuit is known in which the charging circuit is disconnected from the laser diode by an inductor for the short period of light pulse emission when the control transistor initiates the light emission.

[0026] The object of the invention is to create a light module for use in particular in a LIDAR device, which avoids the above disadvantages of the prior art and has additional advantages.

[0027] Furthermore, a further object of the invention is to use one or more light modules according to the invention to create a LIDAR device without moving components. Finally, a further object of the invention is to provide optimized imaging optics and optics that enable strip-shaped illuminating light, which can be used primarily in a LIDAR device. Finally, a further object of the invention is to create a driver circuit for, in particular, power transistors for briefly conducting high currents (current pulses).

[0028] These objects of the invention are solved with the objects of claims 1, 23, 25, 46, 47 and 51. Individual embodiments of these objects according to the invention are the subject of the subclaims.

[0029] The invention thus creates a light module a carrier provided with a top side, in which a circuit die with integrated circuits is arranged, the circuit die having a top side, a transistor, in particular a power transistor, formed in the top side of the circuit die, wherein the transistor can be switched on or off Conduction path having a first end region and a second end region, of which the first end region is electrically connected to a first conduction path connection pad and the second end region is electrically connected to a second conduction path connection pad, both of which are exposed at the top of the carrier, and wherein the transistor has a Control connection for switching the line path on and off, a light-emitting diode die having a light-emitting diode, in particular a light-emitting diode die having a laser diode, with a bottom side having a first connection field and a top side having a second connection field, the light-emitting diode die having its first Connection field is arranged lying on the first line path connection field of the transistor and these two connection fields are electrically connected to one another, a charge storage component having a charge storage device, which has a bottom side having a first connection field and a top side having a second connection field, the charge storage component having its first connection field is arranged lying on the second line path connection field of the transistor and these two connection fields are electrically connected to one another, at least one first bonding wire which electrically connects the second connection field of the light-emitting diode die to the second connection field of the charge storage component, one integrated in the circuit die, a charging circuit having an output for charging the charge storage component with electrical charge and a control circuit integrated in the circuit die for controlling the transistor and the charging circuit, the charging circuit being assigned a charge connection field which is exposed on the top of the carrier and to which the output of the charging circuit is electrically connected is, wherein the connection field of the charging circuit is electrically connected to the second connection field of the charge storage component via at least one second bonding wire, and wherein the control circuit controls the charging circuit for charging the charge storage component up to a degree of charge required for the generation of a light pulse by the light-emitting diode die and thereafter controls the transistor to turn its conduction path on.

[0030] The light module according to the invention has a carrier in which a circuit die with integrated circuits is located. The circuit is contacted by means of a lead frame, i.e. a lead frame that has several line tongues or fingers that end in connection fields located on the top of the carrier. The carrier is, so to speak, the housing, typically made of plastic material, in which the circuit die and the lead frame are embedded.

[0031] The electrical connection of the individual components of the light module are optimized with regard to the reduction of parasitic impedances, in particular parasitic inductances, so that high-current pulses can be generated within a very short time, which ensure a high-energy, powerful light pulse.

[0032] For this purpose, there is a transistor in the top or near the top of the circuit, which is typically a power transistor. One of the two connection fields of a light-emitting diode die is electrically connected to the line path of the transistor. This light-emitting diode die, which is preferably a laser diode die, is expediently connected by die-to-die bonding to an exposed connection panel formed in the top of the carrier, which is connected over the lead frame and within the circuit die is electrically connected to one of the two end regions of the conduction path of the transistor. This connection should be as short as possible, which is why, among other things, arranging the transistor directly in or under the top of the circuit die is an advantage. So the active area of ​​the transistor is at the top of the circuit die. The charge storage component, which is usually a capacitor, is also arranged here. The charge storage component is also designed as a die and has a connection field on the bottom, which is electrically connected to the other line path connection field of the transistor. The charging circuit has a charging circuit integrated into the circuit die, which is controlled by a control circuit which is also integrated into the circuit die. The connection to the charging circuit is led out of the circuit die via the lead frame to the top of the carrier and ends there in a connection field that is electrically connected to the top connection field of the charge storage component by means of a (second) bonding wire. The charge storage component itself is now in turn connected to the light-emitting diode die with a first bonding wire that is significantly shorter than the second bonding wire, and this second bonding wire connects the top-side connection fields of the light-emitting diode die and the charge storage component. The control circuit of the circuit die ultimately also controls the transistor, with the interposition of a driver circuit that is also integrated in the circuit die. A possible design of this driver circuit will be discussed in detail below.

[0033] The hybrid construction of the light module according to the invention ensures that parasitic inductances and ohmic resistances as well as capacitances are minimized, particularly in the discharge circuit, which is determined by the conduction path of the transistor, the light-emitting diode die and the charge storage component. Preferably, the last two components mentioned are arranged directly next to one another on the top side of the carrier, so that the first bonding wire can be made as short as possible. The connections between the top conductor path connection fields of the carrier for the transistor up to the actual conduction path of the transistor is also optimized, so that parasitic impedances are largely minimized here too. The charging circuit includes the output of the charging circuit, the second bonding wire and the charge storage component and is also optimized with regard to the reduction of parasitic influences through inductances and resistances as well as capacitances. In principle, it has been found that the parasitic inductance of the charging circuit can advantageously be greater than the parasitic capacitance of the discharging circuit. Then, so to speak, the electrical connection of the charge storage component to the charging circuit is blocked in a certain way when the discharge circuit is closed when the transistor is switched on, so that the charge storage can effectively supply the light-emitting diode with maximum electrical energy in preferably the shortest possible time and with a rapid increase. The pulse-like control of the transistor with a large edge steepness of the electrical switching pulse for the transistor also contributes to this. This in turn is supported by a driver circuit that is advantageously switched off, which will be discussed later.

[0034] As already indicated before, it is advantageous if the at least one first bonding wire has a first parasitic inductance and a first parasitic ohmic resistance, the at least one second bonding wire has a second parasitic inductance and a second parasitic ohmic resistance, the electrical connection of the first connection field of the light-emitting diode die to the first end region of the line path of the transistor has a third parasitic inductance and a third parasitic ohmic resistance and the electrical connection between the first connection field of the charge storage component and the second end region of the conduction path of the transistor has a fourth parasitic inductance and a fourth parasitic ohmic resistance, the electrical connection of the output of the charging circuit with the charge connection field assigned to the charging circuit having a fifth parasitic inductance and a fifth parasitic ohmic resistance, the first parasitic inductance, the third parasitic inductance and the fourth parasitic inductance having a total size that is smaller than the size of the third parasitic inductance and the fifth parasitic inductance in total and in particular less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the third parasitic inductance and the fifth parasitic inductance in total.

[0035] The length of the first bonding wire can in particular be less than 1 / 2 or less than 1 / 3 or less than 1 / 5 of the length of the second bonding wire. The value of the first parasitic inductance and / or the first parasitic ohmic resistance is advantageously smaller than the value of the second parasitic inductance and / or the second parasitic ohmic resistance. The parasitic inductances or ohmic resistances of both bonding wires are preferably smaller than the other parasitic inductances or ohmic resistances mentioned above. It is also advantageous if the first parasitic ohmic resistance, the third parasitic ohmic resistance and the fourth parasitic ohmic resistance have a total size that is smaller than the size of the third ohmic resistance and the fifth ohmic resistance in total and in particular less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the third ohmic resistance and the fifth ohmic resistance in total.

[0036] As explained above, form the electrically interconnected components, namely the light-emitting diode die, the charge storage component, the at least one first bonding wire and the transistor with its conduction path together with a discharge circuit which has a first parasitic inductance and a first parasitic ohmic resistance, and the charge storage component with its electrical connection with the output of the charging circuit via the at least one second bonding wire, a charging circuit which has a second parasitic inductance and a second parasitic ohmic resistance, the first parasitic inductance being smaller than the second parasitic inductance and in particular less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the second inductance.

[0037] It is also advantageous if the first parasitic ohmic resistance is smaller than the second parasitic ohmic resistance and in particular is less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the second parasitic ohmic resistance.

[0038] It has been found that it can be expedient if several first bonding wires are connected in parallel to one another and several second bonding wires are also used in parallel to one another in order to make the aforementioned electrical connections of the top-side connection fields of the light-emitting diode die, charge storage component and connection field for the charging circuit to realize.

[0039] In a further advantageous embodiment of the invention, several light-emitting diode dies and several charge storage components can be provided, whereby each light-emitting diode is assigned a charge storage component, the top of the carrier for each light-emitting diode has an exposed first connection field which is electrically connected to the first end region of the conduction path of the transistor, and for each charge storage component has an exposed second connection field which is electrically connected to the second end region of the line path of the transistor, in which a charging circuit assigned to each charge storage component is integrated and a connection field for each charging circuit is arranged exposed on the top of the carrier, each light-emitting diode die with its first connection field on the assigned first Line path connection field of the transistor is arranged lying on top and these two connection fields are electrically connected to one another, each charge storage component is arranged with its first connection field on the assigned second line path connection field of the transistor and these two connection fields are electrically connected to one another, the second connection field of each light-emitting diode This is connected to the second connection field of the charge storage component assigned to the respective light-emitting diode die by means of at least one first bonding wire, the connection field of each charging circuit is connected to the second connection field of the charge storage component assigned to the respective charging circuit by means of at least one second bonding wire and the control circuit connects the charging circuits sequentially Charging the respective charge storage components up to a degree of charge required for the generation of a light pulse by the light-emitting diodes assigned to the respective charge storage component and controls the transistor to turn on its conduction path before driving the next charging circuit.

[0040] The previously described embodiment of the light module now has a single transistor which selectively closes one of several discharge circuits, each of which includes a different one of the light-emitting diodes and another of the charge storage devices. All light-emitting diodes are connected together to form a common first star point (for example the cathodes of the light-emitting diodes) and connected to one end region of the conduction path of the transistor. The other end region of the line path is connected, for example, to the reference potential to which one contact of the charge storage is also connected, the other contact of which in turn is connected to the other contact of the light-emitting diode (for example to its anode) which is not connected to the transistor. The charge storage devices are charged sequentially controlled by the control circuit. After each charging process, the transistor is then switched on, so that only the LED whose associated charge storage is charged lights up. This circuit concept simplifies the circuit structure and the number of switching elements, since only a single transistor is required, which should advantageously have a large area in order to have the required current-carrying capacity. If you were to use several such transistors, you would quickly reach limits when it comes to the number of transistors per circuit die.

[0041] In the exemplary embodiment described above, several individual first and second line path connection fields for the transistor can be provided on the top of the carrier. However, since a star point of the circuit is connected to both end regions of the line path of the transistor (namely, for example, the anodes of all light-emitting diodes on the one hand and the contacts of all charge storage devices on the other hand), a common and therefore larger first line path connection field as well as a common and therefore also A correspondingly large second line path connection field of the transistor can be formed on the top of the carrier.

[0042] As already described above, the light-emitting diode die preferably has a laser diode, i.e. is designed as a laser diode die, whereby it is expedient to design the laser diode as an edge emitter.

[0043] In a further advantageous embodiment of the invention, a first supply voltage connection field exposed on the top of the carrier can be provided for a supply voltage potential, being connected to the second line path connection field of the transistor or, if several such second line path connection fields are present, to all of them A supply voltage reference potential can be applied to the second line path connection fields of the transistor or to a second line path connection field that is common to all of these second line path connection fields.

[0044] Furthermore, a buffer capacitor component forming a buffer capacitor can expediently be provided with a bottom on which a first connection field is arranged, and a top on which a second connection field is arranged, the buffer capacitor component having its first connection field on the second line path connection field or the second line path connection fields or the second line path connection field common to all of these second line path connection fields is arranged lying on top and the connection fields on both sides are connected to one another and wherein the second connection field of the buffer capacitor component is electrically connected to the first supply voltage connection field via at least a third bonding wire.

[0045] In order to minimize the length of the first bonding wires connecting the top-side connection panel of the LED die and the associated charge storage component, it is advantageous if the LED die and the charge storage components are arranged one after the other along two adjacent lines, each LED die and that respectively assigned charge storage component are arranged opposite each other.

[0046] When using a light module with several light-emitting diodes, each defines an optical axis along which a light beam emanating from the relevant light-emitting diode is directed, the line along which the light-emitting diodes are arranged in succession being either runs in a circular arc around a center point and the optical axes of the light-emitting diodes run radially to this circular arc-shaped line or runs in a straight line and the optical axes of the light-emitting diodes run perpendicular to it.

[0047] It is advantageous if the capacitors typically used as charge storage and the buffer capacitor already mentioned above are designed as a common component, which has a bottom with a common bottom connection field and a top with at least a first top connection field and a second top connection field and a dielectric between the bottom connection field on the one hand and the at least one first top connection field and the second top connection field on the other hand, the buffer capacitor being formed between the second top connection field and the portion of the bottom connection field lying below this second top connection field and each charge storage capacitor is formed between another one of the first top connection fields and the portion of the bottom connection field lying below this respective first top connection field.

[0048] As already described above, the carrier has a potting compound in which a lead frame having a plurality of conductor tongues and the circuit die electrically connected to the conductor tongues are embedded, the conductor tongues having the connection fields exposed on the top of the carrier.

[0049] The transistor of the light module according to the invention, which is designed in particular as a power transistor, is expediently controlled by means of digital voltage signals, which naturally do not have sufficient power to control the comparatively large-area gate of a power MOSFET, for example. A power transistor can be understood as the parallel connection of a large number of individual transistors. Each individual transistor has an individual control connection (in the form of, for example, a gate electrode), with the entirety of the individual control connections forming the overall control connection of the power transistor. So that the power transistor can be switched homogeneously, the digital control signal must be applied to each individual control connection. It should also be noted that the lengths of the electrical connection between the output of the control circuit, which is typically designed using digital technology, to each of the individual control connections are of the same length and are designed accordingly geometrically in their courses.

[0050] In this context, it has proven to be advantageous if the transistor of the circuit is designed as a voltage-controlled overall transistor designed using analog circuit technology and having an overall control connection and an overall line path for conducting an electrical current via the overall line path and for blocking the current, the overall control connection being via a control connection. Total area of ​​the circuit-This extends if the control circuit has a driver circuit designed in digital circuit technology for controlling the overall control connection of the overall transistor for conducting and blocking the current, or that the circuit-Die has a driver circuit designed in digital circuit technology and controllable by the control circuit Controlling the overall control connection of the overall transistor for conducting and blocking the current, the overall transistor being divided into a large number of individual transistors designed using analog circuit technology or having a large number of such individual transistors, each individual transistor having an individual control connection and the individual control connections of the individual transistors each having a control connection -Individual areas of the die that are the same size or evenly distributed over the total control connection area of ​​the entire transistor, the driver circuit having a large number of individual driver circuits, each with one input and u outputs, with u as an integer natural number greater than or equal to 2, which are hierarchically divided into different stages, whereby the output of a single transistor circuit of an i-th stage, with i equal to 1 to v and v as an integer natural number greater than or equal to 2, with the inputs of u individual driver circuits of the (i+1)- th stage, is connected (i.e. where each single driver circuit has a fan-out of u, with u as an integer natural number greater than or equal to 2), the arrangement consisting of a single driver circuit of the i-th stage and the single driver circuits of the (i+1)-th stage, their Inputs are connected to the outputs of the individual driver circuit of the i-th stage, forming a self-similar structure, the self-similar structures of an i-th stage being larger in area than the self-similar structures of an (i+1)-th stage and the self-similar structures of the i -th stage are nested with an (i+1)-th stage with the self-similar structure of an i-th stage from which it emerged, and wherein the outputs of the individual driver circuits of the v-th stage are connected to the individual control connection areas of the individual transistors are.

[0051] By nesting individual self-similar structures per driver stage, it is achieved that, as described above, the electrical connecting lines (including the electrical connections and circuit components of the individual driver circuits of the individual driver stages) are of the same length and identical or similar in terms of their geometric orientation and their geometric course , namely, for example, symmetrical or mirror-symmetrical.

[0052] By "fanning out" the single transistor control signal of the control circuit into a large number of individual digital signals, each of which only has to control comparatively small electrodes of the individual transistors, it is possible to optimize the switch-on times and the edge steepness, so that with a high-energy current pulse , which is switched by the power transistor, works and the light-emitting diode, preferably the charger diode, can be controlled.

[0053] In a further advantageous embodiment of the invention, it can be provided that each individual driver circuit has an input and four outputs, that each of the individual driver circuits of the i-th stage and the four individual driver circuits of the (i+1)-th stage together with the electrical connection of the four outputs of the Single driver circuit of the i-th stage forms an H-shaped structure with the inputs of the four single driver circuits of the (i+1)-th stage, with the single driver circuits of the (i+1)-th stage arranged at the four ends of the H-shaped structure and the i-th stage single driver circuit is located midway between the four ends, and the H-shaped structures have the same orientation from stage to stage.

[0054] Furthermore, it can be expedient if each individual driver circuit has one input and two outputs, that each of the individual driver circuits of the i-th stage is arranged in the middle between the two individual driver circuits of the (i+1)-th stage, as well as together with the electrical connection of the two Outputs of the individual driver circuit of the i-th stage form a rectilinear structure with the inputs of the two individual driver circuits of the (i+1)-th stage and if these self-similar structures are rotated by 90 ° to each other from stage to stage.

[0055] It can also be advantageous if the individual driver circuits are designed as inverter circuits and that the individual transistors are designed as power transistors, in particular MOSFETs. The digital inverter circuit is the simplest concept for the individual driver circuits, as used in the multiple driver stages of the driver circuit according to this embodiment of the invention.

[0056] With regard to the geometric design and arrangement of the connection fields of the light module, it can be expedient if the top of the carrier has a rectangular shape with two longitudinal edges and two transverse edges that are shorter in comparison to these longitudinal edges, with the at least one first line path connection field of the transistor on one of the two Transverse edges is arranged and on the other transverse edge connection panels for the energy supply of the control circuit, the at least one charging circuit, the at least one charge storage component and the at least one light-emitting diode die are arranged.

[0057] In an advantageous embodiment of the invention, it can be provided that one of two transfer signal connection fields of at least one pair of transfer signal connection fields are arranged on each of the longitudinal edges of the top side of the carrier, which are electrically connected to one another and for the supply of transfer signals intended for the circuit such as a reset signal, a diagnostic signal, a bus communication signal, a trigger signal for triggering the generation of a light pulse by the at least one light-emitting diode die, the transfer signals being transferred from one light module to the adjacent light module or from one light module to the next when several light modules are arranged side by side Processing in its circuit which can be forwarded to the neighboring light module.

[0058] In a further advantageous embodiment of the invention, it can be provided that the light modules are arranged next to one another with the longitudinal edges of their upper sides arranged adjacent to one another, in particular when the longitudinal edges are aligned parallel, the transfer signal connection fields of the same pairs of transfer signal connection fields of two adjacent light modules being electrically connected to one another are connected.

[0059] It can also be advantageous if the light-emitting diode dies of all light modules arranged next to one another are arranged on a common arc-shaped curved line or on a straight line.

[0060] The above-mentioned tasks are further solved according to the invention by a LIDAR device for optically scanning a room and for recording a distance image representing the room at least one light module according to one or more of the above-mentioned embodiments, wherein from each light-emitting diode of each light module when the relevant light-emitting diode is controlled, a light beam with an elliptical or oval-shaped light beam cross-section with a first semi-axis and with a second semi-axis which is longer than the first semi-axis or with a circular cross section, a transmitter optical element for expanding the light beam of each of the light-emitting diodes - this by stretching the elliptical or oval-shaped light beam cross section along the second semi-axis and compressing the light beam cross section along the first semi-axis or vice versa to form a light beam fan directed towards the space to be scanned line-like and / or slit-like cross-section or by stretching the circular light beam cross-section to form a light beam fan with a line-like and / or slit-like cross-section directed at the space to be scanned, the cone-shaped light beams generated by the light-emitting diodes arranged next to one another entering the room as light beam fans at different angles , a photosensor with a plurality of photodetectors which are arranged in a number of rows or columns equal to the total number of light-emitting diodes of the at least one light module, each row or column having the same number of photodetectors, a receiver optical element for directing potential reflected light from the space to be scanned onto the photosensor, with reflection light potentially arising due to the respective light beam fan striking another of the several rows or columns of photodetectors of the photosensor, and an evaluation unit for evaluating signals from the photodetectors to determine distance information and / or to determine a Distance image of the space to be scanned.

[0061] The LIDAR device according to the invention therefore works with several light-emitting diodes, which are controlled sequentially in order to convert light beam strips into line-shaped light beam strips after passing through the individual light beam bundles emitted, which typically have an elliptical or oval-shaped cross-section, or else have a circular cross-section. Each light beam line hits a different line or strip-shaped area of ​​the scene to be imaged, i.e. the distance image to be recorded. The light reflected from there successively per strip reaches the individual rows or columns of a 2D photo sensor with a large number of photo detectors, in particular designed as photo diodes, via imaging receiving optics. The exposure of the photo sensor takes place in the manner of a “rolling shutter”. The individual photodetector signals are then evaluated by an evaluation unit. The evaluation can be evaluated either according to the time-of-flight concept or depending on the intensity.

[0062] An advantage of the LIDAR device described above is that it works mechanically without requiring any movable components. The receiver optical element is therefore expediently an imaging lens or an imaging lens, as is typically used in cameras. The transmitter optical element can have a cylindrical lens and a Powell lens or can have a lens that combines the function of these two types of lenses.

[0063] The advantage of using a Powell lens is that inhomogeneities in intensity distribution across the cross-sectional area of ​​the light beam can be compensated for. Such light intensity inhomogeneities typically occur with Gaussian emitters and are particularly common with edge emitter light-emitting or laser diodes. These light intensity inhomogeneities can be compensated for over the longitudinal extent of the light beam strips, as used in the LIDAR device according to the invention, using the Powell lens or special lenses with appropriate surfaces.

[0064] In an advantageous embodiment of the invention, at least two light modules can be provided, the light-emitting diode dies of each light module each being arranged next to one another along a circular arc line extending over a predetermined angle and adjacent light modules being arranged rotated relative to one another by the predetermined angle.

[0065] In a further advantageous embodiment of the invention, at least two light modules can be provided, the light-emitting diode dies of each light module being arranged next to one another along a straight line and adjacent light modules being arranged rotated at an angle to one another, so that the optical axes of those light-emitting diode dies of the light modules , which are arranged at the same position within the sequence of LED dies of each light module, intersect at a common point. The advantage of this arrangement of the LED dies is that the distance of each LED die from the transmitter optical element lens is now the same.

[0066] According to an alternative to the LIDAR device according to the invention, it is provided with a light module with a single light-emitting diode die according to one or more of the above-mentioned, wherein from the light-emitting diode die when activated a light beam with an elliptical or oval-shaped light beam cross section with a first semi-axis and a second semi-axis which is longer than the first semi-axis or with a circular one Cross section emanates from a transmitter optical element for expanding the light beam of the light-emitting diode - this by stretching the elliptical or oval-shaped light beam cross section along the second semi-axis and compressing the light beam cross section along the first semi-axis or vice versa to form a light beam fan with a line-like and / or slot-like directed at the space to be scanned Cross section or by stretching the circular light beam cross section into a light beam fan directed towards the space to be scanned with a line-like and / or slot-like cross section, a movable optical deflection element for deflecting the light beam fan at different angles into the space to be scanned for scanning the space by means of the light beam fan sweeping over it, a Photosensor with a plurality of photodiodes arranged in rows and columns, a receiver optical element for directing potential reflected light from the space to be scanned onto the photosensor, with potential reflected light that arises due to each light beam fan deflected into the room at a different angle another of the several rows or columns of photodetectors of the photosensor occurs, and an evaluation unit for evaluating signals from the photodetectors to determine distance information and / or to determine a distance image of the space to be scanned.

[0067] This variant of the LIDAR device uses a movable mechanical element, for example a pivoting mirror or polymer optics. Examples of such fundamentally known movable optical elements can be found in EP-A-3 660 574 or US-A-2020 / 0264462 as micro-mechanical / micro-electrical systems (MEMS) in the form of MEMS mirrors and in WO-A-2008 / 035983 and WO-A-2018 / 154139 as a polymer optic element with piezo drive. In LIDAR systems with movable optical deflection elements, the circuit concept according to the invention can advantageously be used for the high-energy electrical control of the light-emitting diode die with the greatest possible edge steepness, with the result that high-intensity, sufficiently long light pulses can be generated.

[0068] In an expedient development of the variant of the LIDAR device described above, it can be provided that the optical deflection element works refractively and is designed in particular as a prism, or that the optical deflection element works reflectively and is designed in particular as a mirror.

[0069] Both variants of the LIDAR device mentioned above use a photosensor in which the photodetectors are arranged in rows and columns. Depending on the design, space is required either between adjacent photodetector rows or adjacent photodetector columns on the sensor chip for the electronic switching elements that are assigned to the individual photodetectors, which is why the individual photodetector rows or photodetector columns cannot capture the entire strip-shaped illuminated scene. But if you now let the photo sensor or the entire LIDAR device oscillate around an axis, whereby the respective oscillation or inclination angle is recorded, then when the scene is recorded for each inclination angle in the course of the oscillation, those strip-shaped areas of the illuminated scene can also be recorded, which have previously been mapped to the spaces between adjacent lines. This increases the resolution at which the scene is recorded.

[0070] In this respect, it is therefore advantageous to provide a tilting movement device for tilting the at least one light module or for tilting the arrangement of several light modules or for tilting the photosensor, the signals from the photodetectors of the photosensor being evaluated depending on the respective tilting angle at which the light-emitting diodes -This means that the light module(s) emit light and / or the photo sensor receives reflected light.

[0071] Alternatively or additionally it can also be provided that each light-emitting diode - which emits a light beam as a scanning light beam with an elliptical or oval-shaped or circular light beam cross-section, the transmitter optical element expands the scanning light cone into a scanning light fan that lies in a light fan plane, the scanning light fans of the scanning light beams of all light-emitting diodes - this are offset from one another by an angular offset, from through A scanning light fan illuminated scanning points in the space to be scanned potentially emit reflection radiation essentially in the form of reflected light cones and the receiver optical element images reflected light cones, which potentially emanate from scanning points of the space to be scanned illuminated by one of the scanning light fans, onto a photodetector column or row of the photosensor.

[0072] In a further expedient embodiment of the invention it can be provided that the light-emitting diode dies are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector column of the photosensor, and that each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector row of the photosensor is.

[0073] In an expedient embodiment of the invention it can also be provided that the light-emitting diode dies are arranged next to one another in a row whose orientation is equal to a photodetector line of the photosensor, and that each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row whose orientation is equal to the orientation of a photodetector line of the photosensor.

[0074] In a further expedient embodiment of the invention it can be provided that the light-emitting diode dies are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector column of the photosensor, and that each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector column of the photosensor is.

[0075] Furthermore, in an expedient embodiment of the invention it can be provided that the light-emitting diode dies are arranged next to one another in a row whose orientation is equal to a photodetector row of the photosensor, and that each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row whose orientation is equal to a photodetector column of the photosensor.

[0076] As far as the optical properties of the LIDAR device are concerned, it is advantageous if the transmitter optical element has a lens having an optical axis, in particular a substantially cuboid shape and with a height, a width and a thickness aligned in the extension of the optical axis and with a first main page and a second main page facing away from this, through which the optical axis runs, wherein the first main side has a flat surface, the second main side having a surface which is formed as an overlay of a convex protrusion and a concave indentation arranged in the middle of the width extension of the lens, the protrusion being an imaginary one lying outside the lens first axis runs and the indentation runs around a second axis, which is also located outside the lens and is directed perpendicular to the first axis.

[0077] This design of the main sides of the transmitter optical element is advantageous in that the intensity with which individual sections of a strip-shaped area of ​​the scene is illuminated is evened out. The transmitter optical element can have one or more lenses. The two main sides then form the end surfaces of one lens or the group of several lenses. The first main page can face the scene to be recorded, so that the second main page faces the light module or modules. But it is also possible for the first main page to face the light module(s) and the second main page to face the scene.

[0078] In the transmitter optical element described above, it is advantageously provided that the first axis lies in a half-space adjoining the first main side of the lens and the second axis lies in a half-space adjoining the second main side of the lens.

[0079] In an alternative embodiment of the transmitter optical element, it has a lens having an optical axis with a particularly essentially cuboid shape and with a height, a width and a thickness aligned in the extension of the optical axis and with a first main side and a second main side facing away from this, through which the optical axis runs, wherein the first main side is designed as an overlay of a flat surface with a concave first indentation arranged in the middle of the width extension of the lens and with a bending of the lens directed towards the second main side in the areas on both sides of this indentation towards the second main side, the second main side is designed as an overlay of a convex first protrusion and a convex second protrusion arranged in the middle of the width extension of the lens, the first protrusion extending around an imaginary first axis arranged outside the lens, the second protrusion extending around a imaginary second axis, also arranged outside the lens, which is directed perpendicular to the first axis, and wherein the indentation extends around an imaginary third axis, also arranged outside the lens, which is directed parallel to the second axis.

[0080] It can also be advantageously provided that the first axis and the second axis and the third axis lie in a half space adjacent to the first main side of the lens and that the bending of the lens in its areas on both sides of the indentation of the first main side is about a fourth axis extends, which runs parallel to the second axis and the third axis and lies in a second half space adjacent to the second main side.

[0081] A possible design of the lens can be that: the first main page has an area that is defined by a function of the shape z = RY + AR 2 * x 2 + AR 3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB 6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY= R0Y+AR2 ∗< x 2< +AR3 ∗< |x 3< |, Sign() as the signum function of a function parameter, Sqrt() as the root of a function parameter, x for a point along the width of the lens, y for a point along the height of the lens, z for a point along the thickness and thus along the optical axis of the lens, starting from the xy center plane of the lens, and R0Y as the radius of curvature of the lens, the second main side has an area that is defined by a function of form z = − d + PC 2 * x 2 + PC 3 * x 3 , with d as the thickness of the lens in the optical center, the parameters PB2 and PB3 being non-zero and at least two of the parameters AR2, AR3, PB4, PB6, PC2 and PC3 being non-zero.

[0082] It can be provided here that the parameters AR2 and AR3 are different from zero and at least two of the parameters PB4, PB6, PC2 and PC3 are different from zero and / or that the parameters PB4 and PB6 are different from zero and at least one of the parameters PC2 and PC3 is non-zero and / or that the parameters PC2 and PC3 are non-zero.

[0083] The area of ​​application of the LIDAR device according to the invention with light modules according to the invention is diverse. For example, the one or more light modules and the LIDAR device can be used for the detection of objects in the environment of or in a partial area of ​​the environment of a stationary or mobile platform, in particular an autonomously moving platform, in particular an autonomously moving platform, such as a robot or a stationary or moving, in particular autonomously moving vehicle, such as e.g. a water, land or aircraft vehicle for, in particular, passenger or freight transport, or the detection of objects in the automation of manufacturing processes, or the non-invasive imaging of living organisms and / or biological organs of a living being, or the examination of biological tissue, or the creation of three-dimensional distance images of objects in a detection room, and / or the monitoring of the surroundings of buildings.

[0084] The advantages of the driver circuit for the power transistor for generating stable digital signals via the relatively large control electrode of the power transistor have already been described above. According to the invention, this driver circuit is now provided as an integrated electrical circuit for switching electrical currents a die, a voltage-controlled overall transistor designed in analog circuit technology and having an overall control connection and an overall conduction path for conducting an electrical current over the overall conduction path and for blocking the current, the overall control connection extending over a total control connection area of ​​the die, one in which the driver circuit, designed using digital circuit technology, for controlling the overall control connection of the overall transistor for conducting and blocking the current, each individual transistor having an individual control connection and the individual control connections of the individual transistors each extending over individual control connection areas of the die which are the same size or evenly over the Control connection total area of ​​the entire transistor are distributed, the driver circuit having a plurality of individual driver circuits, each with one input and u outputs, with u as an integer natural number greater than or equal to 2, which are hierarchically divided into different stages, the output of a single transistor circuit an i-th stage, with i equal to 1 to v and v as an integer natural number greater than or equal to 2, is connected to the inputs of u individual driver circuits of the (i+1)-th stage (i.e. where each single driver circuit has a fan-out of u, with u as an integer natural number greater than or equal to 2), the arrangement consisting of a single driver circuit of the i-th stage and the single driver circuits of the (i+1)-th stage, their Inputs are connected to the outputs of the individual driver circuit of the i-th stage, forming a self-similar structure, the self-similar structures of an i-th stage being larger in area than the self-similar structures of an (i+1)-th stage and the self-similar structures of the i -th stage are nested with an (i+1)-th stage with the self-similar structure of an i-th stage from which it emerged, and wherein the outputs of the individual driver circuits of the v-th stage are connected to the individual control connection areas of the individual transistors are.

[0085] In an advantageous embodiment of the invention, it can be provided that each individual driver circuit has one input and four outputs, that each of the individual driver circuits of the i-th stage and the four individual driver circuits of the (i+1)-th stage together with the electrical connection of the four outputs of the individual driver circuit the i-th stage forms an H-shaped structure with the inputs of the four individual driver circuits of the (i+1)-th stage, the individual driver circuits of the (i+1)-th stage being arranged at the four ends of the H-shaped structure and the i-th stage single driver circuit is located midway between the four ends, and the H-shaped structures have the same orientation from stage to stage.

[0086] In a further advantageous embodiment of the invention, it can be provided that each individual driver circuit has one input and two outputs, that each of the individual driver circuits of the i-th stage is arranged in the middle between the two individual driver circuits of the (i+1)-th stage and together with the Electrical connection of the two outputs of the individual driver circuit of the i-th stage with the inputs of the two individual driver circuits of the (i + 1)-th stage forms a rectilinear structure and that these self-similar structures are rotated by 90 ° to each other from stage to stage.

[0087] In an advantageous embodiment of the invention, it can further be provided that the individual driver circuits are designed as inverter circuits and that the individual transistors are designed as power transistors, in particular MOSFETs.

[0088] The optical unit of the LIDAR device for illuminating the scene has already been discussed above. According to one variant, the LIDAR device is provided with one or more light modules, wherein each light-emitting diode emits a light beam with an elliptical or circular cross section, each light beam having a light beam axis, the light beam axes lying substantially in a common light beam axis plane and the light beam axis plane defining an optical axis, with a lens arranged on the optical axis of the light beam axis plane , which expands each light beam in a direction perpendicular to the laser beam axis plane, so that a light fan results for each of the light beams in a light fan plane perpendicular to the light beam axis plane, with a photosensor with a photodetector array, which has a plurality of photodetector rows, each with a plurality of photodetector pixels, and with an imaging optics for the real optical imaging of a scene illuminated by the light fans onto the photo sensor, the imaging optics being the projection of the light beam fans in the far field onto an ideally homogeneously white and / or essentially ideally diffusely uniformly and uniformly reflecting projection plane perpendicular to the optical axis of the light beam axis plane in the form a projection image of the light beam fan onto the photo sensor as an image of the scene.

[0089] With this LIDAR device the lens is shaped such that the value of the illumination intensity of a first section of the image of the projection of a first light beam fan onto a first photodetector pixel of the photodetector array of the photosensor is dependent on the value of the illumination intensity of a second section of the image of the projection of the first light beam fan which is different from the first section a second photodetector pixel that is different from the first photodetector pixel or of a second light beam fan deviates from a second photodetector pixel of the photodetector array of the photosensor that is different from the first photodetector pixel by not more than 10% or by not more than 5% or by not more than 2%, the lens has a first surface and a second surface facing away from this, the first surface is defined by a function of the shape z = RY + AR 2 * x 2 + AR 3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB 6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY= R0Y+AR2 ∗< x 2< +AR3 ∗< |x 3< |, Sign() as the signum function of a function parameter, Sqrt() as the root of a function parameter, x for a point along the width of the lens, y for a point along the height of the lens, z for a point along the thickness and thus along the optical axis of the lens, starting from the x-y center plane of the lens, and R0Y as the radius of curvature of the lens, the second surface is defined by a function of the shape z = − d + PC 2 * x 2 + PC 3 * x 3 , with d as the thickness of the lens in the optical center, the parameters PB2 and PB3 being non-zero and at least two of the parameters AR2, AR3, PB4, PB6, PC2 and PC3 being non-zero.

[0090] It can be provided here that the parameters AR2 and AR3 are different from zero and at least two of the parameters PB4, PB6, PC2 and PC3 are different from zero and / or that the parameters PB4 and PB6 are different from zero and at least one of the parameters PC2 and PC3 is non-zero and / or that the parameters PC2 and PC3 are non-zero. The first surface can face the scene, so that the second surface faces the light module(s). However, a reverse construction or installation of the lens is also possible.

[0091] As already described above, it is particularly desirable when used in LIDAR devices to be able to generate light pulses that are as high-energy as possible. This is done by pulse-like control of a (preferably power) transistor with a large edge steepness of the control pulse. The preparation of the transistor control is usually carried out using circuit components designed using digital circuit technology, which ultimately have to control a comparatively large-area power transistor. Special precautions must be taken to ensure that the same strength of control is evenly distributed over the surface of the control electrode of the power transistor, which, as far as is known, have not yet been satisfactorily solved in the prior art.

[0092] The state of the art is exemplified by: Fig. 23 explained. Fig. 23shows an exemplary circuit, reduced to the essentials, according to the prior art for controlling a laser diode LD by means of a driver circuit I and, for example, a field effect transistor M and an unspecified control circuit CTR, which in this case is, for example, the block CTR Circuit after Fig. 5 acts. The exact structure of the pre-driver or control circuit CTR, which is not specified in more detail, is not relevant for the considerations made below and is therefore not explained further.

[0093] The driver circuit I has an input and an output. The laser diode LD includes a cathode and an anode. The laser diode LD can also be a light-emitting diode. The field effect transistor M includes a gate connection, a drain connection and a source connection.

[0094] The pre-driver circuit (implemented here as an example as a control CTR) is electrically connected to the input of the driver circuit I. The output of the driver circuit I is electrically connected to the gate connection of the field effect transistor M. In Fig. 23 The field effect transistor M is shown as an example as a normally on p-channel MOSFET. The drain connection of the field effect transistor M is electrically connected to the cathode of the laser diode LD. The anode of the laser diode LD is electrically connected to a first reference potential HV. The source connection of the field effect transistor M is electrically connected to a second reference potential Gnd. The second reference potential Gnd is smaller in magnitude than the first reference potential HV.

[0095] In such a circuit for controlling a laser diode LD or light-emitting diode, the control circuit CTR and the driver circuit I and the field effect transistor M are implemented as separate blocks in a CMOS architecture or as discrete components.

[0096] For the control of pulsed laser diodes or light-emitting diodes using short high-current pulses, GaN field effect transistors in particular are known in the prior art as discrete components with an external discrete pre-driver, or CMOS high-current transistors with an integrated pre-driver.

[0097] The invention is therefore based on the further object of creating a solution which avoids the above disadvantages of the prior art and has further advantages. An essential aspect of the invention is to avoid the previously noticeable and disruptive limitation of the maximum achievable switching speed, which occurs due to the considerable signal transit times, in particular the gate signal, due to the areal expansion of high-current MOS transistors with low resistance.

[0098] The core of the invention presented here is a light and in particular laser module that allows the emission of comparatively long, high-energy, intense laser or light pulses with a large edge steepness. It is assumed that the laser module comprises n lasers arranged linearly next to one another. The lasers are preferably semiconductor lasers, which preferably have a common cathode contact. When we speak of a laser module or laser or lasers in the following, this is synonymous and generally understood as a light module with light sources in the form of LEDs.

[0099] The proposed laser module therefore has a linear laser array made up of n lasers, where n stands for an integer positive number that is greater than or equal to 1 and, for example, greater than or equal to 2 or greater than or equal to 4 or greater than or equal to 8 or greater than or equal to 16. The number n of lasers is preferably a power of 2. The lasers are preferably arranged next to one another along a first (imaginary) line with a first distance from laser to laser. The lasers are preferably designed in the same way. The lasers are preferably manufactured in a common crystal.

[0100] Each of the n lasers is preferably assigned exactly one capacitor out of n capacitors as the respective energy source for its laser pulse. Whether or not a laser emits a laser pulse with the next pulse signal is preferably determined by whether or not the capacitor assigned to this laser was charged by a charging circuit before the pulse signal was generated. The n capacitors are preferably arranged next to each other along a second (imaginary) line. This second line of arrangement of the capacitors preferably runs parallel to the first line of arrangement of the lasers. The second capacitor-to-capacitor distance for the n capacitors arranged along this second line is preferably equal to the first laser-to-laser distance by which the lasers are spaced apart along the first line. This results in a linear capacitor array made up of n capacitors.

[0101] Furthermore, the laser module has a control switch which is used to ignite and operate the laser with electrical charge from the capacitor assigned to the respective laser.

[0102] In order for a laser to be able to emit a laser pulse when the pulse signal arrives, the capacitor assigned to this laser must have previously been charged by a charging circuit assigned to this capacitor. The laser module therefore preferably comprises n charging circuits, with each charging circuit being able to selectively charge a different one of the n capacitors (hereinafter referred to as the capacitor assigned to this charging circuit) via a charging line inductance. In the course of developing the invention, it was recognized that the size of this charging line inductance has a positive effect on the discharge speed of the respective capacitor and thus on the steepness of the pulse edge, since this inductance separates the charging circuit from the capacitor for high frequencies. This means that the output capacitances of the charging circuit no longer have an effect on steep laser edges and a large charging line inductance. The laser pulse potentially becomes steeper due to the blocking charging line inductance.

[0103] Thus, each of the n capacitors is preferably assigned one of the n lasers as a laser assigned to this capacitor. When the pulse signal arrives, the control switch is closed. The control switch is preferably a transistor of an integrated circuit. By closing the control switch, the control switch discharges that capacitor of the n capacitors that is charged via the laser assigned to this capacitor and a discharge line inductance which preferably connects this capacitor to the anode of the laser. The assigned laser can only emit a laser pulse with the arrival of the pulse signal and the subsequent closing of the control switch if the capacitor assigned to this laser has previously been charged by the charging circuit. By closing the control switch when the electrical pulse signal arrives, the control switch preferably connects the cathode of the laser to a reference potential. Of course, circuits are also conceivable or conceivable or possible in which the anode and cathode of the laser are swapped. These functionally equivalent circuits and arrangements are expressly included in the invention.

[0104] It is therefore an essential finding according to the invention that the value of the charging line inductance should be as high as possible, while the inductance of the discharging line should be as small as possible. The connecting line from, for example, the anode of the laser to its capacitor and the supply line inductance from the capacitor to the reference potential contribute to the discharge line inductance. The total discharge line inductance should be as low as possible. When the invention was developed, it was recognized that it is advantageous to use several thin bonding wires for the connection instead of a thick bonding wire with a high current-carrying capacity, since the total inductance of the several bonding wires connected in parallel is lower than the parasitic inductance of the thick bonding wire. Although there is a transformative coupling effect between the bonding wires placed in parallel, the advantages of the low overall inductance and thus the fast switching times far outweigh this.

[0105] The charging line inductance is maximized. The bonding wire length for connecting the first connection of the capacitor to the charging circuit assigned to it is therefore preferably maximized in order to increase the charging line inductance to the extent possible and thus to obtain maximum separation between the parasitic output capacitances of the charging circuit and the anode of the laser.

[0106] Thus, the value of the charging line inductance is preferably larger and in particular significantly larger than the value of the discharging line inductance.

[0107] The laser module preferably comprises an integrated circuit in which the cathodes of the lasers of the linear laser array of n lasers (i.e. the laser line) are connected together to form a star point in a wireless bonding manner. For this purpose, the laser module with a common rear contact, which in the example presented here represents the common cathode of the n lasers, is preferably connected directly to a contact of the control switch, so that this control switch is connected to the cathodes of the n lasers with a connection with practically no inductance is. The crystal (i.e. the die) of the integrated circuit dissipates the heat loss from the n-laser. The back side of the linear laser array is therefore preferably connected in a thermally and electrically conductive manner to a contact of the control switch, which is preferably monolithically integrated into the crystal of the integrated circuit that is preferably used. This connection can be made by gluing or soldering or another suitable electrically and thermally conductive connection technique, such as thermocompression of bond balls or another flip-chip assembly technique. Preferably, the stack consisting of the crystal (Die) of the linear laser array or the crystals (Die) of the individual diode lasers and the crystal (Die) of the integrated circuit with the control switch and preferably with the charging circuit is thermally and preferably also electrically conductive the back of the integrated circuit is mounted on a heat sink, for example by means of thermally and preferably electrically conductive gluing or soldering.

[0108] As already mentioned, the control switch and preferably the n charging circuits for the n capacitors of the single-row capacitor array are part of the integrated circuit. The control switch is preferably electrically connected in a bond-wireless manner to the first star point, which, for example, connects the cathodes of the n lasers to one another.

[0109] As mentioned, the control circuit and the n charging circuits are preferably integrated into the crystal of the integrated circuit in the active surface opposite the back of the crystal. Thus, the n charging circuits are part of the active surface of the integrated circuit, meaning that they are placed essentially directly under the surface of the crystal or on its surface. In parallel to the linear laser array of n lasers, the linear capacitor array of n capacitors is now also attached to the active surface of the monolithic crystal (Die) of the integrated circuit.

[0110] This parallelism refers not only to a temporal parallelism, but also to a spatial parallelism. The n lasers of the laser array are preferably arranged along a first straight line. The n capacitors of the capacitor array are preferably arranged along a second straight line, which firstly is preferably parallel to the second line or secondly can be thought of as lying on the underside of the capacitor array. Likewise, the first line can be thought of as lying on the underside of the laser array. The first line and the second line then define a plane that is preferably the same as the active surface of the crystal of the electrical circuit or is at least substantially parallel to this surface and only slightly spaced from it by fastening means, such as adhesive or solder that one can speak of an essentially equality of the plane and the surface of the die.

[0111] Each of the n capacitors of the capacitor array has a first connection and a second connection. To reduce the discharge lead inductance, the first connection of each capacitor of the linear capacitor array is connected to the anode of the laser of the linear laser array of n lasers assigned to this capacitor by a multiple bonding with a first bonding wire length. The second connections of the n capacitors of the capacitor array are connected together to form a second star point. To further reduce the discharge lead inductance, this second star point is connected to a reference potential contact on the active surface of the crystal of the integrated circuit with a plurality of bonding wires with a second bonding wire length. This construction has significant advantages. If only one of the n capacitors of the capacitor array has been charged by its associated charging circuit and all other capacitors are uncharged, these uncharged capacitors are essentially charged to a voltage close to 0V or such a low voltage as to cause "ignition " of the lasers assigned to these other capacitors is far from sufficient. When the pulse signal arrives, the control switch now connects the first star point to the reference potential. Firstly, the previously charged capacitor in question is discharged via the laser assigned to it. Secondly, the first connections of all other capacitors are also connected to the reference potential via their lasers. Since the associated capacitors of these lasers are essentially uncharged, these remaining capacitors force the potential of the second terminals of these capacitors, which form the second star point, to also be close to the reference potential. The first connections of the capacitors of the linear capacitor array are preferably connected to the charging circuit of the n charging circuits assigned to the respective capacitor of the n capacitors of the capacitor array via a bonding wire each having a third bonding wire length and which crosses the second star point. The third bonding wire length is preferably longer than the second bonding wire length. The second bonding wire length is preferably longer than the first bonding wire length.

[0112] This laser module defined in this way can be used in a LIDAR system. It is proposed to use the following basic structure of a LIDAR system: The proposed LIDAR system preferably comprises the said linear laser array of n lasers, a photosensor with a 2D photodetector array of n x m photodetectors (hereinafter sometimes also referred to as photodiodes ), with m photodetectors (m larger as an integer and primarily much larger than 1) in each n of columns or rows, a control circuit for the n lasers, n x m receiving circuits for the n x m photodetectors and an evaluation circuit for the measurement signals of the n x m receiving circuits. The optics of the LIDAR system preferably comprise a Powell lens on the laser side, i.e. for the laser beams, or a functionally equivalent optics, which will be included in the term Powell lens in the following, and on the photodetector side, i.e. in Beam path from the scene illuminated sequentially in strips by the laser to the photo sensor, preferably a second optic, hereinafter referred to as a receiver lens. Each laser of the n lasers emits a respective laser beam when supplied with electrical current. The Powell lens preferentially expands each laser beam into a fan of light. In reality, every light fan will have a highly elliptical radiation cross section perpendicular to its direction of propagation. For the purposes of this invention, the description assumes for simplicity that the short semi-axis of the cross-sectional ellipse or cross-sectional oval has a length of practically 0 cm. Since the real cross section is different from 0 cm, this does not limit the invention. This assumption of 0 cm fan thickness only serves to simplify the description. Each light fan has an opening angle. Each light fan has a light fan level and a fan origin point. The Powell lens is arranged relative to the linear laser array of the n lasers in such a way that the surface normals of the n light fan planes of the light fans of the n lasers preferably lie in a common plane with one another and together with the straight line along which the n lasers are preferably arranged are. The n lasers of the laser array preferably generate n laser beams, the n light fans of which are tilted perpendicular to their respective fan plane into a substantially common fan origin point by a respective fan angle relative to a freely selectable light fan of the n light fans, namely about a substantially common axis of rotation this fan origin point.

[0113] A similar tilting occurs on the photodetector side. For design reasons, each of the photodetectors typically already has a receiving lobe that describes the spatial direction-dependent sensitivity of the respective photodetector. All n x m photodetectors are preferably designed in the same way. They are preferably monolithically integrated on a semiconductor crystal. It is preferably one or n photodetector rows, with the m photodetectors being arranged linearly along a straight line for each photodetector row in the relevant photodetector row. However, it is also conceivable to use only one line of photodetectors. The n x m photodetectors are preferably semiconductor components. For example, there are avalanche photodiodes (English: avalanche photodiode (APD)) and / or single-photon avalanche photodiodes (English: single photon avalanche diode(SPAD)) in question. The receiver lens deforms the n x m reception lobes of the n x m photodetectors into n x m reception fans. Here too, for the sake of simplicity, it is assumed that the receiving compartments have a receiving compartment thickness of essentially 0 cm. In reality, this assumption is not correct and, analogous to the light fan of the laser, the receiving fan is actually a receiving lobe with a typically highly elliptical cross section. This simplification of the assumption of a receiving fan thickness of 0 cm is only intended to simplify the description and therefore does not limit the invention. The n x m receiving compartments now each have a receiving compartment level. This means that n x m receiving fan levels are defined by the second optics. Each receiving fan level of the n x m receiving fan levels of the n x m photodetectors is not parallel to the n laser fan levels of the n light fans of the n lasers. Preferably, each receiving fan level of the n x m receiving fan levels of the n x m photodetectors is perpendicular to each of the n laser fan levels of the n light fans of the n lasers. This preferably results in k = n x m crossing lines, which represent the sensitivity line of a pairing of the reception fan of one of the n x m reception fans, which is assigned to one of the n x m photodetectors, and a light fan of the n light fans, which is assigned to a laser of the n lasers. The Powell lens performs two functions in the system. These functions can be distributed over the two surfaces of the Powell lens. However, both functions can also be implemented with a single lens surface. These two functions are a. the vertical focusing of all lasers and b. the so-called horizontal flat fielding of the laser power, i.e. the uniform distribution of the laser power in order to homogeneously illuminate a line of the image to be recorded, with this uniform distribution being the same for all lasers.

[0114] A cylinder surface essentially realizes the function a. Higher order terms expand the mathematical function that describes the cylinder surface to minimize the imaging errors. The vertical radius of curvature is a function of the horizontal distance from the center of the lens, giving better focus at the ends of the lines.

[0115] A polynomial for the surface shape of the lens implements the function b. The polynomial describes the thickness of the lens as a function of the horizontal distance to the center. This allows the lens to redistribute the energy of the laser beams horizontally almost as desired.

[0116] A horizontal curvature of the lens described by a polynomial as a function of the horizontal distance to the center results in further optimization. This polynomial allows correction of the (cushion) distortion of the lens.

[0117] All polynomials also have a weak influence on the other functions (vertical focusing, horizontal energy distribution, distortion correction), so that all parameters must be coordinated during optimization. For this purpose, one function is optimized iteratively. The resulting errors in the other functions are then corrected one after the other. Through cyclic repetition, the design stabilizes with errors that typically become smaller and smaller. The whole thing is now repeated until the errors are small enough.

[0118] The parameters determined as examples during the creation of the invention are not yet fully optimized, but they are better than in the prior art.

[0119] The equations for the lens are: Equation for the surface structure of the front: z = RY + AR 2 * x 2 + AR 3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB 6 * x 6 + PC 2 * x 2 + PC 3 * x 3 mit RY = R 0 Y + AR 2 * x 2 + AR 3 * x 3 Here Sign() stands for the Signum function and Sqrt() stands for the root of the function parameter.

[0120] Here z stands for the distance to the x-y center plane, where the optical axis is the z-axis.

[0121] Equation of the surface structure of the back: z = − d + PC 2 * x 2 + PC 3 * x 3 This means:

[0122] xhorizontal axis yvertical axis zoptical axis R0Yradius of curvature of the cylinder term that determines the focal length. R0Y = 12.6 mm was used as an example in the invention. This radius of curvature is determined by the distance from laser to laser and the distance between the sensors in the sensor line, as well as the focal length of the receiver lens. It applies here f tx / p tx = f rx / p rx with f tx Focal length of the lens of the laser f rx Focal length of the lens of the sensor line p tx Distance from laser to laser p rx Distance from receiver to receiver in the sensor line dThickness of the lens in the optical center. In the invention, d = 2.2 mm was used as an example AR2, AR3 coefficients of the higher order polynomials for the gradient of the curvature PB2, PB3, PB4, PB6 coefficients that describe the horizontal thickness profile of the lens PC2, PC3 coefficients that describe the curvature of the lens (both surfaces the same ) describe.

[0123] As part of the development of the invention, various lenses were tested. The parameters of a first lens were as follows: AR2=0, AR3=0 PB2=-0.0085, PB3=0.0008, PB4=0, PB6=0 PC2=0, PC3=0

[0124] The parameters of a second lens were as follows: AR2=0.01, AR3=0.0006 PB2=-0.0085, PB3=0.0008, PB4=0, PB6=0 PC2=0, PC3=0

[0125] The parameters of a third lens were as follows: AR2=0.01, AR3=0.0005 PB2=-0.015, PB3=0.0015, PB4=-0.000024, PB6=0 PC2=0, PC3=0

[0126] The parameters of a fourth lens were as follows: AR2=0.028, AR3=-0.0028 PB2=-0.0115, PB3=0.00038, PB4=-0.000034, PB6=0.00000013 PC2=0.028, PC3=-0.0032

[0127] The electrical functions of an exemplary LIDAR system according to the invention are described below.

[0128] The control circuit now causes one of the n lasers to emit a laser light pulse at an emission time. For this purpose, a control circuit causes, for example, one of the n charging circuits of the previously described laser module to charge the capacitor assigned to it before emission. All other capacitors should be uncharged and remain uncharged for the duration of the process for emitting a light pulse by the laser assigned to the capacitor to be charged. After completion of the charging process, which is stopped, for example, in a time-controlled manner after a predefined or calculated time or is stopped after reaching or exceeding a capacitor target voltage, the charging circuit is preferably removed from the capacitor to be charged, for example by a switch and / or by switching the output to high resistance the charging circuit is separated. After one of the combinations of laser and capacitor of the n pairs of laser and associated capacitor is armed in this way by charging the capacitor, the capacitor can be suddenly discharged via the laser and the control switch by closing the same. For this purpose, a control circuit, which is preferably part of the control circuit, preferably generates a pulse signal which preferably closes said control switch and thus, for example, connects the cathode of the laser to the reference potential. The charged capacitor is preferably connected to this reference potential with its second connection and is preferably connected to the anode of the laser with its first connection. This means that the previously charged capacitor is suddenly discharged via the laser assigned to it. The laser emits a pulse of light. The other lasers of the n lasers do not emit a light pulse because their associated capacitors are not charged or not sufficiently charged. Theoretically it is possible to charge more than one capacitor and then gradually use different charging patterns and then calculate back to the simple case of a single charged capacitor.

[0129] The light pulse is now expanded into a fan of light via the Powell lens and emitted into the space in front of the device. In this free space, after a first light transit time, the light pulse then hits an object, assumed here as an example, and is reflected back there as a reflected light pulse. After a second light transit time, the reflected light pulse then reaches the second optics, which distributes the photons of the reflected light pulse to the n x m photodetectors. Here, the second optics then assigns a photon of the reflected light pulse to one of the n x m photodetectors if the propagation vector of the photon in question lies in the corresponding sensitivity fan that is assigned to this photodetector - or to put it another way - if the direction from which the photon came, in which sensitivity compartment lies.

[0130] Each photodetector and the receiving circuit assigned to it preferably detect the reflected light of this laser pulse within their respective receiving compartment. In addition, the receiving circuits preferably have means for recording the transit time of the light pulse from the time of transmission to the time of reception in the photosensor. This preferably results in n x m light transit time information for each laser pulse, which represents the light transit time of a light pulse from the time of emission (emission time) by a laser to the time of reception (reception time) by a respective photodetector as a light pulse reflected from the scene. This light travel time information can be converted into a length or a distance using the speed of light, for example the speed of light in air.

[0131] If this measurement is carried out for each of the n lasers, k = n x m light transit time values ​​and thus k = n x m distances are obtained from the resulting n measurements, namely a distance for each image point assigned to a photodiode.

[0132] In order to obtain these distances, the respective receiving circuit passes on the respective measured value for the reception time of the respective laser pulse at the respective photodiode to the evaluation circuit. This receives information from the control circuit as to which of the n lasers emitted the light pulse. From this, the evaluation circuit can then determine which sensitivity line belongs to which distance. It should be noted that a sensitivity line in the sense of this invention arises from the pair of the receiving fan of one of the n x m photodiodes and one of the light fans of the n lasers.

[0133] After all n lasers in the laser array have emitted a light pulse once, there are k distances for the k sensitivity lines. If these are plotted on the sensitivity line, there is exactly one point for each sensitivity line that caused the reflection of the light pulse for the light fan of this sensitivity line and was received by the photo sensor with the sensitivity fan of this sensitivity line. In this way, k = n x m positions are determined in three-dimensional space, which can preferably be converted from the distance sensitivity line coordinate system, for example, into a Cartesian coordinate system for further use.

[0134] The evaluation circuit thus creates a three-dimensional pixel cloud from the angle of the laser fan of the respective laser pulse and the angle of the respective reception fan of the respective photodetector and the respective reception time of the respective laser pulse at the respective photodetector based on the respective transmission time.

[0135] It is particularly advantageous if the n surface normals of the n light fans have angular distances (a 1.2, a 2.3, a 3.4, to a n-2,n-1, a n-1,n) which are between each two adjacent light fans are essentially the same.

[0136] It is also particularly advantageous if the n x m surface normals of the n x m sensitivity fans have m angular distances (b 1.2, b 2.3, b 3.4, to b m-2,m-1, b m-1,m) in the Have horizontals that are essentially the same between two adjacent sensitivity compartments.

[0137] It is particularly advantageous to use the laser module described above in a previously described LIDAR system.

[0138] The invention further includes a laser module with a linear laser array of n lasers, with n as an integer positive number. The n-lasers are preferably mounted on a module carrier and / or a driver IC. Each laser beam of each laser has a laser beam axis. All laser beam axes and / or at least two laser beam axes intersect at one point. Building on this, a collection of p laser modules, with p as an integer positive number, can be defined, in which each laser module has a linear laser array of n lasers, with n as an integer positive number, and where the lasers of each Modules can be numbered in the same way and each laser beam of each laser has a laser beam axis and the laser beam axes of the kth laser, with 0<k≤n, of all p laser modules are in a common point intersect and / or where the laser beam axes of the k-th laser, with 0<k≤n, of at least two of the p laser modules intersect at a point.

[0139] However, it is better if the laser beam axes of all n x p lasers of all p laser modules intersect at a common point. Alternatively, at least two laser beam axes of at least two lasers of the n x p lasers of all p laser modules can intersect at a point. The driver IC is preferably the said integrated circuit. Such a driver IC preferably has a rectangular shape. The driver IC then has two narrow sides and two long sides as edge sections. The driver IC preferably has contacts or a contact DisC on a first edge section of rectangular shape, which is formed by one narrow side, which are intended and suitable for contacting one or more rear contacts of diode lasers. On a second edge section of its rectangular shape, which is formed by the other narrow side, the IC has contacts VDDA, GNDA, VDDD, GNDD, VDDP, GNDP, VDDH, GND, which supply the power to the driver IC and / or the said laser D1 to Dn and / or the energy storage associated with them, i.e. the capacitors C1 to Cn. The first edge section is opposite the second edge section.

[0140] The driver IC preferably has at least one transfer contact for a signal on a third edge section of its rectangular shape, which is formed by one long side, which can be passed on to other driver ICs. The driver IC has a further transfer contact on a fourth edge section of its rectangular shape, which is formed by the other long side, which is electrically connected to the transfer contact of another driver IC.

[0141] Preferably, one of the transfer contacts is a contact for a reset signal RES, which sets the driver IC into a defined state. A transfer contact is preferably a contact for a trigger signal TRIG, which causes the driver IC to control its lasers D1 to Dn in a predetermined signal state, if this is intended due to the system state. One or more transfer contacts are preferably intended for receiving signals from a data bus. The one or more transfer contacts on one edge section of the driver IC are preferably directly electrically connected to one or more corresponding transfer contacts on the opposite edge of an adjacent driver IC. However, it is also conceivable that a linear data bus (e.g. a LIN bus) is at least temporarily interrupted by the driver ICs as bus nodes and internal device parts of the driver IC receive and record the data on one side of the driver IC the other side of the IC can also be sent in a modified form if necessary. In this case, the signals from the one or more transfer contacts on one edge section of the driver IC are transmitted before being forwarded to one or more corresponding transfer contacts on the opposite edge section of an adjacent driver IC in a sub-device of the driver IC. especially in a data bus interface.

[0142] Furthermore, this invention includes a compilation of laser modules to form, in particular, a LIDAR system with at least two laser modules, i.e. with at least a first laser module and a second laser module, the laser modules essentially having a cuboid shape with two narrow sides and two long sides and where the laser modules are arranged with their long sides next to each other.

[0143] The laser modules each have a driver IC in a cuboid housing, as described above, which are arranged next to each other on a carrier.

[0144] The driver ICs of the laser modules are typically identical in terms of the transfer contacts used on their driver ICs. Each transfer contact of the driver IC of the first laser module is then preferably electrically connected to the corresponding transfer contact of the driver IC of the second laser module by means of a single bonding wire per such transfer contact pair. This has the advantage that only small losses occur. This is particularly advantageous for a fast, synchronous transmission of the trigger signal TRIG, since all lasers should fire successively in a time-coordinated manner and thus emit their radiation packet.

[0145] The invention also includes a special capacitor array for a laser module and / or for an assembly of laser modules and / or for use together with a driver IC, as respectively described above. For example, the capacitor array has a rectangular shape and has a top and a bottom. On its top side, the capacitor array has n contacts K1' to Kn' lined up along a first edge of the rectangle. The capacitor array has a further contact KG', which extends along a second edge of the rectangle on the top of the capacitor array. The second edge of the rectangle is opposite the first edge of the rectangle. The further contact KG' extends along the third and fourth edges by a distance that is shorter than the extent of the third and fourth edges of the rectangle and ends at a distance from the contacts K1' to Kn'. The capacitor array has a bottom contact KR that covers the bottom of the capacitor array. Each of the n contacts K1' to Kn' forms a capacitance C1 to Cn with the rear contact KR, the further contact KG' forming a further capacitance CVDD with the rear contact KR and the capacitors C1 to Cn and CVDD having a common dielectric extends between the n contacts K1' to Kn' and the further contact KG' on the one hand and the underside contact KR on the other hand.

[0146] The presented devices can be used as a LIDAR system or as part of such a LIDAR system in a mobile device. For example, the mobile device can in particular be a robot or a missile or a spacecraft or a hull or a watercraft or a vehicle or a rail vehicle or an aircraft or a spacecraft. By oscillating the mobile device, the resolution of the distance information of the illuminated scene can be increased.

[0147] The devices presented can be used as a LIDAR system or as part of such a LIDAR system in automation technology. They can be used, for example, in a device for detecting the shape of an object or a building or in a device for automating processes or in a device for three-dimensionally detecting the shape of three-dimensional bodies.

[0148] The proposed laser module enables the generation of short light pulses for a LIDAR system that does not require moving parts. However, the advantages are not limited to this.

[0149] The light module, the common capacitor component, the combination of several light modules, the circuit die and the integrated circuit for switching electrical currents, as described above and defined in the version of the claim with regard to their features, are to be viewed as independent inventions that are also implemented independently of one another can be. The same applies to the features of the individual subclaims of the claim version, which define an independent invention and do not necessarily have to be exclusively related to other features of other subclaims.

[0150] The features of the invention or the individual aspects of the invention described above and / or below are to be understood as independent, individual features, even if they are described in connection with other features, both individually and with those associated with them, if applicable Additional features described in connection can be implemented independently and are essential to the invention.

[0151] If “light” from the diodes or reflected light is mentioned above and below, this primarily means light in a wavelength range outside that for visible light. However, the invention can also be implemented with visible light.

[0152] The invention is described in more detail below using several exemplary embodiments. In detail we show: Fig. 1 shows the beam path of an exemplary LIDAR system with exemplary n = 4 lasers and exemplary m = 256 photodetectors of a sensor in the top view and the side view, whereby the first laser emits a laser pulse and its laser surfaces illuminate the first line of an image is detected by the photodiodes of the first row of the sensor through light reflection, Fig. 2 shows the beam path of the LIDAR system with the four lasers and the 256 photodetectors in top and side view, with the second laser emitting a laser pulse, Fig. 3 shows the beam path of the LIDAR -System with the four lasers and the 256 photodetectors in the top view and the side view, with the third laser emitting a laser pulse, Fig. 4 shows the beam path of the LIDAR system with the four lasers and the 256 photodetectors in the top view and the side view, with the fourth laser emits a laser pulse, Fig. 5 shows an exemplary circuit for the proposed LIDAR system, Fig. 6 shows a proposed structure of a laser module for the LIDAR system Fig. 5 , Fig. 7 is a schematic representation of the hybrid structure consisting of the carrier with circuit die and with various electrical and electronic components in die-to-die connection to connection panels on one main side of the carrier, Fig. 8 is an arrangement with several laser modules Fig. 6 ,Figs. 9A, 9B, 9C, a capacitor array C1 to C4 and CVDD for use in a laser module according to the Fig. 7 in plan, side view and the internal circuitry of the capacitor array, Fig. 10, the structure of a proposed driver IC in plan, Fig. 11, the arrangement of the laser modules on the driver IC level, Fig. 12, the alignment of the laser modules Fig. 11along a curved line , Fig. 16 shows a real measurement result as a point cloud in an exemplary Cartesian coordinate system as the target coordinate system with n = 16 lasers and m = 256 photodetectors in the photodetector line, Fig. 17 shows a drone according to the invention with a LIDAR module attached to it, Fig. 18 shows the optimal positioning of the scanning points a flat surface that is set up at a certain distance from the sensor system and whose surface normal is aligned parallel to the measuring axis of the sensor system, Fig. 19 a lens without correction polynomials, Fig. 20 a lens with the parameters AR2 = 0.01, AR3 = 0.0006, PB2 = -0.0085 , PB3=0.0008, PB4=0, B6=0, PC2=0, PC3=0, Fig. 21 a lens with the parameters AR2=0.01, AR3=0.0005, PB2=-0.015, PB3=0.0015, PB4=-0.000024, PB6=0, PC2=0, PC3=0, Fig. 22 a lens with the parameters AR2=0.028, AR3=-0.0028, PB2=-0.0115, PB3=0.00038, PB4=-0.000034, PB6=0.00000013, PC2=0.028, PC3=-0.0032, Fig. 23 an exemplary, reduced to the essential, circuit according to the prior art for controlling a laser diode LD by means of a driver circuit I and an unspecified pre-driver circuit and a field effect transistor M, Fig. 24 in the parts of the figure (a) to (f) simplifies the basic concept of self-similarity based on the circuit diagram and the circuit layout, Fig. 25 in the figure part (a) a simplified layout of a basic structure of the self-similar structure according to the invention as a stick layout and in the figure part (b) like other basic structures combined so that the self-similar structure according to the invention ultimately results, and FIG. 26 is a simplified representation of the self-similarity of the circuit layout.

[0153] In the exemplary embodiments of Figs. 1 to 4 The components of a LIDAR system are shown schematically, which has a transmitter in the form of a laser diode row LDZ made up of n = four lasers D1, D2, D3, D4 and a receiver in the form of a 2D (photodiode) sensor S with four lines and a number of n = 256 photodiodes per line as well as lenses (transmitter lens SL and cylindrical lens ZL) for fanning out the beams of the laser to form a highly elliptical cross section for illuminating a line of a distance image to be recorded and a lens (receiver lens EL) for imaging the illuminated line in each case.

[0154] Fig. 1 shows the beam path of the LIDAR system in top and side view when the first laser D1 emits a laser pulse. The first laser D1 emits a light pulse which is expanded into a first light fan LF1 by the lens SL, ZL, which preferably has a Powell lens. The first light fan LF1 is shown in dashed lines. The first light fan LF1 illuminates a first strip of the room or scene (distance image) in front of the LIDAR system. A receiver lens EL images this illuminated first (image) strip onto a line of the sensor S. In Fig. 1 (as well as in the Figs. 2 to 4 ) the image of the two image points at the two ends of the illuminated image strip onto the two photodiodes at the two ends of the relevant row of photodiodes of the sensor S is illustrated by the dotted and solid lines. The illuminated first image strip is different from the second illuminated image strip ( Fig. 2 ), from the third illuminated image strip ( Fig. 3 ) and from the fourth illuminated image strip ( Fig. 4 ) different. In the example of the Fig. 1 The sensor array includes 256 photodiodes per line. This sensor line thus records an image strip. The receiver lens EL is also preferably a Powell lens.

[0155] Fig. 2shows the beam path of the LIDAR system in top and side view when the second laser D2 emits a laser pulse. The second laser D2 emits a light pulse which is expanded into a second light fan LF2 by the lens SL, ZL, which preferably has a Powell lens. The second light fan LF2 is shown in dashed lines. The second light fan LF2 illuminates a second strip of the room or scene (distance image) in front of the LIDAR system. A receiver lens EL images this illuminated second strip onto a line of the sensor S. The illuminated second image strip is from the first illuminated image strip Fig. 1 , from the third illuminated image strip of the Fig. 3 and from the fourth illuminated image strip of the Fig. 4 different.

[0156] Fig. 3 shows the beam path of the LIDAR system in top and side view, with the third laser D3 emitting a laser pulse. The third laser D3 emits a light pulse which is expanded into a third light fan LF3 by the lens SL, ZL, which preferably has a Powell lens. The third light fan LF3 is shown in dashed lines. The third light fan LF3 illuminates a third strip of the room or scene (distance image) in front of the LIDAR system. A receiver lens EL images this illuminated third strip onto a line of the sensor S. The illuminated third image strip is from the second illuminated image strip Fig. 2 , from the first illuminated image strip of the Fig. 1 and from the fourth illuminated image strip of the Fig. 4 different.

[0157] Fig. 4 shows the beam path of the LIDAR system in top and side view, with the fourth laser D4 emitting a laser pulse. The fourth laser D4 emits a light pulse which is expanded into a fourth light fan LF4 by the lens SL, ZL, which preferably has a Powell lens. The fourth light fan LF4 is shown in dashed lines. The fourth light fan LF4 illuminates a fourth strip of the room or scene (distance image) in front of the LIDAR system. A receiver lens EL images this illuminated fourth strip onto a line of the sensor S. The illuminated fourth image strip is from the second illuminated strip Fig. 2 , from the third illuminated image strip of the Fig. 3 and from the first illuminated image strip of the Fig. 1 different.

[0158] Fig. 5 shows an example circuit for the proposed LIDAR system. A control circuit CTR causes one of the n charging circuits B1 to Bn to charge a capacitor C1 to Cn via a charging line K1 to Kn assigned to this charging circuit. Each of the n charging lines K1 to Kn has a (mainly parasitic) resistance RZ1 to RZn and a parasitic inductance LZ1 to LZn. Each of the charging lines K1 to Kn is preferably connected to a first connection of exactly one of n capacitors C1 to Cn. The second connection of each of the n capacitors C1 to Cn is connected to the reference potential via a line. Each of the lines between the second terminal of a capacitor C1 to Cn and the reference potential includes a parasitic resistor RC1 to RCn and a parasitic inductor LC1 to LCn. The anode, preferably exactly one of the n lasers D1 to Dn, is preferably connected to the first connection, preferably exactly one of the n capacitors C1 to Cn, via preferably exactly one of n discharge lines K1' to Kn'. The cathodes of the n lasers D1 to Dn are connected together to form a common first star point DisC. This common star point is connected to the reference potential GND through the control switch T dis when the pulse signal G dis arrives. The second connections of the n capacitors C1 to Cn are also connected to the reference potential GND.

[0159] An exemplary buffer Buf generates the pulse signal G dis from the pulse pre-signal PL to open the control switch T dis. The control circuit CTR can preferably generate this pulse advance signal PL when the charging process for the capacitor to be charged is completed by the associated charging circuit B1 to Bn and the relevant charging circuit B1 to Bn is switched neutral.

[0160] A backup capacitor CVDD is preferably part of the capacitor array KA of the n capacitors C1 to Cn. The backup capacitor CVDD stabilizes the supply voltage VDD or another system-relevant voltage. It serves to prevent the effects of the current surges that occur when the laser is ignited on other components connected to the VDD supply voltage, for example in a vehicle with the VDD supply voltage as the on-board electrical system voltage.

[0161] The backup capacitor CVDD is connected to the supply voltage VDD at its first connection via a line inductance LZV and via a line resistance RZV.

[0162] The backup capacitor CVDD is connected to the reference potential GND at its second connection via a line resistance RCV and a line inductance LCV.

[0163] Fig. 6 shows an exemplary embodiment of the structure of a laser module for the LIDAR system Fig. 5 .

[0164] The basis of the module is the driver IC. The driver IC is preferably a monolithically integrated circuit. It preferably includes the control circuit CTR and all other micro-integrable (e.g. CMOS) circuit parts Fig. 5 . These can be, for example (but not exclusively), the control circuit CTR, the buffer Buf, the control switch T dis and the n charging circuits B1 to Bn. Furthermore, the control circuit CTR can include, for example, a microcomputer with memory, interfaces and CPU. These together form the control circuit. In the example of the Fig. 6 For example, n = 4 lasers D1 to D4 are used, which are manufactured, for example, on a common crystal and form a linear laser array. The underside of this crystal forms the common cathode of the laser diodes, which is electrically connected as the first star point DisC to a control switch that is made in the crystal of the driver IC and is located on its active surface. Flip-chip assembly makes it possible to create this connection with only low parasitic inductance and resistance values, which increases the edge steepness of the laser pulses. The thermal cooling of the n lasers takes place via the crystal of the driver IC. The four capacitors C1 to C4 are also designed as a common component. In the example of the Fig. 6 the second connections of the four capacitors C1 to C4 are connected to one another by a common contact. The first connection of each capacitor C1 to C4 is connected to the laser assigned to it of the four lasers D1 to D4 via one of the four discharge lines K1 'to K4'. The discharge lines K1' to K4' are particularly short due to the selected arrangement. The shown multiple bonding wire connection of the discharge lines K1' to K4' leads to a further reduction in the parasitic inductance and thus to a further increase in the edge steepness. Likewise, the short bonding wires of the connection between the (second) star point DisK as a common connection point of the capacitors C1 to Cn and the reference potential together with the multiple bonding wire connection lead to a reduction in the parasitic inductance of this line connection. This also increases the edge steepness of the emitted light pulse.

[0165] The relatively long bonding wires of the charging lines K1 to Kn are more beneficial for the edge steepness, since they prevent or largely suppress the electrical charge of the capacitors C1 to Cn from flowing out via these charging lines K1 to Kn.

[0166] A backup capacitor CVDD can be part of the capacitor array KA as shown. The backup capacitor CVDD is connected to the reference potential GND on a bottom side with a second connection with a very low line resistance RCV and a very low line inductance LCV. The first connection of the backup capacitor CVDD is connected to the virtual node KG' of the supply voltage VDD. The virtual node KG' of the supply voltage VDD is connected to the supply voltage VDD with very short bonding wires. As a result, the virtual node KG' of the supply voltage VDD is connected to the supply voltage VDD with a very low line resistance RZV and a very low line inductance LZV.

[0167] In Fig. 7 is as a realization of the circuit Fig. 5a hybrid structure of the laser module is shown schematically, which has, for example, a plastic casting compound as the carrier TR. A circuit die and a lead frame are embedded in the carrier TR; Both are not shown for clarity. The control circuit CTR, the transistor driver Buf and the charging circuits B1 to Bn are designed as integrated circuits of the circuit die. Furthermore, the transistor T dis is located as close as possible to the top of the circuit die. Like in the Figs. 5 and 7 shown, the transistor T dis has a line path LPF, the end regions LPF1, LPF2 of which are electrically routed to the top side TRO via a first line path connection field TAF1 and a second line path connection field TAF2. On the first line path connection field TAF1 there are the laser diodes D1 to Dn, which are electrically connected to the first line path connection field TAF1 by die-to-die bonding to the bottom first connection field DAF1 of their respective die D1D. In the same way, the capacitors C1 to Cn are connected to the second line path connection field TAF2 of the transistor Tdis. For this purpose, each capacitor C1 is designed, for example, as a separate charge storage component LSBT, with all capacitors C1 to Cn in combination also being able to form a common charge storage component (see, for example, the capacitor array KA in this context). Fig. 6 ). The charge storage components LSBT have a first connection field LAF1 on the bottom, which is electrically connected to the second line path connection field TAF2 by die-to-die bonding.

[0168] On the top side of both the laser diode die D1D and the charge storage component LSBT there is a second connection field DAF2 and LAF2, which are electrically connected to one another by means of a short first bonding wire BD1. These first bonding wires BD1 form the lines K1' to Kn'.

[0169] In addition, the capacitors C1 to Cn are each electrically connected via longer second bonding wires BD2 to connection panels AF of the charging circuit B1 to Bn assigned to them on the top side TRO of the carrier TR. Also shown is a third bonding wire BD3, which connects the supply voltage potential VDD, which is applied to a top-side connection panel of the carrier TR, to the backup or buffer capacitor CVDD, which in turn is connected to the reference potential GND with its second contact. For this purpose, the support or buffer capacitor CVDD is designed as a separate component or a component integrated in the capacitor array KA, which is also electrically connected, for example by die-to-die bonding, to the second line path connection field TAF2, to which the reference potential is applied.

[0170] In Fig. 7 is visualized by the spreading line pairs, which are parasitic components in the discharging circuit and in the charging circuit according to the circuit Fig. 5 correspond to the individual components of the hybrid structure. It should be noted that ultimately the lead frame, which is in Fig. 7 is not shown, and the internal connections in also in Fig. 7 circuits not shown which contribute to the parasitic components.

[0171] In Fig. 7 it is then finally indicated that the Figs. 26 ff shows a representation of the details of driver Buf and transistor Tdis. The output of the driver Buf is connected to the control terminal GT dis of the transistor

[0172] Fig. 8 shows an arrangement with several laser modules Fig. 6 . The control logic and the control are preferably designed in such a way that only one of the lasers of all laser modules generates a light pulse, with the control of all lasers arranged next to one another taking place sequentially from one laser to, for example, the neighboring laser.

[0173] The Figs. 9A, 9B and 9C show a capacitor array KA with capacitors C1 to C4 and CVDD for use in a laser module according to Fig. 8 in supervision ( Fig. 9A ), in a side view ( Fig. 9B ) and the internal circuitry of the capacitor array ( Fig. 9C ).

[0174] The capacitor array KA made of C1 to Cn and CVDD is preferably rectangular. The contact surfaces for the discharge lines K1' to Kn' are arranged next to each other on the top side, preferably along a first edge of the rectangle (see Fig. 9A ). The distance from the center of a contact surface for connecting a discharge line to the center of the contact surface for connecting the next discharge line preferably corresponds to the distance between the geometric centers of gravity of the corresponding laser (see D1 to Dn in Fig. 6 ). The lasers and these contact surfaces of the capacitor array KA therefore preferably have the same pitch = distance from center to center. In the example of the Fig. 9 This distance is, for example, 500 µm.

[0175] The contact surface for the virtual node KG 'of the supply voltage VDD, which corresponds to the first connection of the backup capacitor CVDD, extends along the second edge of the rectangle opposite the first edge of the rectangle.

[0176] The contact surface for the virtual node KG' of the supply voltage VDD preferably extends along the entire second edge of the rectangle. In the example of the Fig. 9 the length of this extension is slightly less than 2000 µm.

[0177] The possibly n contact surfaces for the connections of the discharge lines K1' to Kn' therefore only take up a section along the first edge of the rectangle, which is smaller than 1 / n of the length of the first edge of the rectangle. In the example of the Fig. 9 this extension is only 375 µm. The area of ​​these contacts is in the Fig. 9 for example 0.17 mm 2<.

[0178] The extension of the possibly n contact surfaces for the discharge lines K1' to Kn' along the third and fourth edges of the rectangle, which is 450 µm in this example, is therefore typically longer than the extension of the contact surface for the virtual node KG' of the supply voltage VDD, which in this example is 100 µm. The size of the contact area for the virtual node KG' of the supply voltage VDD is approximately 0.2 mm 2<.

[0179] A bottom contact KR of the capacitor array KA (see Fig. 9B ) forms the common contact for connecting the common reference potential GND.

[0180] The material between the contact surfaces for the nodes K1' to Kn' and KG' forms the dielectric of the capacitor array KA. One of the capacitors C1 to Cn and CVDD is then formed between each contact surface for the nodes K1' to Kn' and KG' and the bottom contact KR.

[0181] The example of Fig. 9 For a better overview (like the other examples in this description), this is aimed at n = 4, but this should not be understood as limiting in any way.

[0182] Fig. 10 shows the structure of a single proposed driver IC in top view. The structure is roughly simplified and limited to the essential features.

[0183] As already mentioned elsewhere in this description, the number n of lasers D1 to Dn of the module is limited to n = 4 by way of example for a better overview. For a different number n of lasers, the principles of this description can be applied accordingly. Here n is used instead of the number 4, even if the figure shows n = 4. n is always to be understood as a completely positive number. On the top side of the driver IC there are four example contact surfaces for the rear contacts of the four example lasers D1 to D4 of the laser module. Each of the four contact surfaces is connected to the first star point DisC. Instead of four separate contact surfaces, a single contact surface is of course also conceivable.

[0184] Related to the orientation of the representation of the driver IC in Fig. 10 There is a contact surface GND below the contact surfaces DisC, which is connected to the reference potential GND. The capacitor array KA is placed on this contact surface. This connects the underside contact KR of the capacitor array KA to the reference potential GND.

[0185] Also related to the orientation of the representation of the driver IC, below the contact area GND there is a contact area VDD for the bonding wires, through which the first connection of the supporting capacitor CVDD of the capacitor array KA, which is the virtual node KG 'of the supply voltage VDD, is connected to the supply voltage VDD.

[0186] Below the contact area VDD (again based on the orientation of the representation of the driver IC) are the n bonding areas (here, for example, n = 4) for the outputs of the driver circuits B1 to Bn (here n = 4). Using long bonding wires, which represent the charging lines K1 to Kn (here n = 4), the capacitors C1 to Cn, which serve as energy reserves for the lasers D1 to Dn (here n = 4), are charged by the driver circuits B1 to Bn.

[0187] In the example of the Fig. 10 The proposed driver IC requires several supply voltages via several supply voltage contacts VDDA, GNDA, VDDD, GNDD, VDDP, GNDP, VDDH, GNDH. When the invention was created, it was recognized that it is advantageous to supply the supply voltages to the driver IC in a low-resistance manner via its edge opposite the lasers, since in this way each driver IC can have its own low-resistance supply line.

[0188] Furthermore, it was recognized that signals that can also be applied to the driver ICs with high impedance can be looped through the ICs. In the example of the Fig. 10 These are, for example, the reset signal RST, which is connected horizontally to a corresponding connection on the opposite side of the driver IC. Furthermore, this is the case in the example Fig. 10 An SPI data bus is shown as an example of a data bus. The input of the SPI data bus MOSI and the output of the SPI data bus MISO and the clock of the SPI data bus SCK have counterparts on the opposite side of the driver IC. A selection signal (English: Chip-Select CS) is also looped through. The ignition signal for firing the laser pulse is fed to the TRIG connection on one side of the driver IC and looped through unchanged to the other side.

[0189] The module's lasers are fired with the edge of this ignition signal.

[0190] Another optional example of a signal that is fed to all driver ICs and is also looped through is connected to the Pulse connection. It can be, for example, a diagnostic signal from a diagnostic interface.

[0191] Fig. 11 shows the arrangement of several laser modules Fig. 10 at driver IC level.

[0192] The contact surfaces on the long sides of two adjacent driver ICs are connected to each other by bonding wires. It is clear that this design ensures a low-resistance supply of electrical energy to all laser modules because the control signals are looped through.

[0193] Fig. 12 shows the alignment of the laser modules Fig. 11 along a curved line KL. This has the advantage that the generation of the laser beam fan is massively simplified. First, the laser modules can be aligned perpendicular to this curved line KL. Secondly, within a laser module, the lasers can be aligned along this curved line KL, so that ultimately all lasers of all modules are aligned along this curved line KL. The curved line KL can be convex or concave. The laser beam of each laser of each laser module has a laser beam axis. If only the laser modules are aligned along the curved line KL and this curved line KL is a circular arc section, the laser beam axes of the first laser D1 of all laser modules intersect at a common point in space. This can also be behind the lasers.

[0194] If the lasers D1 to Dn of a laser module are aligned along a curved circular line KL, the laser beam axes of the lasers D1 to Dn of this laser module intersect at a point.

[0195] If the lasers D1 to Dn of all laser modules are aligned along a curved common circular line KL, the laser beam axes of the lasers D1 to Dn of all laser modules intersect at a point.

[0196] An alignment of only part of the lasers and / or only part of the laser modules along the curved line KL should not be ruled out.

[0197] The invention is not limited to the arrangement or juxtaposition of several light modules, each with, for example, four laser diode dies. For example, the arrangement of at least four in the Figs. 8th , 11 and 12 The light modules shown can also be realized by a single light module, on which the laser diode dies are then arranged either along a straight line or along the curvature line KL (see Fig. 13 ). Connection fields for the aforementioned signals and voltages to be applied to the light module(s) are arranged along the outer edge of such a light module, which is larger in size. The overall light module can either have a common and therefore large-area capacitor array KA or several partial capacitor arrays.

[0198] Fig. 14 shows an example Powell lens. The surface is curved about a first axis A1 on the first surface OF1 and curved about a second axis A2 on the second surface OF2. The two axes are oriented perpendicular to each other. ME denotes the xy center plane in the center of the lens related to the z extent (extension in the direction of the optical axis) of the lens.

[0199] Fig. 15 shows an exemplary arrangement of the transmission system with the transmitter lens and the receiver system with the receiver lens. The laser diode (array) rows LDZ with n = 4 laser diodes, as described above as an example, and the sensor S with n = 4 rows, each with e.g. 256 pixels, are shown in an exploded view and schematically. For example, if four laser modules are used, as in the Figs. 8th , 11 and 12 shown, this would result in a laser diode row LDZ with 16 laser diodes and a photo sensor with 16 lines of e.g. 256 pixels.

[0200] Fig. 16 shows a real measurement result as a point cloud in an exemplary Cartesian coordinate system as the target coordinate system with n = 16 lasers and m = 256 photodetectors in the photodetector row.

[0201] Fig. 17 shows a drone according to the invention with a mounted LIDAR system according to the invention. The lidar system according to the invention can be used very well for drones because it is particularly light and has no mechanical parts, such as oscillating mirrors.

[0202] Other prior art solutions are not as compact and cannot provide this information at this low weight and power consumption.

[0203] The proposed LIDAR system can also be used in other vehicles, floating bodies, missiles, rail vehicles, as a scanner in automation technology and the like. It is advantageous if the vehicle performs oscillating pitching movements so that the "gaps" in the distance image, which are caused by the distance between adjacent photodetector lines of the sensor, can be scanned, which can increase the image resolution. A complete distance image is recorded for each pitch angle and the information from the photodetector lines is then combined to form the complete image. This also provides information about areas of the distance image that would be imaged onto the spaces between adjacent photodetector lines of the sensor without nodding movements being carried out.

[0204] Fig. 18is intended to illustrate the problem of a possible inhomogeneity in the light intensity distribution of the laser light within an illumination strip. The images of the laser diode beams after passing through the transmitter optical element SLE are shown as rectangles on the horizontal. The beam from a laser diode typically has an elliptical cross section. If the intensity is now determined along a main axis of this cross-sectional ellipse or this cross-sectional oval and entered into an xy diagram that has the position along this main axis as the x-axis and the radiation intensity as the y-axis, then laser diodes typically show a Gaussian-shaped intensity distribution. The optics now expand the laser beam of a laser diode in one direction, so that ideally a rectangular, evenly illuminated area should result in the far field on a projection surface perpendicular to the optical axis of the expansion lens and the laser. However, this is not the case due to imaging errors. In Fig. 18 Vertical lines are shown. The area of ​​a rectangle piece of one of the horizontal rectangles, which is located between two vertical lines, should always receive the same amount of light from rectangle piece to rectangle piece when illuminated by the laser associated with this rectangle. So ideally all rectangle pieces should be the same and, as in Fig. 18 shown, positioned. In real cases, however, the optics have errors and the laser beam cross section shows a Gaussian instead of a rectangular intensity distribution across the cross section.

[0205] The Figs. 18 to 22 each show only the upper left quadrant of the projection field of the transmitter optical element SLE, which is rectangular and thus has four quadrants separated by two mutually perpendicular axes of symmetry.

[0206] The camera with the photodetectors images the irradiated points onto the n photodetector rows, each with q photodetectors. In the examples of Figs. 18 to 22 It is assumed that the photodetector array has n = 16 rows and q = 256 pixels. Each of the n lasers in the laser module illuminates one line. The optics then expand the laser beam of a jth laser of the n lasers with 1≤j≤n = 16 according to the width of the line. The laser beam of the jth laser is thus expanded horizontally. The density or the spacing of the vertical lines of the Fig. 18 represents the desired energy density in the far field. Each of the n lasers of the laser module thus illuminates a line of the image, which is then scanned by a line of the photodetector array, here for example a photodetector array with 16 photodetector lines, each with 256 photodetectors. The normal intensity distribution over the line without correction is also a Gaussian distribution due to the Gaussian intensity distribution within the laser beam cross section. The task of the optics described here is to remedy this.

[0207] Each of the n photodetector rows is in the examples Figs. 18 to 22 assigned to exactly one laser.

[0208] Instead, through defocusing, each of the n lasers can illuminate r photodetector lines by means of reflection in the vehicle surroundings. The number of possible photodetector rows is then r+n. It therefore makes sense to use (n+r) x q photodetectors in this case, which are organized in r+n photodetector rows. Each of the n lasers is then assigned exactly r photodetector lines.

[0209] Instead of defocusing, multi-segment lenses can also be used.

[0210] The n lasers are preferably arranged within the laser module in a one-dimensional laser array perpendicular to the expansion plane of the photodetector lines.

[0211] For the sake of completeness, it should be mentioned that, for reasons of space, n = 4 lasers per laser module are assumed elsewhere in this document in order to simplify the representation.

[0212] Fig. 19 shows the first lens without correction polynomials. Only the parameters B2 and B3 are different from 0. The equations are accordingly: z = R 0 Y − Sign R0Y * Sqrt R0Y 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 und z = − d . Like based on Fig. 19can be seen, the energy distribution at the edges and especially in the corners differs significantly from the desired distribution Fig. 18 away.

[0213] Fig. 20 shows a lens corresponding to the parameters of the first lens with AR2=0.01, AR3=0.0006, PB2=-0.0085, PB3=0.0008, PB4=0, PB6=0, PC2=0, PC3=0. The equations are now: z = RY + AR 2 * x 2 + AR 3 * x 3 − Sign RY * Sqrt RY2 − y 2 + PB 2 * x 2 + PB 3 * x 3 mit RY = R 0 Y + AR 2 * x 2 + AR 3 * x 3 und z = − d .

[0214] Fig. 21 shows a lens corresponding to the parameters of the second lens with AR2=0.01, AR3=0.0005, PB2=-0.015, PB3=0.0015, PB4=-0.000024, PB6=0, PC2=0, PC3=0. The equations are now: z = RY + AR 2 * x 2 + AR3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 mit RY = R 0 Y + AR 2 * x 2 + AR3 * x 3 und z = − d . The distribution of energy is almost optimal.

[0215] Fig. 22 shows a lens corresponding to the parameters of the third lens with AR2=0.028, AR3=-0.0028, PB2=-0.0115, PB3=0.00038, PB4=-0.000034, PB6=0.00000013, PC2=0.028, PC3=-0.0032. The equations are now: z = RY + AR 2 * x 2 + AR3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB6 * x 6 + PC 2 * x 2 + PC 3 * x 3 mit RY = R 0 Y + AR 2 * x 2 + AR3 * x 3 und z = − d + PC 2 * x 2 + PC3 * x 3 .

[0216] Again Fig. 22 As can be seen, the distribution is now almost optimal and the errors are negligible in real cases.

[0217] In various technical applications, laser diodes or light-emitting diodes are controlled by driver circuits, typically using short high-current pulses. High currents flow in the driver circuits with short switching times. High-current capable CMOS transistors with low drain-source resistance used in the driver circuits extend over large areas, which limits the switching speed due to the limited propagation speed of the gate signal. A LIDAR system is mentioned as an application example.

[0218] With a self-similar structure according to the invention of a driver circuit of the type described above, the object is achieved according to the invention in that the driver circuit and pre-driver are divided into blocks, each of which contains a small part of the driver transistor with a corresponding pre-driver. The driver circuit and pre-driver in a block are dimensioned so that the desired switching time is achieved within the block. In order to achieve the desired driver current strength, several blocks are connected together and an additional pre-driver stage is added. This interconnection of the individual blocks takes place in a self-similar structure according to the invention, as will be explained below. The gate signal is routed to the sub-blocks in a balanced manner in order to achieve simultaneous switching. By nesting hierarchically structured pre-drivers and driver circuits as well as direct connection of all critical networks via the top of the chip and balanced signal wiring, the presented architecture based on self-similar substructures enables massively scalable high-current switches with consistently high switching speeds.

[0219] The division of the driver circuit into individual blocks, hereinafter referred to as basic structures, and the combination of these basic structures to form a self-similar structure is explained in more detail using the figures. For a simpler presentation, we will no longer differentiate between driver circuit and pre-driver and will simply refer to driver instead.

[0220] Basic structure in the sense of this description refers to the structure that constantly recurs in a similar way in a self-similar structure at different scales and nestings.

[0221] The inventive concept of nesting an always constant design of the interconnection of each output of a single driver circuit of one stage with the inputs of the single driver circuits of the next stage (both at the layout and at the circuit level) has the advantage that the length of the circuit path from the input of the single driver circuit from the first stage to the outputs of each individual driver circuit of the last stage is always the same. The course and structure of these signal paths is also similar or symmetrical or point-symmetrical in groups, so that overall the same parasities such as parasitic inductances and parasitic ohmic resistances as well as possibly parasitic capacitances result. All of this ensures that the comparatively large control electrode field of a power transistor is simultaneously supplied with the control signal in a large number of individual sub-areas, which in turn is preferably generated digitally and is electrically stabilized due to the large number of stages in each sub-area of ​​the control electrode surface. This is ensured in particular by implementing the individual driver circuits as digital inverter circuits.

[0222] The concept presented here includes circuit-level self-similarity and layout-level self-similarity. Both types of self-similarity are claimed here individually and together.

[0223] Fig. 24 shows in simplified form the basic concept of the invention underlying self-similarity of the circuit architecture based on the circuit diagram and the circuit layout. The Fig. 24 includes six Figs. 24(a) to 24(f) , which are explained below. The three Figs. 24(a) to 24(c) on the left side show simplified concept of self-similar structure on schematic page. The three Figs. 24(d) to 24(f) on the right show simplified the concept of the self-similar structure on the corresponding layout page.

[0224] The Fig. 24(a) shows the exemplary circuit diagram of a first structure B0'. The first structure B0' has a first connection S0 of the first structure B0' and a second connection G0 of the first structure B0' and a third connection GND0 of the first structure B0'. The first structure B0' comprises a first part I0 of a first driver and a first part M0 of a first field effect transistor. The first part I0 of the first driver has a first and a second connection. The first part M0 of the first field effect transistor has a gate connection and a drain connection and a source connection. The first connection S0 of the first basic structure B0' is electrically conductively connected to the drain connection of the first part M0 of the first field effect transistor. The third connection GND0 of the first structure B0' is electrically conductively connected to the source connection of the first part M0 of the first field effect transistor. The second connection G0 of the first structure B0' is electrically conductively connected to the first connection of the first part I0 of the first driver. The second connection of the first part I0 of the first driver is electrically conductively connected to the gate connection of the first part M0 of the first field effect transistor.

[0225] The Fig. 24(d) accordingly shows the simplified layout representation of the first structure B0'. The first part M0 of the first field effect transistor and the first part I0 of the first driver are shown as adjacent rectangles.

[0226] Fig. 24(b) shows the exemplary combination of n structures B0' Fig. 24(a) to a first basic structure B1'. The variable n stands for a natural number greater than 1. Preferably, n is equal to 4. The first basic structure B1' has a first connection S1 of the first basic structure B1' and a second connection G1 of the first basic structure B1' and a third connection GND1 of the first Basic structure B1'. The first basic structure B1' comprises n structures B0'. The n first connections S0<1;n> of the n structures B0' are electrically conductively connected to the first connection S1 of the first basic structure B1'.

[0227] The n third connections GND0<1;n> of the n structures B0' are electrically conductively connected to the third connection GND1 of the first basic structure B1'. The first basic structure B1' comprises a first part I1 of a second driver. The first part I1 of the second driver has a first connection and a second connection.

[0228] The first connection of the first part I1 of the second driver is electrically conductively connected to the second connection G1 of the first basic structure B1'. The second connection of the first part I1 of the second driver is electrically conductively connected to the n second connections G0<1;n> of the n structures B0'.

[0229] Fig. 24(e) shows a simplified layout representation of the first basic structure B1'. The first basic structure B1' here comprises four structures B0' and the first part I1 of the second driver. The adjacent positioning of parts of the first driver forms a further part of the first driver or the entire first driver. Due to the adjacent positioning of parts of the first field effect transistor, a further part of the first field effect transistor or the entire first field effect transistor is formed.

[0230] Fig. 24(c) shows the combination of n first basic structures B1' Fig. 24(b) to a first self-similar structure B2'. The variable n stands for a natural number greater than 1. Preferably, n is equal to 4. The first self-similar structure B2' has a first connection S2 of the first self-similar structure B2' and a second connection G2 of the first self-similar structure B2' and a third connection GND2 of the first self-similar structure B2'. The first self-similar structure B2' includes n first structures B1'. The n first connections S1<1;n> of the n first basic structures B1' are electrically conductively connected to the first connection S1 of the first self-similar structure B2'. The n third connections GND1<1;n> of the n first basic structures B1' are electrically conductively connected to the third connection GND2 of the first self-similar structure B2'.

[0231] The first self-similar structure B2' comprises a first part I2 of a third driver. The first part I3 of the third driver has a first connection and a second connection.

[0232] The first connection of the first part I2 of the third driver is electrically conductively connected to the second connection G2 of the first self-similar structure B2 '. The second connection of the first part I3 of the third driver is electrically conductively connected to the n second connections G1<1;n> of the n first basic structures B1'.

[0233] Fig. 24(f) shows a simplified layout representation of the first self-similar structure B2'. The first self-similar structure B2' here comprises four first basic structures B1' and the first part I2 of the third driver. The adjacent positioning of parts of the first driver forms a further part of the first driver or the entire first driver. Due to the adjacent positioning of parts of the first field effect transistor, a further part of the first field effect transistor or the entire first field effect transistor is formed.

[0234] The expansion to larger self-similar structures based on the first self-similar structure B2' and its smallest self-similar unit, the first basic structure B1', can be continued as desired.

[0235] If the layout representation is further simplified, the self-similarity of the structure and the division of the drivers and transistors into different blocks becomes even clearer.

[0236] Fig. 25(a) shows on the left a simplified layout of a basic structure of the self-similar structure according to the invention as a stick layout. In Fig. 25(b) It is shown how further basic structures are combined so that the self-similar structure according to the invention ultimately results.

[0237] In the Fig. 25Driver parts are shown simplified as black dots. Driver part in the sense of this invention refers to a part of a driver that is functional on its own. A driver can therefore be divided into several driver parts, possibly spatially separated from one another, which, due to their arrangement in the self-similar structure according to the invention, together provide the same functionality as a driver that is not spatially divided. In this description, the terms “driver part” and “part of a driver” are used synonymously.

[0238] Parts of field effect transistors are in Fig. 25(b) shown in simplified form as rectangular, dotted areas F1, F2, F3, F4. Field effect transistor part in the sense of this invention refers to a part of a field effect transistor that is functional on its own. A field effect transistor can therefore be divided into several field effect transistor parts, possibly spatially separated from one another, which, due to their arrangement in the self-similar structure according to the invention, together provide the same functionality as a non-spatially divided field effect transistor. In this description, the terms “field effect transistor part” and “part of a field effect transistor” are used synonymously.

[0239] First of all, the in Fig. 25(a) Basic structure shown described. A first driver part T1 is electrically conductively connected to a second line L2 via a first line L1. The first line L1 and the second line L2 run at right angles to each other. The connection point of the first line L1 and the second line L2 is at the center of the route of the second line L2. The second line L2 connects a second driver part T2 and a third driver part T3 to one another in an electrically conductive manner. The second driver part T2 and the third driver part T3 are arranged symmetrically to the junction of the first line L1 and the second line L2.

[0240] The first driver part T1 is electrically connected to a fourth line L4 via a third line L3. In this example, the third line L3 and the fourth line L4 run at right angles to each other. The connection point of the third line L3 and the fourth line L4 is at the center of the route of the fourth line L4. The fourth line L4 connects a fourth driver part T4 and a fifth driver part T5 to one another in an electrically conductive manner. The fourth driver part T4 and the fifth driver part T5 are arranged symmetrically to the junction of the third line L3 and the fourth line L4.

[0241] The first driver part T1 is therefore at the center of an imaginary rectangle, at the corner points of which the second driver part T2 and the third driver part T3 and the fourth driver part T4 and the fifth driver part T5 are placed.

[0242] The basic structure described can be continued as described below, with more and more such basic structures emerging. This is done using the Fig. 25(b) explained. The fifth driver part T5 of the basic structure described is here in the geometric center of another basic structure. The fifth driver part T5 is electrically connected to a sixth line L6 via a fifth line L5. The fifth line L5 and the sixth line L6 are arranged at right angles to each other. The junction of the fifth line L5 and the sixth line L6 lies at the center of the sixth line L6. The sixth line L6 connects a sixth driver part T6 and a seventh driver part T7 to one another in an electrically conductive manner. The sixth driver part T6 and the seventh driver part T7 are arranged symmetrically to the junction of the fifth line L5 and the sixth line L6.

[0243] The fifth driver part T5 is electrically connected to an eighth line L8 via a seventh line L7. The seventh line L7 and the eighth line L8 are arranged at right angles to each other. The junction of the seventh line L7 and the eighth line L8 is at the center of the eighth line L8. The eighth line L8 connects an eighth driver part T8 and a ninth driver part T9 to one another in an electrically conductive manner. The eighth driver part T8 and the ninth driver part T9 are arranged symmetrically to the junction of the seventh line L7 and the eighth line L8.

[0244] Thus, in this new basic structure, the fifth driver part T5 is now in the center of a rectangle at the corner points of which the sixth driver part T6 and the seventh driver part T7 and the eighth driver part T8 and the ninth driver part T9 are placed. Accordingly, any other driver part that lies at a corner point of such a rectangle can also be the center of another basic structure. The first driver part T1 could also lie on the corner point of such a rectangle of a further basic structure, not shown.

[0245] In addition, each driver part that lies on the corner point of such a rectangle, i.e. in the example shown, the second driver part T2 or the third driver part T3 or the fourth driver part T4 or the fifth driver part T5 or the sixth driver part T6 or the seventh driver part T7 or the eighth driver part T8 or the ninth driver part T9, be electrically connected to four field effect transistor parts.

[0246] In Fig. 25(b) This is shown using the second driver part T2. The second driver part T2 is electrically conductively connected to a first field effect transistor part F1 and to a second field effect transistor part F2 and to a third field effect transistor part F3 and to a fourth field effect transistor part F4. Here, the first field effect transistor part F1 lies above the third field effect transistor part F3 and to the left of the second field effect transistor part F2. The fourth field effect transistor part F4 is located below the second field effect transistor part F2 and to the right of the third field effect transistor part F3. The second driver part T2 is therefore located in the center of the rectangle formed by the four field effect transistor parts F1, F2, F3, F4.

[0247] The four field effect transistor parts F1, F2, F3, F4 together form a field effect transistor as a common functional unit. In order to avoid the spread of a field effect transistor with a low drain-source resistance over large areas, the field effect transistor was divided into four field effect transistor parts F1, F2, F3, F4. Analogously, the drivers are divided into the driver parts described.

[0248] Fig. 26 shows a simplified representation of the self-similarity of the circuit layout on which the invention is based. Driver parts are shown simplified as black dots. Parts of field effect transistors are shown in simplified form as rectangular, dotted areas. Fig. 26 now shows a more extensive combination of the in Fig. 25 basic structures described into a larger self-similar structure. After the in Fig. 25 Using the principle described, such a basic structure could be added to each driver part and the self-similar structure shown could be continued as desired. The field effect transistor parts are shown here as examples only for some basic structures and could also be supplemented with other basic structures.

[0249] The Fig. 26 shows the top view of a layout of the self-similar structure according to the invention. It can be seen here that only one metallization layer is required since all electrically conductive connections are in the same plane. A signal is fed in at a first signal connection DP. The first signal connection DP is preferably electrically connected to a driver part, which lies in the geometric center of the self-similar structure. This takes advantage of the balanced signal wiring resulting from the symmetry of the basic structure or the self-similar structure.

[0250] Such a self-similar structure of a driver circuit, in which drivers and transistors are interleaved, enables, at least in some implementations, an increase in the maximum achievable switching speed compared to circuits with discrete components and compared to integrated circuits with non-interleaved and / or not self-similarly structured drivers. Therefore, the self-similar structure of a driver circuit according to the invention can be used in all applications that benefit from short switching times at high currents. The nested drivers and pre-drivers can be manufactured on one die in the CMOS process, which enables monolithic driver ICs with additional CMOS-standard functions (digital configuration, integrated pulse shaping and diagnostic circuits). Compared to a CMOS architecture with separate driver and pre-driver blocks, the nested architecture according to the invention can be scaled better, achieving faster rise times and more compact system solutions than with discrete structures.

[0251] But the advantages are not limited to this. In particular, the previously described driver circuit is not limited to the application for the pulse operation of a light-emitting or laser diode or, for example, to the application of such pulse operation in a LIDAR device. The pulse operation of the transistor can also be used in a switching power supply, a DC-DC converter and wherever it is important to generate steep rising edges of electrical signals.

[0252] The driver circuit has been explained above using terms such as "driver part" and "field effect transistor part". These terms are equivalent to single driver circuit (as a driver part) and single transistor (as a field effect transistor part). In Fig. 26 GSA denotes the overall control connection of the transistor T dis. This overall control connection has a total control connection area GF, which is regularly divided into a large number of individual control connection areas GFE for individual transistors (not shown) of the transistor Tdis. The four outputs of an individual driver circuit T1 to T9 are assigned to four of these individual control connection areas or four individual control connections ESA (see, for example, the individual driver circuits T2 and T9 in Fig. 26 , whose outputs are connected to the four individual transistors corresponding to F1 to F4).

[0253] In Fig. 25(a) For example, the penultimate stage of the driver circuit is shown. In Fig. 25(b) The last stage of the driver circuit is then shown, and only for the driver circuit structure starting from T5, for example the lower right corner area of ​​the Fig. 26 corresponds.

[0254] As in particular based on Fig. 26 As can be seen, the driver circuit shown there has four stages, with the circular dot connected to the connection DP showing the individual driver circuit of the first stage and the individual driver circuits corresponding to the round dots T6, T7, T8 and T9 (see also Fig. 25 ) show the individual driver circuits of the last stage. The one in the exemplary embodiment Figs. 25 and 26 H-shaped structures shrink from stage to stage. The advantage of this regular arrangement of self-similar structures is that the signal paths from the connection DP to the individual driver circuits of the fourth stage are always the same length and always the same or similar in terms of circuitry. This is in Fig. 26 illustrated by two dashed lines, which, starting from the DP connection, lead to different individual driver circuits of the fourth stage.

[0255] Due to the special design of the nesting of the individual driver stages of the driver circuit, it is possible to provide the driver circuit designed using digital circuit technology with a large number of digital outputs, which are now evenly distributed over the comparatively large electrode of the power transistor designed using analog circuit technology and to which digital output signals are simultaneously output when a signal is applied to the input of the driver circuit. Each digital output signal now "supplies" an individual control connection area of ​​an individual transistor, with all individual transistors now switching simultaneously and thus the entire transistor quickly and effectively generates a current pulse that is highly energetic and causes the laser to generate a powerful light pulse.

[0256] The invention advantageously has at least one or some of the following groups of features or one or some of the features of one or more of the groups of features mentioned below: 1. Laser module with a linear laser array of n lasers, with a linear capacitor array of n capacitors, with a control switch, with n charging circuits, where n is an integer positive number greater than 2 and where a capacitor of the capacitor array has a first connection and a second connection and wherein a charging circuit of the n charging circuits selectively in each case a capacitor of the n capacitors, hereinafter referred to as the capacitor assigned to this charging circuit, via a charging line inductance which is assigned to this charging circuit and this capacitor, and the first connection thereof Capacitor can charge and wherein each capacitor of the n capacitors is assigned a laser of the n lasers as a laser assigned to this capacitor and wherein the control switch is that capacitor of the n capacitors that is charged via the laser assigned to this capacitor and one between the laser and the first Discharge line inductance arranged at the connection of this capacitor, which is assigned to this capacitor and this laser, discharges and this assigned laser then only emits a laser pulse when the capacitor assigned to this laser was charged, and the control switch connects the laser to a reference potential and the The value of the charging line inductance assigned to a capacitor is greater than the value of the discharge line inductance assigned to this capacitor and the value of the inductance between the laser and the control switch and the value of the inductance between the control switch and the reference potential is smaller than the value of the charging line inductance and is smaller than the value of the discharge supply line inductance . 2. Laser module according to number 1, with an integrated circuit, wherein the cathodes of the n lasers of the linear laser array of n lasers are connected to a star point in a wireless bonding manner and wherein the control switch is part of the integrated circuit and the control switch is connected wirelessly to the Star point is connected. 3. Laser module according to one or more of the two preceding numbers with an integrated circuit in a monolithic crystal with an active surface, the n charging circuits being part of the active surface of the integrated circuit and being parallel to the linear laser array of n lasers the linear capacitor array of n capacitors is mounted parallel to one another on the active surface of the monolithic crystal of the integrated circuit and wherein the first connection of the capacitor of the linear capacitor array is connected by a multiple bonding with a first bonding wire length to the anode of the capacitor assigned to this capacitor Laser of the linear laser array is connected and wherein the second connections of the n capacitors of the capacitor array are interconnected to form a second star point and wherein the second star point is connected to a plurality of bonding wires with a second bonding wire length with a reference potential contact on the active surface of the crystal integrated circuit and wherein the first connection of the capacitor is connected via a bonding wire with a third bonding wire length which crosses the second star point to the charging circuit assigned to this capacitor and wherein the third bonding wire length is longer than the second bonding wire length and wherein the second bonding wire length is longer is as the first bonding wire length. 4.LIDAR system with a linear laser array of n lasers and with a linear photodetector array of m photodetectors and with a control circuit for the n lasers and with a reception circuit for the m photodetectors and with an evaluation circuit for the measurement signals of the m reception circuits and with a Powell lens, or a functionally equivalent optics, which is hereinafter included by the term Powell lens, with a second optics, hereinafter referred to as a receiver lens, wherein each laser emits a laser beam when energized with electrical current and wherein the Powell lens such a laser beam expands into a light fan with a light fan plane and a fan origin point and wherein the n lasers generate n laser beams, the n light fans of which are tilted perpendicular to their respective fan plane around a substantially common fan origin point, the receiver lens converting the m reception lobes of the m photodetectors into m Receiving fans are deformed, each of which has a receiving fan level, and wherein each receiving fan level of the receiving fan levels is not parallel to the laser fan level and in particular each receiving fan level of the receiving fan levels is perpendicular to the laser fan level, the control circuit causing a laser of the n lasers to emit a laser light pulse at an emission time and wherein the m photodetectors and their respective receiving circuit detect the respective reflected light of this respective laser pulse and the respective reception time within their respective reception compartment and wherein the respective reception circuit passes on the respective measured value for the reception time of the respective laser pulse at the respective photodiode to the evaluation circuit and wherein the Evaluation circuit creates a three-dimensional pixel cloud from the angle of the laser fan of the respective laser pulse and the angle of the respective receiving fan of the respective photodetector and the respective reception time of the respective laser pulse at the respective photodetector based on the respective transmission time. 5. LIDAR system according to the previous number, where the n surface normals of the n light fans have angular distances (a 1.2, a 2.3, a 3.4, to a n-2,n-1, a n-1,n ) that are essentially the same between two adjacent light compartments. 6. LIDAR system according to one or more of the two previous digits with a laser module according to one or more of the digits 1 to 3. 7. Driver circuit, with the drivers I0, I1, I2 and transistors M0, T1 to T9 in blocks B0 ', B1', B2' are divided and the interconnection of the individual blocks B0', B1', B2' is a self-similar structure. 8. Driver circuit, whereby the drivers I0, I1, I2 and transistors M0, T1 to T9 are divided into blocks B0', B1', B2' and the interconnection of the individual blocks B0', B1', B2' forms a self-similar structure at circuit level is. 9. Driver circuit, whereby the drivers I0, I1, I2 and transistors M0, T1 to T9 are divided into blocks B0', B1', B2' and the interconnection of the individual blocks B0', B1', B2' has a self-similar structure on layout -level is. 10.Driver circuit comprising a first driver part T1 and a second driver part T2 and a third driver part T3 and a fourth driver part T4 and a fifth driver part T5 and a first line L1 and a second line L2 and a third line L3 and a fourth line L4 and wherein the first driver part T1 is electrically conductively connected to the second line L2 via the first line L1, and wherein the first line L1 and the second line L2 are perpendicular to one another and wherein the connection point of the first line L1 and the second line L2 is in the center of the route of the second Line L2 is located and wherein the second line L2 electrically conductively connects the second driver part T2 and the third driver part T3 to one another and wherein the second driver part T2 and the third driver part T3 are arranged symmetrically to the connection point of the first line L1 and the second line L2 and where the first driver part T1 is electrically conductively connected to the fourth line L4 via the third line L3, and wherein the third line L3 and the fourth line L4 are perpendicular to one another and wherein the connection point of the third line L3 and the fourth line L4 is in the center of the route fourth line L4 and wherein the fourth line L4 connects the fourth driver part T4 and the fifth driver part T5 to one another in an electrically conductive manner and wherein the fourth driver part T4 and the fifth driver part T5 are arranged symmetrically to the connection point of the third line L3 and the fourth line L4 and wherein each driver part T1, T2, T3, T4, T5 can be electrically connected to transistor parts and each driver part T1, T2, T3, T4, T5 can also be part of a further, identically constructed driver circuit, so that the combination of these driver circuits is a self-similar structure. 11. LIDAR system, wherein it has at least one driver circuit according to one or more of numbers 1 to 4 for controlling at least one laser diode or a light-emitting diode LD. 12. Integrated electrical circuit with drivers I0, I1, I2 and transistors N0, T1 to T9, the drivers I0, I1, I2 and transistors N0, T1 to T9 being divided into individual, interconnected blocks B0', B1', B2' and the interconnection of the individual blocks B0', B1', B2' forms a self-similar structure. 13. Integrated electrical circuit according to number 12, whereby the interconnection of the individual blocks B0', B1', B2' forms a self-similar structure at the circuit level. 14. Integrated electrical circuit according to number 12, whereby the interconnection of the individual blocks B0', B1', B2' forms a self-similar structure at the layout level. 15.Integrated electrical circuit according to one of numbers 12 to 14, wherein the self-similar structure has a first driver part T1 with an input and an output, a second driver part T2 with an input and an output, a third driver part T3 with an input and an output, a fourth Driver part T4 with an input and an output and a fifth driver part T5 with an input and an output and a straight first line L1 extending from the output of the first driver part T1, a straight second line L2 running at right angles to the first line L1, a rectilinear third line L3 which extends from the output of the first driver part T1 in a direction opposite to the direction of extension of the first line L1 and a rectilinear fourth line L4 which runs at right angles to the third line L3 and thus parallel to the second line L2, the first Line L1 is connected to the second line L2 and its connection point is in the center of the route of the second line L2, the second line L2 connecting the inputs of the second driver part T2 and the third driver part T3 with each other, whereby the second driver part T2 and the third driver part T3 are arranged symmetrically to the connection point of the first line L1 and the second line L2, the third line L3 being connected to the fourth line L3 and its connection point being in the center of the route of the fourth line L4, the fourth line L4 being the inputs of the fourth driver part T4 and the fifth driver part T5 interconnect, whereby the fourth driver part T4 and the fifth driver part T5 are arranged symmetrically to the junction of the third line L3 and the fourth line L4, and the first driver part T1 is in the middle between the junction of the first line L1 with the second line L2 and the junction of the third line L3 with the fourth line L4. 16. Integrated electrical circuit according to number 15, wherein the first line L1 is designed as two mutually parallel first line sections, from which two second line sections extend in opposite directions, the first line section and the second line section providing the output of the first driver part T1 connects to the input of the second driver part T2 and the other first line section and the other second line section connects the output of the first driver part T1 to the input of the third driver part T3, and that the third line is designed as two third line sections running parallel to one another , from which two fourth line sections extend in opposite directions, the third line section and the fourth line section connecting the output of the first driver part T1 to the input of the fourth driver part T4 and the other third line section and the other fourth line section connecting the output of the first driver part T1 connects to the input of the fifth driver part T5. 17. Integrated electrical circuit according to number 15 or 16, wherein each of the second, third, fourth and fifth driver parts T2, T3, T4, T5 with at least one transistor part M0, T1 to T9 or with a group of point-symmetrical said driver parts T2, T3, T4, T5 arranged transistor parts M0, T1 to T9 is connected. 18. Integrated electrical circuit according to number 15 or 16, each of the second, third, fourth and fifth driver parts T2, T3, T4, T5 being the first driver part of a further group of five driver parts T1, T2, T3, T4, T5 and four Lines L1, L2, L3, L4 can form, which are designed, arranged and connected according to number 4. 19. LIDAR system with at least one diode in the form of a laser or light-emitting diode and a driver circuit for pulse-like control of the at least one diode, the driver circuit being designed according to one or more of the preceding numbers. 20.Laser module with a linear laser array of n lasers, with n as an integer positive number, with a linear capacitor array of n capacitors with a control switch, with n charging circuits, where n is an integer positive number greater than 2 and where a capacitor of the capacitor array has a first connection and a second connection and wherein a charging circuit of the n charging circuits selectively in each case a capacitor of the n capacitors, hereinafter referred to as the capacitor assigned to this charging circuit, via a charging line inductance which is assigned to this charging circuit and this capacitor, and can charge the first connection of this capacitor and wherein each capacitor of the n capacitors is assigned a laser of the n lasers as a laser assigned to this capacitor and wherein the control switch uses that capacitor of the n capacitors that is charged via the laser assigned to this capacitor and an between Laser and the first connection of this capacitor arranged discharge line inductance, which is assigned to this capacitor and this laser, discharges and this assigned laser then only emits a laser pulse when the capacitor assigned to this laser was charged, and the control switch the laser with a reference potential connects and wherein the value of the charging line inductance assigned to a capacitor is greater than the value of the discharge line inductance assigned to this capacitor and wherein the value of the inductance between the laser and the control switch and the value of the inductance between the control switch and the reference potential is smaller than the value of the charging line inductance and is smaller than the value of the discharge lead inductance. 21. Laser module according to the previous number with an integrated circuit, wherein the cathodes of the n lasers of the linear laser array of n lasers are connected to a star point in a wireless bonding manner and the control switch is part of the integrated circuit and the control switch is connected wirelessly to the Star point is connected. 22. Laser module according to one or more of the two preceding numbers with an integrated circuit in a monolithic crystal with an active surface, the n charging circuits being part of the active surface of the integrated circuit and being parallel to the linear laser array of n lasers the linear capacitor array of n capacitors is mounted parallel to one another on the active surface of the monolithic crystal of the integrated circuit and wherein the first connection of the capacitor of the linear capacitor array is connected by a multiple bonding with a first bonding wire length to the anode of the capacitor assigned to this capacitor Laser of the linear laser array is connected and wherein the second connections of the n capacitors of the capacitor array are interconnected to form a second star point and wherein the second star point is connected to a plurality of bonding wires with a second bonding wire length with a reference potential contact on the active surface of the crystal integrated circuit and wherein the first connection of the capacitor is connected via a bonding wire with a third bonding wire length which crosses the second star point to the charging circuit assigned to this capacitor and wherein the third bonding wire length is longer than the second bonding wire length and wherein the second bonding wire length is longer is as the first bonding wire length. 23. Laser module with a linear laser array of n lasers, with n as an integer positive number, the n lasers being mounted on a module carrier and / or a driver IC and each laser beam of each laser being a laser Beam axis and wherein all laser beam axes and / or at least two laser beam axes intersect at one point. 24.Assembly of p laser modules, with p as an integer positive number, each having a linear laser array of n lasers, with n as an integer positive number, and where the lasers of each module can be numbered in the same way and where each laser -Beam of each laser has a laser beam axis and whereby all the laser beam axes of the kth laser, with 0<k≤n, of all p laser modules intersect at a point and / or where the laser beam axes of the k -th laser, with 0<k≤n, cut by at least two of the p laser modules in one point. 25. Assembly of p laser modules, with p as an integer positive number, each having a linear laser array of n lasers, with n as an integer positive number, and each laser beam of each laser of each module having a laser beam axis and wherein all p x n laser beam axes of all p x n lasers of all p laser modules intersect at a point and / or at least two laser beam axes of at least two lasers of the p x n lasers of all p laser modules intersect at a point. 26. Driver IC for a laser module according to one or more of numbers 20 to 23 or for a combination of laser modules according to numbers 24 or 25, where the driver IC has a rectangular shape and where the driver IC is two Has narrow sides and two long sides as edges and wherein the driver IC has contacts or a contact DisC on a first edge of the rectangle of its shape, which is a narrow side, which are intended and suitable for contacting one or more rear contacts of lasers, wherein the IC has, on its second edge of the rectangle of its shape, which is a narrow side, contacts VDDA, GNDA, VDDD, GNDD, VDDP, GNDP, VDDH, GND, which supply the power to the driver IC and / or the said lasers D1 to Dn and / or associated energy storage C1 to Cn and wherein the first edge is opposite the second edge. 27. Driver IC according to number 26, wherein the driver IC has at least one transfer contact for a signal on a third edge of the driver IC, which is a long side, which can be passed on to other driver ICs and whereby the Driver IC has another transfer contact on a fourth edge of the driver IC, which is a long side, which is electrically connected to the transfer contact. 28. Driver IC according to number 27, wherein a transfer contact is a contact for a reset signal RES, which puts the driver IC into a defined state. 29. Driver IC according to paragraph 27, wherein a transfer contact is a contact for a trigger signal TRIG, which causes the driver IC to fire its lasers D1 to Dn in a predetermined signal state, if this is intended due to the system state. 30. Driver IC according to number 27, wherein one or more transfer contacts are intended for contacting signals of a data bus and wherein the one or more transfer contacts on one edge of the driver IC, which is a long side, with a or more corresponding transfer contacts on the opposite edge of the driver IC, which is the opposite long side, are directly electrically connected, or wherein the signals of the one or more transfer contacts on one edge of the driver IC, which is a long side is to be processed in a sub-device of the driver IC, in particular in a data bus interface, before forwarding to one or more corresponding transfer contacts on the opposite edge of the driver IC, which is the opposite long side. 31. Compilation of laser modules, in particular LIDAR systems, with several, but at least two, laser modules, a first laser module and a second laser module, the laser modules having a rectangular shape with two narrow sides and two long sides and wherein the laser modules are arranged with their long sides next to each other and wherein the laser modules each have a driver IC according to one or more of numbers 17 to 30 and wherein the driver ICs of the laser modules have the transfer contacts used Driver ICs are identical in construction, with one transfer contact of the driver IC of the first laser module being electrically connected to the corresponding transfer contact of the driver IC of the second laser module by means of a single bonding wire per such transfer contact pair. 32.LIDAR system with a linear laser array of n lasers and with a linear photodetector array of m photodetectors and with a control circuit for the n lasers and with a reception circuit for the m photodetectors and with an evaluation circuit for the measurement signals of the m reception circuits and with a Powell lens, or a functionally equivalent optics, which is hereinafter included by the term Powell lens, with a second optics, hereinafter referred to as a receiver lens, wherein each laser emits a laser beam when energized with electrical current and wherein the Powell lens such a laser beam expands into a light fan with a light fan plane and a fan origin point and wherein the n lasers generate n laser beams, the n light fans of which are tilted perpendicular to their respective fan plane around a substantially common fan origin point, the receiver lens converting the m reception lobes of the m photodetectors into m Receiving fans are deformed, each of which has a receiving fan level, and wherein each receiving fan level of the receiving fan levels is not parallel to the laser fan level and in particular each receiving fan level of the receiving fan levels is perpendicular to the laser fan level, the control circuit causing a laser of the n lasers to emit a laser light pulse at an emission time and wherein the m photodetectors and their respective receiving circuit detect the respective reflected light of this respective laser pulse and the respective reception time within their respective reception compartment and wherein the respective reception circuit passes on the respective measured value for the reception time of the respective laser pulse at the respective photodiode to the evaluation circuit and wherein the evaluation circuit a three-dimensional pixel cloud is created from the angle of the laser fan of the respective laser pulse and the angle of the respective reception fan of the respective photodetector and the respective reception time of the respective laser pulse at the respective photodetector based on the respective transmission time. 33. LIDAR system according to the previous number, where the n surface normals of the n light fans have angular distances a 1.2, a 2.3, a 3.4, to a n-2,n-1, a n-1,n , which are essentially the same between any two adjacent light compartments. 34. LIDAR system according to one or more of the two preceding numbers, with a laser module according to one or more of numbers 20 to 23 and / or with a combination of laser modules according to numbers 24 and / or 25 and / or 31 and / or with a driver IC according to one or more of the numbers 26 to 30. 35.Capacitor array for a laser module, in particular according to one or more of numbers 20 to 23 and / or for a combination of laser modules according to numbers 24 and / or 25 and / or 31 and / or for use together with a driver -IC according to one or more of numbers 26 to 30, wherein the capacitor array is rectangular and wherein the capacitor array has a surface and a bottom and wherein the capacitor array has n contacts K1 'to Kn' lined up along a first edge of the Rectangle on the surface of the capacitor array and wherein the capacitor array has a further contact KG 'which extends along a second side of the rectangle on the top of the capacitor array, and wherein the second side of the rectangle is the first side of the Rectangle is opposite and wherein the extent of the further contact KG 'along the third and fourth sides is shorter than the extent of the contact of the n contacts K1' to Kn' closest to the third edge of the rectangle along the third edge of the rectangle and where the Extension of the further contact KG' along the third and fourth sides is shorter than the extension of the contact of the n contacts K1' to Kn' closest to the fourth edge of the rectangle along the fourth edge of the rectangle and the capacitor array has a rear contact KR which covers the underside of the capacitor array and wherein each of the n contacts K1' to Kn' forms a capacitance C1 to Cn with the rear contact KR and wherein the further contact KG' forms a further capacitance CVDD with the rear contact KR and where the Capacitors Ca to Cn and CVDD have a common dielectric which extends between the n contacts K1' to Kn' and the further contact KG' on the one hand and the rear contact KR. 36. Use of a laser module according to one or more of numbers 20 to 23 and / or a combination of laser modules according to one or more of numbers 24 and / or 25 and / or 31 and / or a driver IC according to one or several of the numbers 26 to 30 and / or a LIDAR system according to one or more of the numbers 32 to 34 and / or a capacitor array according to number 35 in a mobile device, the mobile device in particular being a robot or a missile or a spacecraft or may be a hull or a watercraft or a vehicle or a rail vehicle or an aircraft or a spacecraft. 37. Use of a laser module according to one or more of numbers 20 to 23 and / or a combination of laser modules according to one or more of numbers 24 and / or 25 and / or 31 and / or a driver IC according to one or several of numbers 26 to 30 and / or a LIDAR system according to one or more of numbers 32 to 34 and / or a capacitor array according to number 35 in a device for detecting the shape of an object or a building or in an automation device of processes or in a device for three-dimensionally detecting the shape of three-dimensional bodies. 38.Lens for use in a LIDAR system, wherein the LIDAR system comprises a laser module and wherein the laser module comprises a linear laser array of n lasers, with n as an integer positive number greater than 1, and wherein each of the n Laser can emit a laser beam with an elliptical or round intensity cross section and wherein each of the laser beams has a laser beam axis and wherein the laser beam axes lie essentially in a common laser beam axis plane with an optical axis and wherein the lens expands each of the laser beams in a direction perpendicular to the laser beam axis plane, so that for each of the n laser beams there is a light fan in a light fan plane perpendicular to the light beam axis plane and wherein the lidar system has a photodetector array and imaging optics and wherein the photodetector array has n photodetector rows with m photodetector pixels, where m is an integer positive number is and wherein the imaging optics images the projection of the laser beam fans in the far field onto an ideally homogeneously white and / or essentially ideally diffuse, uniformly and uniformly reflecting projection plane perpendicular to the optical axis in the form of a projection image of the laser beam fans back onto the n photodetector lines as an image image of the laser beam fans and where the lens is shaped in such a way that, for a given imaging optics, the value of the illumination intensity of an associated first section of the image of the projection of a first laser beam fan onto a first arbitrary photodetector pixel of the photodetector array is equal to the value of the illumination intensity of an associated second section of the image of the projection of a second laser beam fan to a second arbitrary photodetector pixel of the photodetector array by no more than 10% and / or no more than 5% and / or no more than 2% and wherein the first section is different from the second section and wherein the first laser beam fan differs from the second laser beam fan can be different, but does not have to be and wherein the first photo pixel is different from the second photo pixel and wherein the lens has a first surface and a second surface opposite it and wherein the first surface is determined by a function of the shape. z = RY + AR 2 * x 2 + AR3 * x 3 − Sign RY * Sqrt RY2 − y2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY= ROY+AR2 ∗< x 2< +AR3 ∗< |x 3< | is described and wherein the second surface is described by a function of the form z=-(d+PC2 ∗< x 2< +PC3 ∗< |x 3< |) and wherein the parameters PB2 and PB3 are non-zero and where at least two of the parameters AR2 and / or AR3 and / or PB4 and / or PB6 and / or PC2 and / or PC3 are different from zero. 39. Lens according to paragraph 38, wherein the parameters AR2 and AR3 are non-zero and at least two of the parameters PB4 and / or PB6 and / or PC2 and / or PC3 are non-zero. 40. Lens according to paragraph 39, wherein the parameters PB4 and PB6 are non-zero and at least two of the parameters PC2 and / or PC3 are non-zero. 41. Lens according to number 40, where the parameters PC2 and PC3 are different from zero. As an alternative to the previous or in addition thereto, the invention advantageously has at least one or some of the feature groups mentioned below or one or some of the features of one or more of the feature groups mentioned below: 1. Light module with a carrier TR provided with a top side TRO, in which a Circuit die is arranged with integrated circuits, the circuit die having a top side, a transistor T dis, in particular power transistor, formed in the top side of the circuit die, wherein the transistor T dis has a line path LPF which can be switched on or off and has a first end region LPF1 and a second end region LPF2, of which the first end region LPF1 is electrically connected to a first line path connection field TAF1 and the second end region LPF2 is electrically connected to a second line path connection field TAF2, both of which are exposed on the top TRO of the carrier TR, and where the transistor T dis has a control connection GT dis for switching the line path LPF on and off, a light-emitting diode die D1D having a light-emitting diode, in particular a light-emitting diode die having a laser diode, with an underside having a first connection field DAF1 and a second connection field DAF2 having top side, wherein the light-emitting diode die D1D with its first connection field DAF1 is arranged lying on the first line path connection field TAF1 of the transistor Tdis and these two connection fields are electrically connected to one another, a charge storage component LSBT having a charge storage device C1 to Cn, which has a having a first connection field LAF1 and a top side having a second connection field LAF2, wherein the charge storage component LSBT is arranged with its first connection field LAF1 lying on the second line path connection field TAF2 of the transistor T dis and these two connection fields are electrically connected to one another, at least to a first Bonding wire BD1, which electrically connects the second connection field DAF1 of the light-emitting diode die D1D to the second connection field LAF2 of the charge storage component LSBT, a charging circuit B1 to Bn integrated in the circuit die and having an output for charging the charge storage component LSBT with electrical charge and an in the circuit die integrated control circuit CTR for controlling the transistor T dis and the charging circuit B1 to Bn, the charging circuit B1 to Bn being assigned a charge connection field AF exposed on the top TRO of the carrier TR, with which the output of the charging circuit B1 to Bn is electrically is connected, wherein the charge connection field AF of the charging circuit B1 to Bn is electrically connected to the second connection field LAF2 of the charge storage component LSBT via at least one second bonding wire BD2, and wherein the control circuit CTR uses the charging circuit B1 to Bn for charging the charge storage component LSBT up to one for the Generation of a light pulse by the light-emitting diode D1D controls the required degree of charge and then controls the transistor T dis to turn on its conduction path LPF. 2.Light module according to number 1, wherein the at least one first bonding wire BD1 has a first parasitic inductance and a first parasitic ohmic resistance, wherein the at least one second bonding wire BD2 has a second parasitic inductance and a second parasitic ohmic resistance, the electrical connection of the first connection panel DAF1 of the light-emitting diode die D1D with the first end region (LPF1) of the line path LPF of the transistor T dis has a third parasitic inductance and a third parasitic ohmic resistance and wherein the electrical connection between the first connection field LAF1 of the charge storage component LSBT and the second end region LPF2 of the Line path LPF of the transistor T dis has a fourth parasitic inductance and a fourth parasitic ohmic resistance, the electrical connection of the output of the charging circuit B1 to Bn with the charge connection field AF assigned to the charging circuit B1 to Bn having a fifth parasitic inductance and a fifth parasitic ohmic resistance , wherein the first parasitic inductance, the third parasitic inductance and the fourth parasitic inductance in total have a size that is smaller than the size of the third parasitic inductance and the fifth parasitic inductance in total and in particular less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the third parasitic inductance and the fifth parasitic inductance in total. 3. Light module according to number 2, wherein the first parasitic ohmic resistance, the third parasitic ohmic resistance and the fourth parasitic ohmic resistance have a total size that is smaller than the size of the third ohmic resistance and the fifth ohmic resistance in total and in particular less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the third ohmic resistance and the fifth ohmic resistance in total. 4. Light module according to one of numbers 1 to 3, wherein the electrically interconnected components, namely the light-emitting diode die D1D, the charge storage component LSBT, the at least one first bonding wire BD1 and the transistor T dis with its line path LPF together form a discharge circuit, which a first parasitic inductance and a first parasitic ohmic resistance, the charge storage component LSBT with its electrical connection to the output of the charging circuit B1 to Bn via the at least one second bonding wire BD2 forming a charging circuit which has a second parasitic inductance and a second parasitic ohmic resistance has, wherein the first parasitic inductance is smaller than the second parasitic inductance and in particular is less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the second inductance. 5. Light module according to number 4, wherein the first parasitic ohmic resistance is smaller than the second parasitic ohmic resistance and in particular is less than 1 / 2 or less than 1 / 4 or less than 1 / 5 of the second parasitic ohmic resistance. 6. Light module according to one of the numbers 1 to 5 with several first bonding wires BD1 and several second bonding wires BD2. 7.Light module according to one of the numbers 1 to 6 with several light-emitting diode dies D1D and several charge storage components LSBT, each light-emitting diode die D1D being assigned a charge storage component LSBT, the top side TRO of the carrier TR for each light-emitting diode die D1D having an exposed first line path connection field TAF1, which is electrically connected to the first end region LPF1 of the line path LPF of the transistor T dis, and for each charge storage component LSBT has an exposed second line path connection field TAF2, which is electrically connected to the second end region LPF2 of the line path LPF of the transistor T dis, wherein a charging circuit B1 to Bn assigned to each charge storage component LSBT is integrated in the circuit die and a charge connection field AF is arranged exposed on the top side TRO of the carrier TR for each charging circuit B1 to Bn, each light-emitting diode die D1D having its first connection field DAF1 is arranged resting on the assigned first line path connection field TAF1 of the transistor T dis and these two connection fields are electrically connected to one another, each charge storage component LSBT with its first charge connection field LAF1 being arranged resting on the assigned second line path connection field TAF2 of the transistor T dis and these two connection fields are electrically connected to one another, the second connection field DAF2 of each light-emitting diode die D1D being connected to the second connection field LAF2 of the charge storage component LSBT assigned to the respective light-emitting diode die D1D by means of at least one first bonding wire BD1, the charge connection field AF of each charging circuit B1 to Bn is connected to the second connection field LAF2 of the charge storage component LSBT assigned to the respective charging circuit B1 to Bn by means of at least one second bonding wire BD2 and the control circuit CTR passes the charging circuits B1 to Bn sequentially to charge the respective charge storage components LSBT up to one for generating a light pulse the light-emitting diode dies D1D assigned to the respective charge storage component LSBT controls the required degree of charge and, before driving the next charging circuit B1 to Bn, drives the transistor Tdis to turn on its conduction path LPF. 8. Light module according to number 7, wherein the first line path connection fields are designed as partial areas of a single common first line path connection field and / or wherein the second line path connection fields are designed as partial areas of a single common second line path connection field. 9. Light module according to one of numbers 1 to 8, wherein the at least one light-emitting diode die D1D is implemented as a laser diode die with a laser diode designed as an edge emitter. 10. Light module according to one of numbers 1 to 9 with a first supply voltage connection field exposed on the top TRO of the carrier TR for a supply voltage potential VDD, being connected to the second line path connection field TAF2 of the transistor Tdis or, if several such second line paths -Connection fields are present, a supply voltage reference potential GND can be applied to all of these second line path connection fields of the transistor or to a second line path connection field that is common to all of these second line path connection fields. 11. Light module according to number 10 with a buffer capacitor component forming a buffer capacitor CVDD with a bottom on which a first connection field is arranged and a top on which a second connection field is arranged, the buffer capacitor component with its first connection field on the second line path connection field or the second line path connection fields or the second line path connection field common to all of these second line path connection fields is arranged lying on top and the connection fields on both sides are connected to one another and wherein the second connection field of the buffer capacitor component is electrically connected to the first supply voltage via at least a third bonding wire (BD3). connection panel is connected. 12.Light module according to number 7 or one of numbers 8 to 11, if directly or indirectly referred to number 7, whereby the light-emitting diode die D1D and the charge storage components LSBT are arranged one after the other along two adjacent lines, each light-emitting diode die D1D and the The charge storage component LSBT assigned to this respective one is arranged opposite one another in order to minimize the length of the first bonding wires BD1 which electrically connect their second connection fields. 13. Light module according to number 12, whereby each light-emitting diode D1D defines an optical axis along which a light beam emanating from the relevant light-emitting diode D1D is directed, the line along which the light-emitting diode D1D are successively arranged either in the shape of a circular arc runs around a center point and the optical axes of the LED dies D1D run radially to this circular arc-shaped line or run in a straight line and the optical axes of the LED dies D1D run perpendicular to it. 14. Light module according to one of numbers 1 to 13, wherein the or each charge storage component (LSBT) has a charge storage capacitor C1 to Cn. 15. Light module according to numbers 14 and 11, wherein the charge storage component or components LSBT and the buffer capacitor component are designed as a common component KA, which has a bottom with a common bottom connection field and a top with at least a first top connection field and a second top connection field. Connection field and a dielectric between the bottom connection field on the one hand and the at least one first top connection field and the second top connection field on the other hand, the buffer capacitor between the second top connection field and the portion of the bottom connection field lying below this second top connection field is formed and each charge storage capacitor is formed between another of the first top connection fields and the portion of the bottom connection field lying below this respective first top connection field. 16. Light module according to one of numbers 1 to 15, wherein the carrier TR has a potting compound in which a lead frame having a plurality of conductor tongues and the circuit die electrically connected to the conductor tongues are embedded, the conductor tongues being on the top TRO of the carrier TR have exposed connection panels. 17.Light module according to one of numbers 1 to 16, wherein the transistor T dis of the circuit is designed as a voltage-controlled overall transistor designed using analog circuit technology and having an overall control connection GSA and an overall line path for conducting an electrical current over the overall line path and for blocking the Current is formed, wherein the overall control connection GSA extends over a total control connection area GF of the circuit die, the control circuit CTR having a driver circuit designed in digital circuit technology for controlling the overall control connection GSA of the overall transistor for conducting and blocking the current, or that Circuit - which has a driver circuit designed in digital circuit technology and controllable by the control circuit for controlling the overall control connection GSA of the overall transistor for conducting and blocking the current, the overall transistor being divided into a large number of individual transistors designed in analog circuit technology or a large number of such individual transistors has, wherein each individual transistor has an individual control connection ESA and the individual control connections ESA of the individual transistors each extend over individual control connection areas of the die, which are the same size and / or evenly distributed over the total control connection area GF of the overall transistor, the driver circuit having a plurality of individual driver circuits T1 to T9, each with one input and u outputs, with u as an integer natural number greater than or equal to 2, which are hierarchically divided into different stages, the output of a single transistor circuit of an i-th stage, with i equal to 1 to v and v is connected as an integer natural number greater than or equal to 2 to the inputs of u individual driver circuits of the (i+1)th stage, the arrangement consisting of a single driver circuit of the ith stage and the individual driver circuits of the (i+1 )-th stage, the inputs of which are connected to the outputs of the individual driver circuit of the i-th stage, forms a self-similar structure, the self-similar structures of an i-th stage being larger in area than the self-similar structures of an (i + 1)-th stage and the self-similar structures of the i-th stage are interleaved with an (i+1)-th stage with the self-similar structure of an i-th stage from which it emerged, and the outputs of the individual driver circuits T1 to T9 of the v- th stage are connected to the individual control connection areas GFE of the individual transistors. 18. Light module according to number 17, each individual driver circuit T1 to T9 having one input and four outputs, each of the individual driver circuits T1 to T9 of the i-th stage and the four individual driver circuits T1 to T9 of the (i+1)-th stage together with the Electrical connection of the four outputs of the individual driver circuits T1 to T9 of the i-th stage with the inputs of the four individual driver circuits T1 to T9 of the (i+1)-th stage forms an H-shaped structure, the individual driver circuits T1 to T9 of the (i+ 1)-th stage are arranged at the four ends of the H-shaped structure and the single driver circuit T1 to T9 of the i-th stage is arranged in the middle between the four ends, and the H-shaped structures are the same from stage to stage Have alignment. 19. Light module according to number 18, each individual driver circuit having one input and two outputs, each of the individual driver circuits of the i-th stage being arranged in the middle between the two individual driver circuits of the (i+1)-th stage and together with the electrical connection of the The two outputs of the individual driver circuit of the i-th stage form a rectilinear structure with the inputs of the two individual driver circuits of the (i+1)-th stage, and these self-similar structures are rotated by 90° to each other from stage to stage. 20. Light module according to one of numbers 17 to 19, wherein the individual driver circuits T1 to T9 are designed as inverter circuits and the individual transistors are designed as power transistors, in particular MOSFET. 21.Light module according to one of numbers 1 to 20, wherein the top side TRO of the carrier TR has a rectangular shape with two longitudinal edges and two transverse edges that are shorter in comparison to these longitudinal edges, the at least one first line path connection field TAF1 of the transistor Tdis being on one of the two Transverse edges are arranged and on the other transverse edge connection fields for the energy supply of the control circuit CTR, the at least one charging circuit B1 to Bn, the at least one charge storage component LSBT and the at least one light-emitting diode die D1D are arranged. 22. Light module according to number 21, wherein on each of the longitudinal edges of the top TRO of the carrier TR one of two transfer signal connection fields of at least one pair of transfer signal connection fields are arranged, which are electrically connected to one another and the supply of transfer signals intended for the circuit such as a reset signal, a diagnostic signal, a bus communication signal, a trigger signal for triggering the generation of a light pulse by the at least one light-emitting diode die, the transfer signals being transferred from one light module to the adjacent light module or from one light module to the next when several light modules are arranged side by side Processing in its circuit which can be forwarded to the neighboring light module. 23. Arrangement of several light modules according to number 22, wherein the light modules are arranged next to one another with the longitudinal edges of their top sides adjacent to one another, in particular with parallel alignment of the longitudinal edges, the transfer signal connection fields of the same pairs of transfer signal connection fields of two adjacent light modules being electrically connected to one another are. 24. Arrangement according to number 23, wherein the light-emitting diode dies D1D of all light modules arranged next to one another are arranged on a common arc-shaped curved line or on a straight line. 25. LIDAR device for optically scanning a room and for recording a distance image representing the room, with at least one light module according to number 7 or according to one of numbers 8 to 24, if directly or indirectly referred to number 7, with each light-emitting diode die D1D of each light module when the relevant light-emitting diode is activated - this D1D is a light beam with an elliptical or oval-shaped light beam cross-section with a first semi-axis and with a second semi-axis that is longer than the first semi-axis or with a circular cross section, a transmitter optical element SLE for expanding the light beam of each of the Light-emitting diodes - This is done by stretching the elliptical or oval-shaped light beam cross section along the second semi-axis and compressing the light beam cross section along the first semi-axis or vice versa to form a light beam fan with a line-like and / or slot-like cross section directed towards the space to be scanned or by stretching the circular light beam cross section into one The light beam fan directed towards the space to be scanned has a line-like and / or slot-like cross section, the cone-shaped light beams generated by the light-emitting diode dies D1D arranged next to one another entering the room as light beam fans at different angles, a photosensor S with a plurality of photodetectors which are in one of the Total number of light-emitting diodes D1D of the number of rows or columns equal to at least one light module are arranged, each row or column having the same number of photodetectors, a receiver optical element EL for directing potential reflected light from the space to be scanned onto the photosensor S, whereby on Due to the respective light beam fan, reflected light that potentially arises strikes another of the several rows or columns of photodetectors of the photosensor, and an evaluation unit for evaluating signals from the photodetectors to determine distance information and / or to determine a distance image of the space to be scanned. 26. LIDAR device according to item 25, wherein the receiver optical element has an imaging lens. 27.LIDAR device according to number 25 or 26, wherein the transmitter optical element has a cylindrical lens and a Powell lens or wherein the transmitter optical element has a lens that combines the functions of a cylindrical lens and a Powell lens. 28. LIDAR device according to one of numbers 25 to 27 with at least two light modules, the light-emitting diode dies of each light module each being arranged next to one another along a circular arc line extending over a predetermined angle and adjacent light modules being arranged rotated relative to one another by the predetermined angle. 29. LIDAR device according to one of numbers 25 to 27 with at least two light modules, the light-emitting diode dies of each light module being arranged next to one another along a straight line and adjacent light modules being arranged rotated at an angle to one another, so that the optical axes of those light-emitting diodes -This of the light modules, which are arranged at the same position within the sequence of light-emitting diodes-This D1D of each light module, intersect at a common point. 30. LIDAR device for optically scanning a room and for recording a distance image representing the room, with a light module with a single light-emitting diode die D1D according to one of claims 1 to 24, wherein from the light-emitting diode die D1D when activated a light beam with a elliptical or oval-shaped light beam cross section with a first semi-axis and a second semi-axis which is longer than the first semi-axis or with a circular cross section, a transmitter optical element SLE for expanding the light beam of the light-emitting diode die D1D by stretching the elliptical or oval-shaped light beam cross section along the second semi-axis and Compression of the light beam cross section along the first semi-axis or vice versa to form a light beam fan with a line-like and / or slit-like cross section directed at the space to be scanned or by stretching the circular light beam cross section to form a light beam fan directed to the space to be scanned with a line-like and / or slit-like cross section, a movable one optical deflection element for deflecting the light beam fan at different angles into the space to be scanned for scanning the space by means of the light beam fan sweeping over it, a photosensor S with a plurality of photodiodes arranged in rows and columns, a receiver optical element EL for directing potential reflected light from the space to be scanned on the photosensor S, with potential reflection light, which arises due to each light beam fan deflected into the room at a different angle, striking another of the several rows or columns of photodetectors of the photosensor S, and an evaluation unit for evaluating signals from the photodetectors for determining distance information and / or for determining a distance image of the space to be scanned. 31. LIDAR device according to number 30, wherein the optical deflection element works refractively and is designed in particular as a prism or wherein the optical deflection element works reflectively and is designed in particular as a mirror. 32. LIDAR device according to one of numbers 25 to 31 with a tilting movement device for tilting the at least one light module or for tilting the arrangement of several light modules or for tilting the photosensor, the signals from the photodetectors of the photosensor being evaluated depending on the respective tilting angle , under which the light-emitting diode dies of the light module(s) emit light and / or the photosensor receives reflected light. 33.LIDAR device according to one of numbers 25 to 32, wherein each light-emitting diode die D1D emits a light beam as a scanning light beam with an elliptical or oval-shaped or circular light beam cross-section, the transmitter optical element SLE expanding the scanning light cone into a scanning light fan which lies in a light fan plane, the Scanning light fans of the scanning light beams of all light-emitting diode dies D1D are offset from one another by an angular offset, with reflection radiation potentially emanating from scanning points illuminated by a scanning light fan in the space to be scanned, essentially in the form of reflected light cones, and the receiver optical element EL reflecting light cones that potentially come from scanning points illuminated by one of the scanning light fans of the space to be scanned, maps onto a photodetector column or row of the photosensor. 34. LIDAR device according to paragraph 33, wherein the light-emitting diode dies D1D are arranged next to one another in a row, the orientation of which is the same as the orientation of a photodetector column of the photosensor S, and each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row are whose orientation is the same as the orientation of a photodetector line of the photosensor S. 35. LIDAR device according to number 33, wherein the light-emitting diode dies D1D are arranged next to one another in a row, the orientation of which is equal to a photodetector line of the photosensor S, and each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row, whose orientation is the same as the orientation of a photodetector line of the photosensor S. 36. LIDAR device according to paragraph 33, wherein the light-emitting diode dies D1D are arranged next to one another in a row, the orientation of which is the same as the orientation of a photodetector column of the photosensor S, and each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row are whose orientation is the same as the orientation of a photodetector column of the photosensor S. 37. LIDAR device according to number 33, wherein the light-emitting diode dies D1D are arranged next to one another in a row, the orientation of which is equal to a photodetector line of the photosensor S, and each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to one another in a row, whose orientation is equal to a photodetector column of the photosensor S. 38. LIDAR device according to one of numbers 25 to 37, wherein the transmitter optical element SLE has a lens having an optical axis with a height, a width and a thickness aligned in the extension of the optical axis and with a first main side and a second main side facing away from this, through which the optical axis runs, the first main side having a flat surface, the second main side having a surface which is formed as an overlay of a convex protrusion and a concave indentation arranged in the middle of the width extension of the lens, wherein the protrusion runs around an imaginary first axis, which lies outside the lens, and the indentation runs around a second axis, which also lies outside the lens and is directed perpendicular to the first axis. 39. LIDAR device according to item 38, wherein the first axis lies in a half-space adjoining the first main side of the lens and the second axis lies in a half-space adjoining the second main side of the lens. 40.LIDAR device according to one of numbers 25 to 37, wherein the transmitter optical element SLE is a lens having an optical axis with a height, a width and a thickness aligned in the extension of the optical axis and with a first main side and a second main side facing away from this, through which the optical axis runs through each, the first main side being an overlay of a flat surface with a concave first indentation arranged in the middle of the width extension of the lens and with a bending of the lens directed towards the second main side in the areas on both sides of this indentation second main side is formed, the second main side being formed as an overlay of a convex first protrusion and a convex second protrusion arranged in the middle of the width extension of the lens, the first protrusion extending around an imaginary first axis arranged outside the lens , wherein the second protrusion extends around an imaginary second axis, also arranged outside the lens, which is directed perpendicular to the first axis, and wherein the indentation extends around an imaginary third axis, also arranged outside the lens, which is parallel to the second axis is directed. 41. LIDAR device according to number 40, wherein the first axis and the second axis and the third axis lie in a half space adjacent to the first main side of the lens and that the bending of the lens in its areas on both sides of the indentation of the first main side by a fourth Axis extends, which runs parallel to the second axis and the third axis and lies in a second half space adjacent to the second main side. 42. LIDAR device according to any one of numbers 38 to 41, wherein the first main page has an area defined by a function of the form. z = RY + AR 2 * x 2 + AR3 * x 3 − Sign RY * Sqrt RY2 − y2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY = R 0 Y + AR 2 * x 2 + AR3 * x 3 , Sign() as the signum function of a function parameter, Sqrt() as the root of a function parameter, x for a point along the width of the lens, y for a point along the height of the lens, z for a point along the thickness and thus along the optical Axis of the lens, starting from the xy center plane of the lens, and R0Y as the radius of curvature of the lens, the second main side has an area that is defined by a function of the shape z = − d + PC 2 * x 2 + PC3 * x 3 , with d as the thickness of the lens in the optical center, the parameters PB2 and PB3 being non-zero and at least two of the parameters AR2, AR3, PB4, PB6, PC2 and PC3 being non-zero. 43. LIDAR device according to paragraph 42, wherein the parameters AR2 and AR3 are non-zero and at least two of the parameters PB4, PB6, PC2 and PC3 are non-zero. 44. LIDAR device according to paragraph 43, wherein the parameters PB4 and PB6 are non-zero and at least one of the parameters PC2 and PC3 is non-zero. 45. LIDAR device according to paragraph 44, both parameters PC2 and PC3 being non-zero. 46. ​​Use of one or more light modules according to one of numbers 1 to 24 or the LIDAR device according to one of numbers 25 to 45 for the detection of objects in the surroundings of or in a sub-area of ​​the surroundings of a stationary or mobile platform, in particular an autonomous one moving platform, in particular an autonomously moving platform, such as a robot or a stationary or moving, in particular autonomously driving vehicle, such as a water, land or aircraft for, in particular, passenger or freight transport, or the detection of objects in the Automation of manufacturing processes, or the non-invasive imaging of living organisms and / or biological organs of a living being, or the examination of biological tissue, or the creation of three-dimensional distance images of objects in a detection room, and / or the monitoring of the surroundings of buildings. 47. Integrated electrical circuit for switching electrical currents, in particular in one or more light modules according to one of the numbers 1 to 24 or in a LIDAR device according to one of the numbers 25 to 45, with a die in which the die is designed using analog circuit technology , voltage-controlled overall transistor having an overall control connection and an overall conduction path for conducting an electrical current over the overall conduction path and for blocking the current, the overall control connection extending over a total control connection area of ​​the die, a driver circuit designed in digital circuit technology for controlling the Overall control connection of the overall transistor for conducting and blocking the current, each individual transistor having an individual control connection and the individual control connections of the individual transistors each extending over individual control connection areas of the die, which are the same size or evenly distributed over the total control connection area of ​​the overall transistor, the driver circuit being a A plurality of individual driver circuits, each with one input and u outputs, with u as an integer natural number greater than or equal to 2, which are hierarchically divided into different stages, the output of a single transistor circuit of an i-th stage, with i equal to 1 to v and v is connected as an integer natural number greater than or equal to 2 to the inputs of u individual driver circuits of the (i+1)th stage, the arrangement consisting of a single driver circuit of the ith stage and the individual driver circuits of the (i+1 )-th stage, the inputs of which are connected to the outputs of the individual driver circuit of the i-th stage, forms a self-similar structure, the self-similar structures of an i-th stage being larger in area than the self-similar structures of an (i + 1)-th stage and the self-similar structures of the i-th stage with an (i+1)-th stage are nested with the self-similar structure of an i-th stage from which it emerged, and the outputs of the individual driver circuits of the v-th stage with the individual control connection areas of the individual transistors are connected. 48.Integrated electrical circuit according to number 47, wherein each individual driver circuit has one input and four outputs, that each of the individual driver circuits of the i-th stage and the four individual driver circuits of the (i+1)-th stage together with the electrical connection of the four outputs of the individual driver circuit of the i -th stage forms an H-shaped structure with the inputs of the four individual driver circuits of the (i+1)th stage, the individual driver circuits of the (i+1)th stage being arranged at the four ends of the H-shaped structure and the Single driver circuit of the i-th stage is arranged midway between the four ends, and that the H-shaped structures have the same orientation from stage to stage. 49. Integrated electrical circuit according to number 47, each individual driver circuit having one input and two outputs, each of the individual driver circuits of the i-th stage being arranged in the middle between the two individual driver circuits of the (i+1)-th stage and together with the electrical Connection of the two outputs of the individual driver circuit of the i-th stage with the inputs of the two individual driver circuits of the (i+1)-th stage forms a rectilinear structure and that these self-similar structures are rotated by 90 ° to each other from stage to stage. 50. Integrated electrical circuit according to one of numbers 47 to 49, wherein the individual driver circuits are designed as inverter circuits and wherein the individual transistors are designed as power transistors, in particular MOSFETs. 51. Optical unit for a LIDAR device, the LIDAR device being provided with one or more light modules according to one of numbers 1 to 24, each light-emitting diode die D1D emitting a light beam with an elliptical or circular cross section, each light beam having a light beam axis has, wherein the light beam axes lie essentially in a common light beam axis plane and the light beam axis plane defines an optical axis, a lens arranged on the optical axis of the light beam axis plane, which expands each light beam in a direction perpendicular to the laser beam axis plane, so that a light fan is formed for each of the light beams a light fan plane perpendicular to the light beam axis plane, a photosensor S with a photodetector array which has a plurality of photodetector rows, each with a large number of photodetector pixels, and imaging optics for the real optical imaging of a scene illuminated by the light fans onto the photosensor S, the imaging optics carrying out the projection the light beam fan in the far field is imaged onto an ideally homogeneously white and / or essentially ideally diffuse, uniformly and uniformly reflecting projection plane perpendicular to the optical axis of the light beam axis plane in the form of a projection image of the light beam fan onto the photosensor S as an image image of the scene, the lens being shaped in this way, that the value of the illumination intensity of a first section of the image of the projection of a first light beam fan onto a first photodetector pixel of the photodetector array of the photosensor S is different from the value of the illumination intensity of a second section of the image of the projection of the first light beam fan onto a different from the first photodetector pixel second photodetector pixel or a second light beam fan to a second photodetector pixel of the photodetector array of the photosensor S that differs from the first photodetector pixel by not more than 10% or by not more than 5% or by not more than 2%, the lens has a first surface and a this has a second surface facing away from it, the first surface is defined by a function of the shape. z = RY + AR 2 * x 2 + AR3 * x 3 − Sign RY * Sqrt RY2 − y2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY = R 0 Y + AR 2 * x 2 + AR3 * x 3 , Sign() as the signum function of a function parameter, Sqrt() as the root of a function parameter, x for a point along the width of the lens, y for a point along the height of the lens, z for a point along the thickness and thus along the optical Axis of the lens, starting from the x-y center plane of the lens, and R0Y as the radius of curvature of the lens, the second surface is defined by a function of shape z = − d + PC 2 * x 2 + PC 3 * x 3 , with d as the thickness of the lens in the optical center, the parameters PB2 and PB3 being non-zero and at least two of the parameters AR2, AR3, PB4, PB6, PC2 and PC3 being non-zero. 52. Optical unit according to paragraph 51, wherein the parameters AR2 and AR3 are non-zero and at least two of the parameters PB4, PB6, PC2 and PC3 are non-zero. 53. Optical unit according to paragraph 52, wherein the parameters PB4 and PB6 are non-zero and at least one of the parameters PC2 and PC3 is non-zero. 54. Optical unit according to number 53, where both parameters PC2 and PC3 are different from zero. GLOSSARY Powell lenses

[0257] Powell lenses are used to generate a line-shaped beam profile from an elliptical or oval-shaped Gaussian beam (i.e. with a Gaussian intensity distribution). A homogeneous intensity distribution is preferably generated along the line; perpendicular to it, the Gaussian distribution of the laser is retained. Line optics can be manufactured with an opening angle of a few degrees to over 90°.

[0258] However, the Powell function is only a secondary task of these lenses within the scope of the technical teaching described here. The primary task is to focus all laser beams in a vertical direction. An optic that fulfills this function is already referred to as a Powell lens for the purposes of this document and is included in the claims. The focusing of all laser beams in the vertical direction is achieved, for example, by the other side of the Figs. 14 and 19 to 22 lenses shown. The Powell function would not be absolutely necessary since a Gaussian distribution in the horizontal direction would also be acceptable for the purpose described here. In such a case, the device would have a greater measuring range in the forward direction than in the sideways direction, which may actually be desired depending on the application. It is possible to integrate both functions in one interface. The other side of such a lens may then be flat. This lens would also be covered by the claims. Such a lens in the sense of the invention is characterized by vertical focusing. One could then logically speak of a “scanning lens” instead of a Powell lens with such a lens, which is of course included in the invention. REFERENCE SYMBOL LIST

[0259] A1first axis A2second axis AFconnection panel of the charging circuit B0'first structure B1first charging circuit for the first capacitor C1, which supplies the first laser D1 with electrical energy for light pulse generation B1'first basic structure B2second charging circuit for the second capacitor C2, which supplies the second laser D2 for light pulse generation, B2' first self-similar structure B3 third charging circuit for the third capacitor C3, which supplies the third laser D3 for light pulse generation with electrical energy BD1 first bonding wire BD2 second bonding wire BD3 third bonding wire Bnn-th charging circuit for the nth capacitor Cn, which supplies the nth laser Dn with electrical energy if necessary in the event of light pulse generation Bufdriver, which amplifies the pulse pre-signal PL to the pulse signal G dis C1first capacitor as an energy reserve for the first laser D1 C2second capacitor as an energy reserve for the second laser D2 C3third Capacitor as energy reserve for the third laser D3 Cnn-th Capacitor as energy reserve for the nth laser Dn CSSelection signal CTRControl circuit that controls the n charging circuits B1 to Bn and generates the pulse pre-signal PL. The control circuit causes one of the n charging circuits to typically charge one of the n capacitors before the generation of a light pulse by one of the n lasers, then preferably switches off all charging circuits or preferably switches off the charging outputs of all charging circuits to a high resistance and then closes the control switch Tdis, which initiates the light pulse generation. The control circuit repeats this process until all n lasers have preferably emitted a light pulse exactly CVDD once and then starts again from the beginning with the next pass of the supporting capacitor to stabilize the operating voltage VDD D1first laser D1DLaser diodes-Die D2second laser D3third laser D4fourth laser DAF1first connection field of a laser diode -This DAF2 second connection field of a charger diode -This DisC first star point and contact surface for the first star point. The cathodes of the lasers D1 to Dn are preferably connected to the first star point. When a pulse signal G dis arrives, the first star point is connected to the reference potential GND through the control switch T dis ). If one of the capacitors C1 to Cn was previously charged, this capacitor is then discharged via the corresponding laser, which then emits a light pulse. DisKsecond star point as a common connection point of the capacitors C1 to Cn Dnnth laser DPerster signal connection DRDrone ELEreceiving lens ESAIndividual control connection of a single transistor F1first field effect transistor part F2second field effect transistor part F3third field effect transistor part F4fourth field effect transistor part G0second connection of the first structure B0' G1second connection of the first basic structure B1' G0<1;n >n second connections of the n structures B0' G1<1;n>n second connections of the n first basic structures B1' G dis pulse signal GFControl connection total area GFEControl connection individual area GNDContact area for reference potential, reference potential GNDAanalog reference potential GNDDdigital reference potential GNDHReference potential for the high supply voltage GNDPReference potential of the interfaces GND0third connection of the first structure B0' GND1third connection of the first basic structure B1' GND2third connection of the first self-similar structure B2' GND0<1;n>n third connections of the n structures B0' GND1<1;n>n third connections of the n first basic structures B1 'Gsage office connection of the transistor GT DIS Tax connection of the transistor HVERSTES Reference potential ITREUTER switching part of the first driver i1erster part of the second driver i2erster part of the third driver L1erste L2 -second management L4vened management l5funsten management L6 -sixt management L8Gente Head of Ldlaserdeff Ekttranistist M0erster part of the first field effect transistor K1first charging line, via which the first charging circuit B1 charges the first capacitor C1 before a light pulse is generated by the first laser D1 K1 'first discharge line, via which the first laser D1 discharges the first capacitor C1 when the control switch T dis is closed by the pulse signal G dis. K2 second charging line, via which the second charging circuit B2 discharges the second capacitor C2 before a light pulse is generated by the second laser D2 charges K2' second discharge line, via which the second laser D2 discharges the second capacitor C2 when the control switch T dis is closed by the pulse signal G dis K3 third charging line, via which the third charging circuit B3 discharges the third capacitor C3 before a light pulse is generated by the third laser D3 charges K3' third discharge line, via which the third laser D3 discharges the third capacitor C3 when the control switch T dis is closed by the pulse signal G dis KA capacitor array KG' virtual node of the supply voltage VDD KL optional curved line along which the laser Modules and / or their lasers are aligned. Knn-th charging line, via which the n-th charging circuit Bn charges the n-th capacitor Cn before a light pulse is generated by the n-th laser Dn. Kn'n-th discharge line, via which the n-th laser Dn charges the n-th capacitor Cn discharges when the control switch T dis is closed by the pulse signal G dis KRUnderside contact of the capacitor array LLIDAR system LAF1first connection field of the charge storage component LAF2second connection field of the charge storage component LC1Inductance of the line with which the second contact of the first capacitor C1 is connected to the reference potential LC2Inductance the line with which the second contact of the second capacitor C2 is connected to the reference potential LC3Inductance of the line with which the second contact of the third capacitor C3 is connected to the reference potential LCnInductance of the line with which the second contact of the nth capacitor Cn Connected to the reference potential is LCV line inductance between the second connection of the supporting capacitor CVDD and the reference potential GND LF1 first light fan of the first laser D1 LF2 second light fan of the second laser D2 LF3 third light fan of the third laser D3 LF4 fourth light fan of the fourth laser D4 LDZ laser diode row LPF line path of the transistor LPF1 first end region of the line path LPF 2second End region of the line path LSBT charge storage component LZ1 inductance of the first charging line K1, via which the first charging circuit B1 charges the first capacitor C1 before a light pulse is generated by the first laser D1 LZ2 inductance of the second charging line K2, via which the second charging circuit B2 charges the second capacitor C2 before a light pulse is generated by the second laser D2 charges LZ3 inductance of the third charging line K3, via which the third charging circuit B3 charges the third capacitor C3 before a light pulse is generated by the third laser D3. LZn inductance of the nth charging line Kn, via which the nth charging circuit Bn charges the nth capacitor Cn before a light pulse is generated by the nth laser Dn charges LZVLine inductance of the supply line to the backup capacitor CVDD MECenter plane of the lens MOSIInput of the SPI data bus MISOOutput of the SPI data bus OF1first lens surface OF2second lens surface PLPowell lens PulseExample signal that is supplied to all modules R1example first local radius vector for the curvature of the first surface OF1 about an exemplary first axis A1 R2 exemplary second local radius vector for the curvature of the second surface OF2 about an exemplary second axis A2 PLPulse pre-signal RC1 resistance of the line with which the second contact of the first capacitor C1 is connected to the reference potential RC2 resistance of the Line with which the second contact of the second capacitor C2 is connected to the reference potential RC3Resistance of the line with which the second contact of the third capacitor C3 is connected to the reference potential RCnResistance of the line with which the second contact of the nth capacitor Cn is connected the reference potential is connected RCV line resistance between the second connection of the backup capacitor CVDD and the reference potential GND RST reset signal RZ1 resistance of the first charging line K1, via which the first charging circuit B1 charges the first capacitor C1 before a light pulse is generated by the first laser D1 RZ2 resistance of the second charging line K2,via which the second charging circuit B2 charges the second capacitor C2 before a light pulse is generated by the second laser D2. RZV line resistance of the third charging line K3, via which the third charging circuit B3 charges the third capacitor C3 before a light pulse is generated by the third laser D3 RZnResistance of the nth charging line Kn, via which the nth charging circuit Bn charges the nth capacitor Cn before a light pulse is generated by the nth laser Dn SPhotosensor S0first connection of the first structure B0' S1first connection of the first basic structure B1' S2first connection the first self-similar structure B2' S0<1;n>n first connections of the n structures B0' S1<1;n>n first connections of the n first basic structures B1' SCC clock signal of the SPI data bus SLS transmitter lens SLE transmitter optical element TAF1 first line path connection field TAF2 second line path connection field T dis control switch preferably designed as a transistor TR carrier TRIG connection for the ignition signal TROO top of the carrier T1 first driver part T2 second driver part T3 third driver part T4 fourth driver part T5 fifth driver part T6 sixth driver part T7 seventh driver part T8 eighth driver part T9 ninth driver part VDD supply voltage and contact surface for supply voltage VDDA analog supply voltage VDDD digital supply voltage VDDHhigh supply voltage VDDPsupply voltage of the interfaces ZL cylindrical lens, LITERATURE LIST

[0260] DE-A-195 14 062 DE-C- 195 46 563 DE-A-199 14 362 DE-B-10 2006 036 167 DE-A-10 2008 021 588 DE-A-10 2008 062 544 DE-A-10 2009 060 873 DE-A-10 2014 105 482 DE-A-10 2016 116 368 DE-A-10 2016 116 369 DE-A-10 2016 116 875 DE-A-10 2017 100 879 DE-A-10 2017 12 1 713 DE-A-10 2018 106 860 DE-A-10 2018 106 861 EP-A-2 002 519 EP-A-3 301 473 EP-A-3 660 574 US-A-2018 / 0045882 US-A-2020 / 0264426 US-B-6 697 402 US-B-9 115 146 US-B-9 185 762 US-B-9 368 936 US-B-10 193 304 WO-A-2008 / 035983 WO-A-2018 / 154139

Claims

1. LiDAR device for optically scanning a space and recording a distance image representing the space, comprising: - at least one light module, - the light module being provided with: - a carrier (TR) having a top surface (TRO) in which a circuit die with integrated circuits is arranged, - the circuit die having a top surface, - a transistor (T) formed in the top surface of the circuit die dis ), in particular a power transistor, - wherein the transistor (T dis ) a conducting or blocking switchable conduction path (LPF) with a first end region (LPF1) and a second end region (LPF2), the first end region (LPF1) being electrically connected to a first conduction path terminal field (TAF1) and the second end region (LPF2) being electrically connected to a second conduction path terminal field (TAF2), both of which are exposed on the top surface (TRO) of the carrier (TR), and wherein the transistor (T dis) a control connection (GT dis ) for conducting and blocking the conduction path (LPF), - a light-emitting diode die (D1D) comprising a light-emitting diode, in particular a light-emitting diode die comprising a laser diode, with a bottom surface comprising a first terminal field (DAF1) and a top surface comprising a second terminal field (DAF2), - wherein the light-emitting diode die (D1D) is connected with its first terminal field (DAF1) to the first conduction path terminal field (TAF1) of the transistor (T dis ) is arranged horizontally and these two terminal fields are electrically connected to each other, - a charge storage component (LSBT) comprising a charge storage element (C1 to Cn), which has a bottom surface having a first terminal field (LAF1) and a top surface having a second terminal field (LAF2), - wherein the charge storage component (LSBT) is connected with its first terminal field (LAF1) to the second conduction path terminal field (TAF2) of the transistor (Tdis ) is arranged horizontally and these two terminal fields are electrically connected to each other, - at least one first bond wire (BD1) that electrically connects the second terminal field (DAF1) of the LED die (D1D) to the second terminal field (LAF2) of the charge storage component (LSBT), - a charging circuit (B1 to Bn) integrated in the circuit die and having one output for charging the charge storage component (LSBT) with electrical charge, and - a control circuit (CTR) integrated in the circuit die for controlling the transistor (T dis) and the charging circuit (B1 to Bn), - wherein the charging circuit (B1 to Bn) is associated with a charge terminal field (AF) exposed on the top side (TRO) of the carrier (TR), to which the output of the charging circuit (B1 to Bn) is electrically connected, - wherein the charge terminal field (AF) of the charging circuit (B1 to Bn) is electrically connected to the second terminal field (LAF2) of the charge storage component (LSBT) via at least one second bond wire (BD2), and - wherein the control circuit (CTR) controls the charging circuit (B1 to Bn) to charge the charge storage component (LSBT) up to a charge level required for generating a light pulse through the LED die (D1D) and thereafter the transistor (T dis) to control the conduction path (LPF), - several LED dies (D1D) and several charge storage devices (LSBT), - wherein each LED die (D1D) is associated with a charge storage device (LSBT), - wherein the top surface (TRO) of the carrier (TR) provides for each LED die (D1D) an exposed first conduction path terminal field (TAF1) which is electrically connected to the first end region (LPF1) of the conduction path (LPF) of the transistor (T dis ) is connected, and for each charge storage device (LSBT) has an exposed second conduction path terminal field (TAF2) that is electrically connected to the second end region (LPF2) of the conduction path (LPF) of the transistor (T dis) is connected, - wherein in the circuit die for each charge storage component (LSBT) an associated charging circuit (B1 to Bn) is integrated and a charge terminal field (AF) is arranged exposed on the top side (TRO) of the carrier (TR) for each charging circuit (B1 to Bn), - wherein each light-emitting diode die (D1D) with its first terminal field (DAF1) is on the associated first conduction path terminal field (TAF1) of the transistor (T dis ) is arranged superimposed and these two terminal fields are electrically connected to each other, - wherein each charge storage component (LSBT) with its first charge terminal field (LAF1) is on the associated second conduction path terminal field (TAF2) of the transistor (T dis) is arranged on top of the device and these two terminal fields are electrically connected to each other, - wherein the second terminal field (DAF2) of each LED die (D1D) is connected to the second terminal field (LAF2) of the charge storage component (LSBT) associated with the respective LED die (D1D) by means of at least one first bond wire (BD1),- wherein the charge terminal field (AF) of each charging circuit (B1 to Bn) is connected to the second terminal field (LAF2) of the charge storage component (LSBT) assigned to the respective charging circuit (B1 to Bn) by means of at least one second bond wire (BD2) and - wherein the control circuit (CTR) sequentially controls the charging circuits (B1 to Bn) to charge the respective charge storage components (LSBT) up to a charge level required for the generation of a light pulse by the light-emitting diode dies (D1D) assigned to the respective charge storage component (LSBT) and, before controlling the next charging circuit (B1 to Bn), the transistor (T, dis) to control the conduction path (LPF), - wherein, when the respective LED die (D1D) of each light module is controlled, a light beam with an elliptical or oval cross-section with a first semi-axis and a second semi-axis longer than the first semi-axis, or with a circular cross-section, is emitted from each LED die (D1D), - to a transmitter optical element (SLE) for widening the light beam of each of the LED dies by stretching the elliptical or oval cross-section along the second semi-axis and compressing the cross-section along the first semi-axis, or vice versa, to form a fan-shaped light beam directed towards the space to be scanned, with a linear and / or slit-like cross-section, or by stretching the circular cross-section to form a fan-shaped light beam directed towards the space to be scanned, with a linear and / or slit-like cross-section,- wherein the cone-shaped light beams generated by the adjacently arranged light-emitting diode dies (D1D) enter the space as a light beam fan at different angles, - a photosensor (S) with a plurality of photodetectors arranged in a number of rows or columns equal to the total number of light-emitting diode dies (D1D) of the at least one light module, wherein each row or column has the same number of photodetectors, - a receiver optical element (EL) for directing potential reflected light from the space to be scanned onto the photosensor (S), wherein, due to the respective light beam fan, potentially generated reflected light strikes another of the multiple rows or columns of photodetectors of the photosensor, and - an evaluation unit for evaluating signals from the photodetectors to determine distance information and / or to determine a distance image of the space to be scanned.

2. LIDAR device according to claim 1, characterized by the fact that The receiver optical element has an imaging lens.

3. LIDAR device according to claim 1 or 2, characterized by the fact that the transmitter optical element has a cylindrical lens and a Powell lens, or that the transmitter optical element has a lens that combines the functions of a cylindrical lens and a Powell lens.

4. LIDAR device according to any one of claims 1 to 3, characterized by at least two light modules, wherein the light-emitting diode dies of each light module are arranged side by side along a circular arc extending over a predetermined angle, and adjacent light modules are arranged rotated relative to each other by the predetermined angle.

5. LIDAR device according to any one of claims 1 to 3, characterized byat least two light modules, wherein the LED dies of each light module are arranged side by side along a straight line and adjacent light modules are arranged rotated by an angle to each other, so that the optical axes of those LED dies of the light modules that are arranged at the same position within the sequence of LED dies (D1D) of each light module intersect at a common point.

6. LiDAR device for optically scanning a space and recording a distance image representing the space, comprising: - a light module with a single LED die (D1D), - the light module being provided with: - a carrier (TR) having a top surface (TRO) in which a circuit die with integrated circuits is arranged, - the circuit die having a top surface, - a transistor (T) formed in the top surface of the circuit die dis), in particular a power transistor, - wherein the transistor (T dis ) a conducting or blocking switchable conduction path (LPF) with a first end region (LPF1) and a second end region (LPF2), the first end region (LPF1) being electrically connected to a first conduction path terminal field (TAF1) and the second end region (LPF2) being electrically connected to a second conduction path terminal field (TAF2), both of which are exposed on the top surface (TRO) of the carrier (TR), and wherein the transistor (T dis ) a control connection (GT dis) for conducting and blocking the conduction path (LPF), - a light-emitting diode die (D1D) comprising a light-emitting diode, in particular a light-emitting diode die comprising a laser diode, with a bottom surface comprising a first terminal field (DAF1) and a top surface comprising a second terminal field (DAF2), - wherein the light-emitting diode die (D1D) is connected with its first terminal field (DAF1) to the first conduction path terminal field (TAF1) of the transistor (T dis ) is arranged horizontally and these two terminal fields are electrically connected to each other, - a charge storage component (LSBT) comprising a charge storage element (C1 to Cn), which has a bottom surface having a first terminal field (LAF1) and a top surface having a second terminal field (LAF2), - wherein the charge storage component (LSBT) is connected with its first terminal field (LAF1) to the second conduction path terminal field (TAF2) of the transistor (T dis) is arranged horizontally and these two terminal fields are electrically connected to each other, - at least one first bond wire (BD1) that electrically connects the second terminal field (DAF1) of the LED die (D1D) to the second terminal field (LAF2) of the charge storage component (LSBT), - a charging circuit (B1 to Bn) integrated in the circuit die and having one output for charging the charge storage component (LSBT) with electrical charge, and - a control circuit (CTR) integrated in the circuit die for controlling the transistor (T dis) and the charging circuit (B1 to Bn), - wherein the charging circuit (B1 to Bn) is associated with a charge terminal field (AF) exposed on the top side (TRO) of the carrier (TR), to which the output of the charging circuit (B1 to Bn) is electrically connected, - wherein the charge terminal field (AF) of the charging circuit (B1 to Bn) is electrically connected to the second terminal field (LAF2) of the charge storage component (LSBT) via at least one second bond wire (BD2), and - wherein the control circuit (CTR) controls the charging circuit (B1 to Bn) to charge the charge storage component (LSBT) up to a charge level required for generating a light pulse through the LED die (D1D) and thereafter the transistor (T dis) to control its conduction path (LPF), - wherein, upon activation, a light beam with an elliptical or oval cross-section with a first semi-axis and a second semi-axis longer than the first, or with a circular cross-section, is emitted from the LED die (D1D), - to a transmitter optical element (SLE) for widening the light beam of the LED die (D1D) by stretching the elliptical or oval cross-section along the second semi-axis and compressing the cross-section along the first semi-axis, or vice versa, to form a fan-shaped light beam directed towards the space to be scanned, with a linear and / or slit-like cross-section, or by stretching the circular cross-section to form a fan-shaped light beam directed towards the space to be scanned, with a linear and / or slit-like cross-section,- a movable optical deflection element for deflecting the light beam fan at different angles into the space to be scanned for scanning the space by means of the light beam fan sweeping over it, - a photosensor (S) with a plurality of photodiodes arranged in rows and columns, - a receiver optical element (EL) for directing potential reflected light from the space to be scanned onto the photosensor (S), - wherein potential reflected light, which arises due to each light beam fan being deflected into the space at a different angle, strikes a different one of the multiple rows or columns of photodetectors of the photosensor (S), and - an evaluation unit for evaluating signals from the photodetectors to determine distance information and / or to determine a distance image of the space to be scanned.

7. LIDAR device according to claim 6, characterized by the fact thatthe optical deflection element works refractively and is in particular designed as a prism, or that the optical deflection element works reflectively and is in particular designed as a mirror.

8. LIDAR device according to any one of claims 1 to 7, characterized by a tilting motion device for tilting the at least one light module or for tilting the arrangement of several light modules or for tilting the photosensor, wherein the evaluation of the signals of the photodetectors of the photosensor is carried out depending on the respective tilting angle at which the light-emitting diode dies of the light module(s) emit light and / or the photosensor receives reflected light.

9. LIDAR device according to any one of claims 1 to 8, characterized by - that Each LED die (D1D) emits a light beam as a scanning light beam with an elliptical, oval, or circular light beam cross-section, - thatthe transmitting optical element (SLE) widens the scanning light cone into a scanning light fan that lies in a light fan plane, - that the scanning light fans of the scanning light beams of all LED dies (D1D) are offset from each other by an angular offset, - that Potentially reflected radiation, essentially in the form of reflected light cones, emanates from scanning points in the space to be scanned, illuminated by a scanning light fan, and - that The receiver optical element (EL) maps reflection light cones, which potentially originate from scanning points of the space to be scanned illuminated by one of the scanning light fans, onto a photodetector column or row of the photosensor.

10. LIDAR device according to claim 9, characterized by - that the light-emitting diode dies (D1D) are arranged side by side in a row, the orientation of which is the same as the orientation of a photodetector slit of the photosensor (S), and - thatEach scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector row of the photosensor (S).

11. LIDAR device according to claim 9, characterized by - that the light-emitting diode dies (D1D) are arranged side by side in a row, the orientation of which is the same as a photodetector row of the photosensor (S), and - that Each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector row of the photosensor (S).

12. LIDAR device according to claim 9, characterized by - that the light-emitting diode dies (D1D) are arranged side by side in a row, the orientation of which is the same as the orientation of a photodetector slit of the photosensor (S), and - thatEach scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is the same as the orientation of a photodetector slit of the photosensor (S).

13. LIDAR device according to claim 9, characterized by - that the light-emitting diode dies (D1D) are arranged side by side in a row, the orientation of which is the same as a photodetector row of the photosensor (S), and - that Each scanning light fan illuminates scanning points in the space to be scanned, which are arranged next to each other in a row, the orientation of which is equal to a photodetector column of the photosensor (S).

14. LIDAR device according to any one of claims 1 to 13, characterized by - thatThe transmitter optical element (SLE) comprises a lens having an optical axis, with a height, a width, and a thickness aligned in the extension of the optical axis, and with a first main surface and a second main surface facing away from it, through which the optical axis passes, - wherein the first main surface has a flat surface, - wherein the second main surface has a surface formed as a superposition of a convex protrusion and a concave indentation arranged in the middle of the width extension of the lens, - wherein the protrusion extends about an imaginary first axis lying outside the lens and the indentation extends about a second axis also lying outside the lens, which is directed perpendicular to the first axis.

15. LIDAR device according to claim 14, characterized by the fact thatthe first axis lies in a half-space adjoining the first main side of the lens and the second axis lies in a half-space adjoining the second main side of the lens.

16. LIDAR device according to any one of claims 1 to 13, characterized by - that the transmitting optical element (SLE) comprises a lens having an optical axis with a height, a width and a thickness aligned in the extension of the optical axis and with a first main surface and a second main surface facing away from it, through which the optical axis passes, - that the first main surface as a superposition of a flat surface with a concave first indentation arranged in the middle of the width of the lens and with a bending of the lens directed towards the second main surface in the areas of which are formed on both sides of this indentation towards the second main surface, - thatthe second main surface is formed as a superposition of a convex first protrusion and a convex second protrusion arranged in the middle of the width of the lens, - wherein the first protrusion extends about an imaginary first axis located outside the lens, - wherein the second protrusion extends about an imaginary second axis, also located outside the lens, which is directed perpendicular to the first axis, and - wherein the indentation extends about an imaginary third axis, also located outside the lens, which is directed parallel to the second axis.

17. LIDAR device according to claim 16, characterized by the fact thatthe first axis, the second axis, and the third axis lie in a hemisphere adjacent to the first main surface of the lens, and that the curvature of the lens in its areas extends on both sides of the indentation of the first main surface around a fourth axis, which runs parallel to the second axis and the third axis and lies in a second hemisphere adjacent to the second main surface.

18. LIDAR device according to any one of claims 14 to 17, characterized by the fact that - the first main page has an area defined by a function of the form z = RY + AR 2 * x 2 + AR 3 * x 3 − Sign RY * Sqrt RY 2 − y 2 + PB 2 * x 2 + PB 3 * x 3 + PB 4 * x 4 + PB 6 * x 6 + PC 2 * x 2 + PC 3 * x 3 with RY = R 0 Y + AR 2 * x 2 + AR 3 * x 3 , Sign() as the sign function of a function parameter, Sqrt() as the square root of a function parameter, x for a point along the width of the lens, y for a point along the height of the lens, z for a point along the thickness and thus along the optical axis of the lens, starting from the xy-center plane of the lens, and R0Y as the radius of curvature of the lens, - the second main page has a surface defined by a function of the form z = − d + PC 2 * x 2 + PC 3 * x 3 , with d as the thickness of the lens at the optical center, - where the parameters PB2 and PB3 are non-zero and - at least two of the parameters AR2, AR3, PB4, PB6, PC2 and PC3 are non-zero.

19. LIDAR device according to claim 18, characterized by the fact that - the parameters AR2 and AR3 are different from zero and - at least two of the parameters PB4, PB6, PC2 and PC3 are different from zero.

20. LIDAR device according to claim 19, characterized by the fact that- the parameters PB4 and PB6 are different from zero and - at least one of the parameters PC2 and PC3 is different from zero.

21. LIDAR device according to claim 20, characterized by the fact that Both parameters PC2 and PC3 are different from zero.

22. Use of one or more light modules, wherein the light module or each light module is provided with: - a carrier (TR) having a top surface (TRO) in which a circuit die with integrated circuits is arranged, - wherein the circuit die has a top surface, - a transistor (T) formed in the top surface of the circuit die dis ), in particular a power transistor, - wherein the transistor (T dis) a conducting or blocking switchable conduction path (LPF) with a first end region (LPF1) and a second end region (LPF2), the first end region (LPF1) being electrically connected to a first conduction path terminal field (TAF1) and the second end region (LPF2) being electrically connected to a second conduction path terminal field (TAF2), both of which are exposed on the top surface (TRO) of the carrier (TR), and wherein the transistor (T dis ) a control connection (GT dis ) for conducting and blocking the conduction path (LPF), - a light-emitting diode die (D1D) comprising a light-emitting diode, in particular a light-emitting diode die comprising a laser diode, with a bottom surface comprising a first terminal field (DAF1) and a top surface comprising a second terminal field (DAF2), - wherein the light-emitting diode die (D1D) is connected with its first terminal field (DAF1) to the first conduction path terminal field (TAF1) of the transistor (T dis) is arranged horizontally and these two terminal fields are electrically connected to each other, - a charge storage component (LSBT) comprising a charge storage element (C1 to Cn), which has a bottom surface having a first terminal field (LAF1) and a top surface having a second terminal field (LAF2), - wherein the charge storage component (LSBT) is connected with its first terminal field (LAF1) to the second conduction path terminal field (TAF2) of the transistor (T dis) is arranged horizontally and these two terminal fields are electrically connected to each other, - at least one first bond wire (BD1) that electrically connects the second terminal field (DAF1) of the LED die (D1D) to the second terminal field (LAF2) of the charge storage component (LSBT), - a charging circuit (B1 to Bn) integrated in the circuit die and having one output for charging the charge storage component (LSBT) with electrical charge, and - a control circuit (CTR) integrated in the circuit die for controlling the transistor (T dis) and the charging circuit (B1 to Bn), - wherein the charging circuit (B1 to Bn) is associated with a charge terminal field (AF) exposed on the top side (TRO) of the carrier (TR), to which the output of the charging circuit (B1 to Bn) is electrically connected, - wherein the charge terminal field (AF) of the charging circuit (B1 to Bn) is electrically connected to the second terminal field (LAF2) of the charge storage component (LSBT) via at least one second bond wire (BD2), and - wherein the control circuit (CTR) controls the charging circuit (B1 to Bn) to charge the charge storage component (LSBT) up to a charge level required for generating a light pulse through the LED die (D1D) and thereafter the transistor (T dis ) to control the switching of its line path (LPF).

23. Use of the LIDAR device according to any one of claims 1 to 21 for: - the detection of objects in the vicinity of or in a part of the vicinity of a stationary or mobile platform, in particular an autonomously moving platform, such as a robot or a stationary or moving, in particular autonomously moving, vehicle, such as a watercraft, land vehicle or aircraft, in particular for the transport of persons or goods, or - the detection of objects in the automation of manufacturing processes, or - the non-invasive imaging of living organisms and / or biological organs of a living being, or - the examination of biological tissue, or - the creation of three-dimensional distance images of objects in a detection space, and / or - the monitoring of the surroundings of buildings.